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1. 发明申请

US20130006406A1 METHOD AND SYSTEM FOR EVALUATING A MACHINE TOOL OPERATING CHARACTERISTICS 失效
标题翻译：用于评估机床工作特性的方法和系统
公开(公告)号：US20130006406A1
公开(公告)日：2013-01-03
申请号：US13608032
申请日：2012-09-10
申请人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slomin , Hong Lin , Fateh Ali Tipu , Adam Daniel Ticknor , Timothy M. McCormack
发明人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slomin , Hong Lin , Fateh Ali Tipu , Adam Daniel Ticknor , Timothy M. McCormack
IPC分类号： G05B19/18
CPC分类号： G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要： A method, a system and a computer program product suitable for use in a manufacturing environment comprising a multiplicity of nominally identical independent tools. A computing device generates a multi dimensional array of process trace data derived from at least one of the independent tools, wherein, the array includes data representing a first dimension comprising a list of steps in a manufacturing recipe and data representing a second dimension comprising a list of a set of sensors generating measurements from at least one of the independent tools. The computing device conducts an analysis on at least one preselected subset of the multi dimensional array for the purpose of evaluating at least one operating characteristic of at least one of the independent tools. The computing device presents results of the analysis via a set of hierarchically linked and browseable graphics.
摘要翻译：一种适用于制造环境的方法，系统和计算机程序产品，包括多个名义上相同的独立工具。计算设备生成从至少一个独立工具导出的过程跟踪数据的多维阵列，其中，所述阵列包括表示包括制造配方中的步骤列表的第一维度的数据和表示包括列表的第二维度的数据一组传感器从至少一个独立工具产生测量值。为了评估至少一个独立工具的至少一个操作特征，计算设备对多维阵列的至少一个预选子集进行分析。计算设备通过一组分层链接和可浏览的图形呈现分析结果。

2. 发明申请

US20100249976A1 METHOD AND SYSTEM FOR EVALUATING A MACHINE TOOL OPERATING CHARACTERISTICS 有权
标题翻译：用于评估机床工作特性的方法和系统
公开(公告)号：US20100249976A1
公开(公告)日：2010-09-30
申请号：US12415348
申请日：2009-03-31
申请人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh All Tipu , Adam Daniel Ticknor , Timothy M. McCormack
发明人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh All Tipu , Adam Daniel Ticknor , Timothy M. McCormack
IPC分类号： G06F17/00
CPC分类号： G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要： A method and system for evaluating a performance of a semiconductor manufacturing tool while manufacturing microelectronic devices are disclosed. At least one report is generated based on executions of at least one statistical test. The report includes at least one heat map having rows that correspond to sensors, columns that correspond to trace data obtained during recipe steps, and cells at the intersection of the rows and the columns. At least one sensor in the tool obtains trace data of a recipe step while manufacturing at least one microelectronic device. A computing device analyzes the obtained trace data to determine a level of operational significance found in the data and assigns a score to the trace data that indicates a level of operational significance. Then, the computing device places the score in a corresponding cell of the heat map. A user uses the cell for evaluating the tool performance.
摘要翻译：公开了一种用于在制造微电子器件的同时评估半导体制造工具的性能的方法和系统。至少根据执行至少一项统计测试生成一份报告。该报告包括至少一个具有与传感器对应的行的热图，对应于配方步骤期间获得的跟踪数据的列，以及行和列的交叉点处的单元格。工具中至少有一个传感器获得配方步骤的痕迹数据，同时制造至少一个微电子器件。计算设备分析所获得的跟踪数据以确定在数据中发现的操作意义的水平，并向指示操作意义水平的跟踪数据分配分数。然后，计算设备将分数放置在热图的相应单元中。用户使用单元格来评估刀具性能。

