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1. 发明授权

US07030039B2 Method of uniformly coating a substrate 有权
公开(公告)号：US07030039B2
公开(公告)日：2006-04-18
申请号：US09895787
申请日：2001-06-30
申请人： Emir Gurer , Tom Zhong , John Lewellen , Edward C. Lee , Robert P. Mandal , James C. Grambow , Ted C. Bettes , Donald R. Sauer , Edmond R. Ward , Jung-Hoon Chun , Sangjun Han
发明人： Emir Gurer , Tom Zhong , John Lewellen , Edward C. Lee , Robert P. Mandal , James C. Grambow , Ted C. Bettes , Donald R. Sauer , Edmond R. Ward , Jung-Hoon Chun , Sangjun Han
IPC分类号： H01L21/312
CPC分类号： H01L21/6715 , B05C5/0208 , B05C5/0245 , B05C5/0254 , B05D1/005 , B05D1/265 , B05D3/0486 , G03F7/162
摘要： A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

2. 发明授权

US06191053B1 High efficiency photoresist coating 失效
标题翻译：高效光刻胶涂层
公开(公告)号：US06191053B1
公开(公告)日：2001-02-20
申请号：US09094443
申请日：1998-06-10
申请人： Jung-Hoon Chun , James Derksen , Sangjun Han
发明人： Jung-Hoon Chun , James Derksen , Sangjun Han
IPC分类号： H01L21312
CPC分类号： H01L21/6715 , B05C5/0245 , B05C11/08 , B05D1/002 , B05D1/005 , B05D1/265 , G03F7/16 , G03F7/162
摘要： An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.
摘要翻译：一种改进的用有机光致抗蚀剂聚合物涂覆半导体衬底的方法和装置，通过以覆盖晶片的整个顶表面的螺旋图案挤出光致抗蚀剂带。本发明提供了更均匀的光致抗蚀剂层，并且比使用昂贵的光致抗蚀剂溶液中的现有方法更有效。将晶片安装在卡盘上，水平排列并向上取向。挤出头定位成与晶片的外边缘相邻并且在晶片的顶表面上方，具有相对于晶片径向排列的挤压槽。晶片旋转，并且挤出头朝向晶片的中心径向移动，而光致抗蚀剂被挤出挤出槽。控制晶片的旋转速度和挤压头的径向速度，使得挤出头相对于旋转晶片的切向速度是恒定的。

3. 发明授权

US09205089B2 Layer processing for pharmaceuticals 有权
标题翻译：药物层加工
公开(公告)号：US09205089B2
公开(公告)日：2015-12-08
申请号：US13458222
申请日：2012-04-27
申请人： Bernhardt Levy Trout , Trevor Alan Hatton , Emily Chang , James M B Evans , Salvatore Mascia , Won Kim , Ryan Richard Slaughter , Yi Du , Himanshu Hemant Dhamankar , Keith M. Forward , Gregory C. Rutledge , Mao Wang , Allan Stuart Myerson , Blair Kathryn Brettmann , Nikhil Padhye , Jung-Hoon Chun
发明人： Bernhardt Levy Trout , Trevor Alan Hatton , Emily Chang , James M B Evans , Salvatore Mascia , Won Kim , Ryan Richard Slaughter , Yi Du , Himanshu Hemant Dhamankar , Keith M. Forward , Gregory C. Rutledge , Mao Wang , Allan Stuart Myerson , Blair Kathryn Brettmann , Nikhil Padhye , Jung-Hoon Chun
IPC分类号： A61K9/70 , A61K31/55 , A61K9/20 , A61K9/24 , A61K31/165 , A61K31/426 , A61J3/00 , A61J3/06 , A61J3/10
CPC分类号： A61K31/55 , A61J3/00 , A61J3/06 , A61J3/10 , A61K9/2027 , A61K9/209 , A61K9/7007 , A61K31/165 , A61K31/426 , Y10T156/1051
摘要： Layer processing for pharmaceuticals, and related systems, methods, and articles are generally described. In some embodiments, ingestible pharmaceutical products (e.g., tablets) can be formed by processing one or more layers containing a pharmaceutically active composition. For example, at least one layer containing a pharmaceutically active composition can be manipulated (e.g., folded, rolled, stacked, etc.) such that the average thickness of the product formed by the manipulation is at least about two times the average thickness of the portions of the layer(s) used to form the product. In some embodiments, after the layer is manipulated, it can be processed (e.g., cut, coated, etc.) to form a final product such as, for example, a tablet.
摘要翻译：通常描述药物的层加工以及相关系统，方法和制品。在一些实施方案中，可以通过加工含有药物活性组合物的一层或多层来形成可摄取的药物产品（例如片剂）。例如，可以操作含有药物活性组合物的至少一层（例如，折叠，卷绕，堆叠等），使得通过操作形成的产品的平均厚度至少为平均厚度的两倍用于形成产品的层的部分。在一些实施方案中，在操作该层之后，可以处理（例如，切割，涂覆等）以形成最终产品，例如片剂。

