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1. 发明申请

US20110244764A1 CHEMICAL-MECHANICAL POLISHING PAD CONDITIONING SYSTEM 有权
标题翻译：化学机械抛光垫调节系统
公开(公告)号：US20110244764A1
公开(公告)日：2011-10-06
申请号：US12754645
申请日：2010-04-06
申请人： Nannaji Saka , Thor Eusner , Jung-Hoon Chun
发明人： Nannaji Saka , Thor Eusner , Jung-Hoon Chun
IPC分类号： B24B1/00 , B24B21/18
CPC分类号： B24B53/017
摘要： Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable platen supported for translation as well as rotation. Means are provided for pushing the polishing pad and bulk material into contact at an interface during rotation and translation and means are provided for passing a slurry through the holes in the bulk material to the interface whereby the radius of curvature of the pad asperities is increased. Water may be delivered to the bulk material for cooling. A process for conditioning a polishing pad is also disclosed.
摘要翻译：抛光垫调节系统。该系统包括支撑包含具有曲率半径的凹凸的抛光垫的第一可旋转压板。第二可旋转压板支撑具有穿过其中的孔的散装材料盘，第二可旋转压板被支撑成平移和旋转。提供了用于在旋转和平移期间将抛光垫和散装材料在界面处推动接触的装置，并且提供了用于使浆料通过块状材料中的孔通过到界面的装置，由此增加焊盘粗糙度的曲率半径。水可以输送到散装材料进行冷却。还公开了一种用于调理抛光垫的工艺。

2. 发明授权

US08758091B2 Chemical-mechanical polishing pad conditioning system 有权
标题翻译：化学机械抛光垫调节系统
公开(公告)号：US08758091B2
公开(公告)日：2014-06-24
申请号：US12754645
申请日：2010-04-06
申请人： Nannaji Saka , Thor Eusner , Jung-Hoon Chun
发明人： Nannaji Saka , Thor Eusner , Jung-Hoon Chun
IPC分类号： B24B1/00 , B24B21/18
CPC分类号： B24B53/017
摘要： Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable platen supported for translation as well as rotation. Means are provided for pushing the polishing pad and bulk material into contact at an interface during rotation and translation and means are provided for passing a slurry through the holes in the bulk material to the interface whereby the radius of curvature of the pad asperities is increased. Water may be delivered to the bulk material for cooling. A process for conditioning a polishing pad is also disclosed.
摘要翻译：抛光垫调节系统。该系统包括支撑包含具有曲率半径的凹凸的抛光垫的第一可旋转压板。第二可旋转压板支撑具有穿过其中的孔的散装材料盘，第二可旋转压板被支撑成平移和旋转。提供了用于在旋转和平移期间将抛光垫和散装材料在界面处推动接触的装置，并且提供了用于使浆料通过块状材料中的孔通过到界面的装置，由此增加焊盘粗糙度的曲率半径。水可以输送到散装材料进行冷却。还公开了一种用于调理抛光垫的工艺。

3. 发明授权

US5509460A Solid/liquid interface detection in continuous casting processes by .gamma. - 失效
标题翻译：通过γ射线衰减在连续铸造工艺中进行固/液界面检测
公开(公告)号：US5509460A
公开(公告)日：1996-04-23
申请号：US296342
申请日：1994-08-25
申请人： Jung-Hoon Chun , Richard C. Lanza , Nannaji Saka
发明人： Jung-Hoon Chun , Richard C. Lanza , Nannaji Saka
IPC分类号： B22D11/20 , B22D11/22 , B22D11/16
CPC分类号： B22D11/207
摘要： A liquid metal/solid metal interface detecting device comprises in general a radiation source for generating gamma radiation, which is directed to pass through a strand extruded from a continuous casting mold. A detector detects the gamma radiation passing through the partially solidified strand to determine a spatial profile for a liquid metal/solid metal interface by relying on the different gamma radiation attenuation characteristics of the solid metal and the liquid metal. Preferably, the gamma radiation is at energies of greater than one million electron volts. In some embodiments, a movable support carries the radiation source and the detector and moves the radiation source and detector along and around the ingot enabling generation of a three-dimensional profile of the liquid metal/solid metal interface by utilizing tomographic imaging techniques. Alternatively, solidification at a single region is determined and this information is used to control the formation of the strand in process controller implementations.
摘要翻译：液体金属/固体金属界面检测装置通常包括用于产生γ辐射的辐射源，其被引导通过从连续铸模中挤出的股线。检测器通过依靠固体金属和液态金属的不同γ辐射衰减特性来检测通过部分凝固的股线的伽马辐射，以确定液态金属/固体金属界面的空间分布。优选地，伽马辐射的能量大于一百万电子伏特。在一些实施例中，可移动支撑件承载辐射源和检测器并且沿着晶锭移动辐射源和检测器，使得能够通过利用断层成像技术产生液态金属/固体金属界面的三维轮廓。或者，确定单个区域的固化，并且该信息用于控制过程控制器实施中的链的形成。