3. 发明授权

US08285414B2 Method and system for evaluating a machine tool operating characteristics 有权
标题翻译：用于评估机床操作特性的方法和系统
公开(公告)号：US08285414B2
公开(公告)日：2012-10-09
申请号：US12415348
申请日：2009-03-31
申请人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh A. Tipu , Adam D. Ticknor , Timothy M. McCormack
发明人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh A. Tipu , Adam D. Ticknor , Timothy M. McCormack
IPC分类号： G06F19/00
CPC分类号： G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要： A method and system for evaluating a performance of a semiconductor manufacturing tool while manufacturing microelectronic devices are disclosed. At least one report is generated based on executions of at least one statistical test. The report includes at least one heat map having rows that correspond to sensors, columns that correspond to trace data obtained during recipe steps, and cells at the intersection of the rows and the columns. At least one sensor in the tool obtains trace data of a recipe step while manufacturing at least one microelectronic device. A computing device analyzes the obtained trace data to determine a level of operational significance found in the data and assigns a score to the trace data that indicates a level of operational significance. Then, the computing device places the score in a corresponding cell of the heat map. A user uses the cell for evaluating the tool performance.
摘要翻译：公开了一种用于在制造微电子器件的同时评估半导体制造工具的性能的方法和系统。至少根据执行至少一项统计测试生成一份报告。该报告包括至少一个具有与传感器对应的行的热图，对应于配方步骤期间获得的跟踪数据的列，以及行和列的交叉点处的单元格。工具中至少有一个传感器获得配方步骤的痕迹数据，同时制造至少一个微电子器件。计算设备分析所获得的跟踪数据以确定在数据中发现的操作意义的水平，并向指示操作意义水平的跟踪数据分配分数。然后，计算设备将分数放置在热图的相应单元中。用户使用单元格来评估刀具性能。

4. 发明授权

US08594826B2 Method and system for evaluating a machine tool operating characteristics 失效
标题翻译：用于评估机床操作特性的方法和系统
公开(公告)号：US08594826B2
公开(公告)日：2013-11-26
申请号：US13608032
申请日：2012-09-10
申请人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh A. Tipu , Adam D. Ticknor , Timothy M. McCormack
发明人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh A. Tipu , Adam D. Ticknor , Timothy M. McCormack
IPC分类号： G06F19/00
CPC分类号： G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要： A method, a system and a computer program product suitable for use in a manufacturing environment comprising a multiplicity of nominally identical independent tools. A computing device generates a multi dimensional array of process trace data derived from at least one of the independent tools, wherein, the array includes data representing a first dimension comprising a list of steps in a manufacturing recipe and data representing a second dimension comprising a list of a set of sensors generating measurements from at least one of the independent tools. The computing device conducts an analysis on at least one preselected subset of the multi dimensional array for the purpose of evaluating at least one operating characteristic of at least one of the independent tools. The computing device presents results of the analysis via a set of hierarchically linked and browseable graphics.
摘要翻译：一种适用于制造环境的方法，系统和计算机程序产品，包括多个名义上相同的独立工具。计算设备生成从至少一个独立工具导出的过程跟踪数据的多维阵列，其中，所述阵列包括表示包括制造配方中的步骤列表的第一维度的数据和表示包括列表的第二维度的数据一组传感器从至少一个独立工具产生测量值。为了评估至少一个独立工具的至少一个操作特征，计算设备对多维阵列的至少一个预选子集进行分析。计算设备通过一组分层链接和可浏览的图形呈现分析结果。

5. 发明授权

US08858300B2 Applying different pressures through sub-pad to fixed abrasive CMP pad 有权
标题翻译：通过子垫将不同的压力施加到固定的磨料CMP垫上
公开(公告)号：US08858300B2
公开(公告)日：2014-10-14
申请号：US12702333
申请日：2010-02-09
申请人： Glenn L. Cellier , Laertis Economikos , Timothy M. McCormack , Rajasekhar Venigalla
发明人： Glenn L. Cellier , Laertis Economikos , Timothy M. McCormack , Rajasekhar Venigalla
IPC分类号： B24B5/00 , B24B37/00 , B24B37/16 , B24B37/24 , B24B37/22
CPC分类号： B24B37/16 , B24B37/22 , B24B37/245
摘要： A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.
摘要翻译：化学机械抛光（CMP）系统包括旋转抛光台，其包括提供具有不同压力的至少两个压力区的压板; 位于所述压板上的子垫，所述子垫包括允许通过其传递不同压力的多个开口; 定位在子垫上的固定磨料垫; 以及密封地联接到所述压板的压力产生系统，用于在所述至少两个压力区域中产生不同的压力，其中所述不同压力在所述固定磨料垫上产生形貌。还提供了一个子垫和相关方法。