4. 发明申请

US20120305174A1 LAYER PROCESSING FOR PHARMACEUTICALS 有权
标题翻译：药物的层加工
公开(公告)号：US20120305174A1
公开(公告)日：2012-12-06
申请号：US13458222
申请日：2012-04-27
申请人： Bernhardt Levy Trout , Trevor Alan Hatton , Emily Chang , James MB Evans , Salvatore Mascia , Won Kim , Ryan Richard Slaughter , Yi Du , Himanshu Hemant Dhamankar , Keith M. Forward , Gregory C. Rutledge , Mao Wang , Allan Stuart Myerson , Blair Kathryn Brettmann , Nikhil Padhye , Jung-Hoon Chun
发明人： Bernhardt Levy Trout , Trevor Alan Hatton , Emily Chang , James MB Evans , Salvatore Mascia , Won Kim , Ryan Richard Slaughter , Yi Du , Himanshu Hemant Dhamankar , Keith M. Forward , Gregory C. Rutledge , Mao Wang , Allan Stuart Myerson , Blair Kathryn Brettmann , Nikhil Padhye , Jung-Hoon Chun
IPC分类号： A61K9/70 , B29C59/16 , B29C39/00
CPC分类号： A61K31/55 , A61J3/00 , A61J3/06 , A61J3/10 , A61K9/2027 , A61K9/209 , A61K9/7007 , A61K31/165 , A61K31/426 , Y10T156/1051
摘要： Layer processing for pharmaceuticals, and related systems, methods, and articles are generally described. In some embodiments, ingestible pharmaceutical products (e.g., tablets) can be formed by processing one or more layers containing a pharmaceutically active composition. For example, at least one layer containing a pharmaceutically active composition can be manipulated (e.g., folded, rolled, stacked, etc.) such that the average thickness of the product formed by the manipulation is at least about two times the average thickness of the portions of the layer(s) used to form the product. In some embodiments, after the layer is manipulated, it can be processed (e.g., cut, coated, etc.) to form a final product such as, for example, a tablet.
摘要翻译：通常描述药物的层加工以及相关系统，方法和制品。在一些实施方案中，可以通过加工含有药物活性组合物的一层或多层来形成可摄取的药物产品（例如片剂）。例如，可以操作含有药物活性组合物的至少一层（例如，折叠，卷绕，堆叠等），使得通过操作形成的产品的平均厚度至少为平均厚度的两倍用于形成产品的层的部分。在一些实施方案中，在操作该层之后，可以处理（例如，切割，涂覆等）以形成最终产品，例如片剂。

5. 发明授权

US08222714B2 Semiconductor package with embedded spiral inductor 有权
标题翻译：半导体封装带嵌入式螺旋电感
公开(公告)号：US08222714B2
公开(公告)日：2012-07-17
申请号：US12523587
申请日：2008-02-04
申请人： Hao Shi , Jung-Hoon Chun , Xingchao Yuan
发明人： Hao Shi , Jung-Hoon Chun , Xingchao Yuan
IPC分类号： H01L27/08
CPC分类号： H01L23/49838 , H01L23/49822 , H01L23/50 , H01L23/645 , H01L24/05 , H01L2224/0401 , H01L2224/05552 , H01L2224/05553 , H01L2224/05555 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K1/112 , H05K1/165 , H05K3/4602 , H05K2201/09627 , H05K2201/10674 , H01L2924/00
摘要： In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.
摘要翻译：在一些实施例中，半导体封装包括具有多个层的衬底，从第一层到最终层，耦合到第一层的管芯，耦合到最终层的焊球等电连接器以及布置在其上的螺旋迹线并且电连接在管芯和电连接器之间。选择螺旋迹线的电感，使得封装具有预定的阻抗。相应地选择材料，横截面积，绕组的数量和密度以及螺旋迹线的总长度。在其他实施例中，半导体封装包括具有多层的衬底; 耦合到第一层的管芯; 耦合到最终层的电连接器; 以及衬底中或衬底上的螺旋迹线。螺旋迹线靠近模具，并且电连接在管芯和电连接器之间。

