专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5692950A Abrasive construction for semiconductor wafer modification 失效
标题翻译：用于半导体晶片修改的磨料结构
公开(公告)号：US5692950A
公开(公告)日：1997-12-02
申请号：US694357
申请日：1996-08-08
申请人： Denise R. Rutherford , Douglas P. Goetz , Cristina U. Thomas , Richard J. Webb , Wesley J. Bruxvoort , James D. Buhler , William J. Hollywood
发明人： Denise R. Rutherford , Douglas P. Goetz , Cristina U. Thomas , Richard J. Webb , Wesley J. Bruxvoort , James D. Buhler , William J. Hollywood
IPC分类号： B24D11/02 , B24B37/22 , B24B37/24 , B24D3/00 , B24D3/28 , B24D3/34 , B24D11/00 , B24D13/14 , B23F21/03
CPC分类号： B24B37/245 , B24B37/22 , B24D3/001 , B24D3/28
摘要： An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
摘要翻译：用于改变诸如半导体晶片的工件的表面的研磨结构。研磨结构包括：三维，有纹理，固定的研磨元件; 至少一个与所述固定研磨元件共同延伸的弹性元件; 以及至少一个与弹性元件和固定研磨元件共同延伸并插入其中的刚性元件，其中刚性元件的杨氏模量大于弹性元件的杨氏模量。

2. 发明授权

US6007407A Abrasive construction for semiconductor wafer modification 失效
标题翻译：用于半导体晶片修改的磨料结构
公开(公告)号：US6007407A
公开(公告)日：1999-12-28
申请号：US915058
申请日：1997-08-20
申请人： Denise R. Rutherford , Douglas P. Goetz , Cristina U. Thomas , Richard J. Webb , Wesley J. Bruxvoort , James D. Buhler , William J. Hollywood
发明人： Denise R. Rutherford , Douglas P. Goetz , Cristina U. Thomas , Richard J. Webb , Wesley J. Bruxvoort , James D. Buhler , William J. Hollywood
IPC分类号： B24D11/02 , B24B37/22 , B24B37/24 , B24D3/00 , B24D3/28 , B24D3/34 , B24D11/00 , B24D13/14 , B24B5/00
CPC分类号： B24B37/245 , B24B37/22 , B24D3/001 , B24D3/28
摘要： An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
摘要翻译：用于改变诸如半导体晶片的工件的表面的研磨结构。研磨结构包括：三维，有纹理，固定的研磨元件; 至少一个与所述固定研磨元件共同延伸的弹性元件; 以及至少一个与弹性元件和固定研磨元件共同延伸并插入其中的刚性元件，其中刚性元件的杨氏模量大于弹性元件的杨氏模量。

3. 发明授权

US5759918A Method for chemical mechanical polishing 失效
标题翻译：化学机械抛光方法
公开(公告)号：US5759918A
公开(公告)日：1998-06-02
申请号：US689741
申请日：1996-08-13
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B1/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
摘要翻译：公开了一种用于抛光半导体晶片的表面的方法和装置。晶片通过工具头保持在适当位置并且被研磨垫接触。提供了一个桌子，研磨垫固定在该工作台上，两者都沿平行于待抛光晶片的表面的方向移动。控制器根据预定的抛光图案控制工作台的运动，并且能够在晶片和研磨垫之间保持恒定的速度。工具头包括圆形压板和围绕压板的外边缘周向定向的保持环，其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。可调联接件安装到压板和环上，并且用于在抛光环相对于晶片表面的高度期间可调节地定位，并且在抛光保持环的位置期间刚性地支撑。柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。