6. 发明申请

US20110195640A1 APPLYING DIFFERENT PRESSURES THROUGH SUB-PAD TO FIXED ABRASIVE CMP PAD 有权
标题翻译：将不同的压力通过辅助垫片施加到固定的磨料CMP垫
公开(公告)号：US20110195640A1
公开(公告)日：2011-08-11
申请号：US12702333
申请日：2010-02-09
申请人： Glenn L. Cellier , Laertis Economikos , Timothy M. McCormack , Rajasekhar Venigalla
发明人： Glenn L. Cellier , Laertis Economikos , Timothy M. McCormack , Rajasekhar Venigalla
IPC分类号： B24B1/00 , B24B7/20 , B24B37/00
CPC分类号： B24B37/16 , B24B37/22 , B24B37/245
摘要： A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.
摘要翻译：化学机械抛光（CMP）系统包括旋转抛光台，其包括提供具有不同压力的至少两个压力区的压板; 位于所述压板上的子垫，所述子垫包括允许通过其传递不同压力的多个开口; 定位在子垫上的固定磨料垫; 以及密封地联接到所述压板的压力产生系统，用于在所述至少两个压力区域中产生不同的压力，其中所述不同压力在所述固定磨料垫上产生形貌。还提供了一个子垫和相关方法。

7. 发明授权

US07056192B2 Ceria-based polish processes, and ceria-based slurries 失效
标题翻译：二氧化铈抛光工艺和二氧化铈基浆料
公开(公告)号：US07056192B2
公开(公告)日：2006-06-06
申请号：US10711369
申请日：2004-09-14
申请人： Rajasekhar Venigalla , James W. Hannah , Timothy M. McCormack , Robert M. Merkling, Jr.
发明人： Rajasekhar Venigalla , James W. Hannah , Timothy M. McCormack , Robert M. Merkling, Jr.
IPC分类号： B24D3/00
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/31053
摘要： By adding silica to ceria-based CMP slurries the polish process starts much faster than without silica thereby eliminating dead time in the polish process and eliminating process instability caused by changes in the dead time with operating conditions. A slurry for performing chemical mechanical polishing (CMP) of patterned oxides (e.g., STI, PMD, ILD) on a substrate, comprises: ceria particles having a concentration of 1.0–5.0 wt % and silica particles having a concentration of 0.1–5.0 wt %. A ratio of ceria concentration to silica concentration (ceria:silica) is from approximately 10:1 to nearly 1:1 by weight. The ceria particles have a particle size of 150–250 nm, and the silica particles have a particle size of greater than 100 nm. The silica may be fumed or colloidal. The slurry has a pH of approximately 9.0.
摘要翻译：通过向二氧化铈基CMP浆料中添加二氧化硅，抛光过程比无二氧化硅快得多，从而消除抛光过程中的死区，并消除由于操作条件下死区时间变化引起的过程不稳定性。用于在基材上进行图案化氧化物（例如STI，PMD，ILD）的化学机械抛光（CMP）的浆料包括：浓度为1.0-5.0重量％的二氧化铈颗粒和浓度为0.1-5.0重量％的二氧化硅颗粒％。二氧化铈浓度与二氧化硅浓度（二氧化铈：二氧化硅）的比率为约10:1至约1:1重量比。二氧化铈粒子的粒径为150〜250nm，二氧化硅粒子的粒径大于100nm。二氧化硅可以是热解或胶体的。浆液的pH值约为9.0。

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