6. 发明授权

US4890662A Mixing and cooling techniques 失效
标题翻译：混合和冷却技术
公开(公告)号：US4890662A
公开(公告)日：1990-01-02
申请号：US219317
申请日：1988-07-15
申请人： Luis E. Sanchez-Caldera , Arthur K. Lee , Nam P. Suh , Jung-Hoon Chun
发明人： Luis E. Sanchez-Caldera , Arthur K. Lee , Nam P. Suh , Jung-Hoon Chun
IPC分类号： B01F5/00 , B22D1/00 , B22D11/00 , B22D11/06 , B22D35/04 , B22F9/02 , B22F9/08 , B32B15/04 , C22C1/10
CPC分类号： B22D17/007 , B22D11/064 , B22D35/04 , B22F9/082
摘要： A method and system for forming a composite mixture of at least two materials, at least one of which is a metal or metal alloy. The materials in a molten state are supplied via inlet channels to a mixing region so as to indirectly impinge on each other and then to flow through an outlet channel to a cooling system, such as a casting or mold device or a device for providing rapid solidification thereof. The ratio of the cross-sectional area of the outlet channel to the sum of the cross-sectional areas of the inlet channels is arranged to be less than 32 and the ratio of the distance from the input side of the outlet channel to the input of the cooling system to the diameter of the outlet channel is arranged to be greater than 5.

7. 发明授权

US08758091B2 Chemical-mechanical polishing pad conditioning system 有权
标题翻译：化学机械抛光垫调节系统
公开(公告)号：US08758091B2
公开(公告)日：2014-06-24
申请号：US12754645
申请日：2010-04-06
申请人： Nannaji Saka , Thor Eusner , Jung-Hoon Chun
发明人： Nannaji Saka , Thor Eusner , Jung-Hoon Chun
IPC分类号： B24B1/00 , B24B21/18
CPC分类号： B24B53/017
摘要： Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable platen supported for translation as well as rotation. Means are provided for pushing the polishing pad and bulk material into contact at an interface during rotation and translation and means are provided for passing a slurry through the holes in the bulk material to the interface whereby the radius of curvature of the pad asperities is increased. Water may be delivered to the bulk material for cooling. A process for conditioning a polishing pad is also disclosed.
摘要翻译：抛光垫调节系统。该系统包括支撑包含具有曲率半径的凹凸的抛光垫的第一可旋转压板。第二可旋转压板支撑具有穿过其中的孔的散装材料盘，第二可旋转压板被支撑成平移和旋转。提供了用于在旋转和平移期间将抛光垫和散装材料在界面处推动接触的装置，并且提供了用于使浆料通过块状材料中的孔通过到界面的装置，由此增加焊盘粗糙度的曲率半径。水可以输送到散装材料进行冷却。还公开了一种用于调理抛光垫的工艺。

8. 发明申请

US20120267756A1 Semiconductor Package with Embedded Spiral Inductor 有权
标题翻译：嵌入式螺旋电感的半导体封装
公开(公告)号：US20120267756A1
公开(公告)日：2012-10-25
申请号：US13542444
申请日：2012-07-05
申请人： Hao Shi , Jung-Hoon Chun , Xingchao Yuan
发明人： Hao Shi , Jung-Hoon Chun , Xingchao Yuan
IPC分类号： H01L23/488 , G06F17/50
CPC分类号： H01L23/49838 , H01L23/49822 , H01L23/50 , H01L23/645 , H01L24/05 , H01L2224/0401 , H01L2224/05552 , H01L2224/05553 , H01L2224/05555 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K1/112 , H05K1/165 , H05K3/4602 , H05K2201/09627 , H05K2201/10674 , H01L2924/00
摘要： In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.
摘要翻译：在一些实施例中，半导体封装包括具有多个层的衬底，从第一层到最终层，耦合到第一层的管芯，耦合到最终层的焊球等电连接器以及布置在其上的螺旋迹线并且电连接在管芯和电连接器之间。选择螺旋迹线的电感，使得封装具有预定的阻抗。相应地选择材料，横截面积，绕组的数量和密度以及螺旋迹线的总长度。在其他实施例中，半导体封装包括具有多层的衬底; 耦合到第一层的管芯; 耦合到最终层的电连接器; 以及衬底中或衬底上的螺旋迹线。螺旋迹线靠近模具，并且电连接在管芯和电连接器之间。