4. 发明授权

US5673746A Solid/liquid interface detection in casting processes by gamma-ray attenuation 失效
标题翻译：通过γ射线衰减在铸造过程中进行固/液界面检测
公开(公告)号：US5673746A
公开(公告)日：1997-10-07
申请号：US625384
申请日：1996-04-01
申请人： Jung-Hoon Chun , Richard C. Lanza , Nannaji Saka
发明人： Jung-Hoon Chun , Richard C. Lanza , Nannaji Saka
IPC分类号： B22D11/20 , B22D11/16 , B22D11/22
CPC分类号： B22D11/207
摘要： A liquid metal/solid metal interface detecting device comprises in general a radiation source for generating gamma radiation, which is directed to pass through a strand extruded from a continuous casting mold. A detector detects the gamma radiation passing through the partially solidified strand to determine a spatial profile for a liquid metal/solid metal interface by relying on the different gamma radiation attenuation characteristics of the solid metal and the liquid metal. Preferably, the gamma radiation is at energies of greater than one million electron volts. In some embodiments, a movable support carries the radiation source and the detector and moves the radiation source and detector along and around the ingot enabling generation of a three-dimensional profile of the liquid metal/solid metal interface by utilizing tomographic imaging techniques. Alternatively, solidification at a single region is determined and this information is used to control the formation of the strand in process controller implementations. Surface temperature detectors can also be used to provide more information about the solidification.
摘要翻译：液体金属/固体金属界面检测装置通常包括用于产生γ辐射的辐射源，其被引导通过从连续铸模中挤出的股线。检测器通过依靠固体金属和液态金属的不同γ辐射衰减特性来检测通过部分凝固的股线的伽马辐射，以确定液态金属/固体金属界面的空间分布。优选地，伽马辐射的能量大于一百万电子伏特。在一些实施例中，可移动支撑件承载辐射源和检测器并且沿着晶锭移动辐射源和检测器，使得能够通过利用断层成像技术产生液态金属/固体金属界面的三维轮廓。或者，确定单个区域的固化，并且该信息用于控制过程控制器实施中的链的形成。表面温度检测器也可用于提供有关固化的更多信息。

5. 发明授权

US06197178B1 Method for forming ceramic coatings by micro-arc oxidation of reactive metals 有权
标题翻译：通过微弧氧化反应性金属形成陶瓷涂层的方法
公开(公告)号：US06197178B1
公开(公告)日：2001-03-06
申请号：US09285604
申请日：1999-04-02
申请人： Jerry L. Patel , Nannaji Saka
发明人： Jerry L. Patel , Nannaji Saka
IPC分类号： C25D1102
CPC分类号： C25D11/04 , C25D11/026
摘要： A process and apparatus for forming oxide coatings on bodies of aluminum and aluminum alloys are described. The process includes forming an electrolyte bath in an inert container. At least two reactive metal bodies are suspended in the bath. The bodies are connected to electrodes which, in turn, are connected to a multiphase AC circuit. A multiphase power (preferably three-phase between three bodies) potential is imposed between each of the bodies. The bodies are moved in the electrolyte bath relative to each other until micro-arcs occur on the surfaces of the bodies, whereby to commence oxidation of the bodies. The imposition of the potential between each of the bodies is continued until the desired thickness of oxide is formed on the bodies.
摘要翻译：描述了一种在铝和铝合金体上形成氧化物涂层的方法和装置。该方法包括在惰性容器中形成电解质浴。至少两个反应性金属体悬浮在浴中。主体连接到电极，电极又连接到多相交流电路。在每个物体之间施加多相功率（优选三体之间的三相）电位。主体相对于彼此在电解质浴中移动，直到微弧出现在主体的表面上，从而开始氧化身体。在每个物体之间施加电位继续进行，直到在物体上形成期望的氧化物厚度。

6. 发明授权

US06476921B1 In-situ method and apparatus for end point detection in chemical mechanical polishing 失效
标题翻译：化学机械抛光中终点检测的原位法和装置
公开(公告)号：US06476921B1
公开(公告)日：2002-11-05
申请号：US09628471
申请日：2000-07-31
申请人： Nannaji Saka , Jamie Nam , Hilario L. Oh
发明人： Nannaji Saka , Jamie Nam , Hilario L. Oh
IPC分类号： G01B1114
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12
摘要： A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.
摘要翻译：提供了一种用于在化学机械抛光（CMP）期间提供在半导体晶片或衬底上的局部区域中去除材料的原位监测的方法和装置。特别地，本发明的方法和装置提供了检测在晶片表面的某些局部区域或区域内的不同材料之间的反射率的差异。反射率的差异用于指示每个特定局部区域中物质去除的速率或进展。