4. 发明授权

US6110025A Containment ring for substrate carrier apparatus 失效
标题翻译：用于衬底载体装置的容纳环
公开(公告)号：US6110025A
公开(公告)日：2000-08-29
申请号：US853103
申请日：1997-05-07
申请人： Roger O. Williams , James D. Buhler
发明人： Roger O. Williams , James D. Buhler
IPC分类号： B24B37/32 , B24B49/16 , B24B5/00 , B24B29/00
CPC分类号： B24B37/32 , B24B49/16
摘要： This invention involves a containment ring that may be used in conjunction with a substrate carrier used for polishing a substrate to give the substrate a smooth and planar surface. The containment ring is generally constructed such that it tilts independently of the substrate carrier platen that supports the substrate during polishing. The containment ring is constructed with a surface that supports a small perimeter portion of the back side of the substrate during polishing and has an enclosed area sufficient to allow the substrate to precess.
摘要翻译：本发明涉及一种容纳环，其可以与用于抛光基底的基底载体结合使用，以给予基底平滑且平坦的表面。密封环通常构造成使得其在抛光期间独立于支撑衬底的衬底载体压板倾斜。容纳环被构造成具有在抛光期间支撑衬底的背侧的小周边部分的表面，并具有足以允许衬底进入的封闭区域。

5. 发明授权

US5938884A Apparatus for chemical mechanical polishing 失效
标题翻译：化学机械抛光装置
公开(公告)号：US5938884A
公开(公告)日：1999-08-17
申请号：US900750
申请日：1997-07-25
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard de Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B37/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.
摘要翻译：公开了一种用于抛光半导体晶片的表面的方法和装置。晶片通过工具头保持在适当位置并且被研磨垫接触。提供了一个桌子，研磨垫固定在该工作台上，两者都沿平行于待抛光晶片的表面的方向移动。控制器根据预定的抛光图案控制工作台的运动，并且能够在晶片和研磨垫之间保持恒定的速度。工具头包括圆形压板和围绕压板的外边缘周向定向的保持环，其抵抗由晶片的表面与抛光表面的接合引起的晶片上的横向力。可调联接件安装到压板和环上，并且用于在抛光环相对于晶片表面的高度期间可调节地定位，并且在抛光保持环的位置期间刚性地支撑。柔性盘固定地安装在支撑柱和压板之间并且基本上平行于压板的表面定向。柔性盘适于防止压板围绕支柱的轴线旋转并且在平行于压板的表面的方向上在压板和柱之间传递力。

6. 发明授权

US5908530A Apparatus for chemical mechanical polishing 失效
标题翻译：化学机械抛光装置
公开(公告)号：US5908530A
公开(公告)日：1999-06-01
申请号：US443956
申请日：1995-05-18
申请人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard De Geus , Lawrence L. Lee
发明人： Jon A. Hoshizaki , Roger O. Williams , James D. Buhler , Charles A. Reichel , William K. Hollywood , Richard De Geus , Lawrence L. Lee
IPC分类号： B24B7/24 , B24B37/04 , B24B37/10 , B24B37/30 , B24B37/32 , G05B19/18 , H01L21/304 , B24B37/00
CPC分类号： B24B37/105 , B24B37/042 , B24B37/30 , B24B37/32 , B24B7/241 , G05B19/182 , G05B2219/43142 , G05B2219/45058 , G05B2219/45232
摘要： An apparatus for polishing wafers, preferably by chemical mechanical polishing. The apparatus includes a table defining a planar polishing surface adapted to contain a polishing medium and a wafer carrier assembly adapted to hold a wafer against the polishing surface. The wafer carrier assembly includes a wafer carrier and prevents rotation of the wafer carrier with respect to the polishing table even when the wafer carrier is moved in a circular or orbital path on the polishing surface. Polishing is carried out relative movement between the wafer carrier and the polishing surface in any direction within the plane of the polishing surface. The relative movement can be accomplished by moving the wafer carrier, the polishing table, or a combination of movements of the wafer carrier and polishing table.
摘要翻译：优选通过化学机械抛光抛光晶片的装置。该装置包括限定适于容纳抛光介质的平面抛光表面和适于将晶片保持在抛光表面上的晶片载体组件的工作台。晶片载体组件包括晶片载体并且防止晶片载体相对于抛光台旋转，即使当晶片载体在抛光表面上以圆形或轨道路径移动时。抛光在抛光表面的平面内的任何方向上进行晶片载体和抛光表面之间的相对移动。可以通过移动晶片载体，抛光台或晶片载体和抛光台的运动的组合来实现相对运动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式