9. 发明申请

US20100281289A1 Bidirectional Memory Interface with Glitch Tolerant Bit Slice Circuits 审中-公开
标题翻译：具有毛刺允许位片电路的双向存储器接口
公开(公告)号：US20100281289A1
公开(公告)日：2010-11-04
申请号：US12743075
申请日：2008-11-14
申请人： Kun-Yung Chang , Jie Shen , Hae-Chang Lee , Fariborz Assaderaghi , Richard E. Perego , Jung-Hoon Chun
发明人： Kun-Yung Chang , Jie Shen , Hae-Chang Lee , Fariborz Assaderaghi , Richard E. Perego , Jung-Hoon Chun
IPC分类号： G06F1/12 , G06F1/04 , H03L7/06 , H03H7/01 , G06G7/12
CPC分类号： G06F13/1689
摘要： A bit slice circuit having transmit and receive modes of operation is described. The bit slice circuit comprises: first transmit circuitry and first receive circuitry operating in a first clock domain, wherein the first circuitry receives a first clock signal; second transmit circuitry and second receive circuitry operating in a second clock domain, wherein the second circuitry receives a second clock signal; transmit transition circuitry and receive transition circuitry, the transmit transition circuitry coupling the first transmit circuitry to the second transmit circuitry, the receive transition circuitry coupling the first receive circuitry to the second receive circuitry, wherein the transition circuitry receives the first and second clock signals; and a single phase mixer that generates the second clock signal, wherein the second clock signal has a first phase in the transmit mode of operation and second phase in the receive mode of operation.
摘要翻译：描述了具有发送和接收操作模式的位分片电路。所述位片电路包括：第一发射电路和在第一时钟域中操作的第一接收电路，其中所述第一电路接收第一时钟信号; 第二发送电路和在第二时钟域中操作的第二接收电路，其中所述第二电路接收第二时钟信号; 发射转换电路和接收转换电路，所述发射转换电路将所述第一发射电路耦合到所述第二发射电路，所述接收转换电路将所述第一接收电路耦合到所述第二接收电路，其中所述转换电路接收所述第一和第二时钟信号; 以及产生所述第二时钟信号的单相混频器，其中所述第二时钟信号具有所述发送操作模式中的第一相位和所述接收操作模式中的第二相位。

10. 发明授权

US5673746A Solid/liquid interface detection in casting processes by gamma-ray attenuation 失效
标题翻译：通过γ射线衰减在铸造过程中进行固/液界面检测
公开(公告)号：US5673746A
公开(公告)日：1997-10-07
申请号：US625384
申请日：1996-04-01
申请人： Jung-Hoon Chun , Richard C. Lanza , Nannaji Saka
发明人： Jung-Hoon Chun , Richard C. Lanza , Nannaji Saka
IPC分类号： B22D11/20 , B22D11/16 , B22D11/22
CPC分类号： B22D11/207
摘要： A liquid metal/solid metal interface detecting device comprises in general a radiation source for generating gamma radiation, which is directed to pass through a strand extruded from a continuous casting mold. A detector detects the gamma radiation passing through the partially solidified strand to determine a spatial profile for a liquid metal/solid metal interface by relying on the different gamma radiation attenuation characteristics of the solid metal and the liquid metal. Preferably, the gamma radiation is at energies of greater than one million electron volts. In some embodiments, a movable support carries the radiation source and the detector and moves the radiation source and detector along and around the ingot enabling generation of a three-dimensional profile of the liquid metal/solid metal interface by utilizing tomographic imaging techniques. Alternatively, solidification at a single region is determined and this information is used to control the formation of the strand in process controller implementations. Surface temperature detectors can also be used to provide more information about the solidification.
摘要翻译：液体金属/固体金属界面检测装置通常包括用于产生γ辐射的辐射源，其被引导通过从连续铸模中挤出的股线。检测器通过依靠固体金属和液态金属的不同γ辐射衰减特性来检测通过部分凝固的股线的伽马辐射，以确定液态金属/固体金属界面的空间分布。优选地，伽马辐射的能量大于一百万电子伏特。在一些实施例中，可移动支撑件承载辐射源和检测器并且沿着晶锭移动辐射源和检测器，使得能够通过利用断层成像技术产生液态金属/固体金属界面的三维轮廓。或者，确定单个区域的固化，并且该信息用于控制过程控制器实施中的链的形成。表面温度检测器也可用于提供有关固化的更多信息。

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