7. 发明授权

US06798529B2 In-situ method and apparatus for end point detection in chemical mechanical polishing 失效
标题翻译：化学机械抛光中终点检测的原位法和装置
公开(公告)号：US06798529B2
公开(公告)日：2004-09-28
申请号：US10029080
申请日：2001-12-21
申请人： Nannaji Saka , Jamie Nam , Hilario L. Oh
发明人： Nannaji Saka , Jamie Nam , Hilario L. Oh
IPC分类号： G01B1114
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12
摘要： A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.
摘要翻译：提供了一种用于在化学机械抛光（CMP）期间提供在半导体晶片或衬底上的局部区域中去除材料的原位监测的方法和装置。特别地，本发明的方法和装置提供了检测在晶片表面的某些局部区域或区域内的不同材料之间的反射率的差异。反射率的差异用于指示每个特定局部区域中物质去除的速率或进展。

8. 发明授权

US06458013B1 Method of chemical mechanical polishing 失效
标题翻译：化学机械抛光方法
公开(公告)号：US06458013B1
公开(公告)日：2002-10-01
申请号：US09628962
申请日：2000-07-31
申请人： Nannaji Saka , Jiun-Yu Lai , Hilario L. Oh
发明人： Nannaji Saka , Jiun-Yu Lai , Hilario L. Oh
IPC分类号： B24B4914
CPC分类号： B24B37/013 , B24B37/042 , B24B49/16
摘要： In the Chemical Mechanical Polishing (CMP) process employed for microelectronics manufacturing, three contact regimes between the wafer surface and the polishing pad may be proposed: direct contact, mixed or partial contact, and hydroplaning. However, an effective in situ method for characterizing the wafer/pad contact and a systematic way of relating contact conditions to the process parameters are still lacking. In this work, the interfacial friction force, measured by a load sensor on the wafer carrier, has been employed to characterize the contact conditions. Models that relate the friction coefficient to the applied pressure, relative velocity, and slurry viscosity are developed and verified by experiments. Additionally, a correlation between friction coefficient and the material removal rate (MR) is established and the effects of process parameters on the Preston constant are investigated.
摘要翻译：在用于微电子制造的化学机械抛光（CMP）工艺中，晶片表面和抛光垫之间的三种接触方式可以被提出：直接接触，混合或部分接触和滑水。然而，仍然缺乏用于表征晶片/焊盘触点的有效原位方法以及将接触条件与过程参数相关联的系统方式。在这项工作中，已经采用由晶片载体上的载荷传感器测量的界面摩擦力来表征接触条件。通过实验开发和验证了摩擦系数与施加的压力，相对速度和浆料粘度相关的模型。另外，建立了摩擦系数与材料去除率（MR）之间的相关性，并研究了工艺参数对Preston常数的影响。

9. 发明授权

US11639881B1 Integrated, continuous diagnosis, and fault detection of hydrodynamic bearings by capacitance sensing 有权
公开(公告)号：US11639881B1
公开(公告)日：2023-05-02
申请号：US17145900
申请日：2021-01-11
申请人： Carlos A. Rosero , Nannaji Saka
发明人： Carlos A. Rosero , Nannaji Saka
IPC分类号： G01M13/04
摘要： A hydrodynamic bearing fault prediction, detection, diagnosis, and response system for combustion ignition engines, machines and/or coupled components of a combustion ignition engine and/or machine; a plurality of transducers, each disposed proximally or about each of the engine/machine components or engine itself; with at least one transducer with capacitance sensing abilities, each of the transducers disposed to react to changes in the dielectric constant of a nanosuspension circulated about the monitored component.

10. 发明授权

US4687274A Electrical contacts 失效
标题翻译：电触点
公开(公告)号：US4687274A
公开(公告)日：1987-08-18
申请号：US609022
申请日：1984-05-10
申请人： Nam P. Suh , Nannaji Saka , Ming J. Liou
发明人： Nam P. Suh , Nannaji Saka , Ming J. Liou
IPC分类号： H01R11/01 , H05K1/11 , H05K3/32 , H05K3/40 , H01R11/02
CPC分类号： H01R11/01 , H05K3/325 , H05K1/117 , H05K3/4007
摘要： A pair of elements for providing slidable electrical contact therebetween wherein the contact surface of at least one of the elements comprises a plurality of contact portions and a plurality of depressed portions in between the contact portions so that wear particles which are generated between their contact surfaces as the elements are moved relative to each other are effectively swept from between the contact surfaces into the depressed portions where they are entrapped. Such operation tends to maintain a low electrical resistance between the elements over many cycles of use.
摘要翻译：一种用于在其间提供可滑动的电接触的元件，其中至少一个元件的接触表面包括多个接触部分和接触部分之间的多个凹陷部分，使得在其接触表面之间产生的磨损颗粒作为这些元件相对于彼此移动有效地从接触表面之间扫掠到它们被截留的凹陷部分中。这种操作往往在多个使用周期之间保持元件之间的低电阻。

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