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1. 发明授权

US06749485B1 Hydrolytically stable grooved polishing pads for chemical mechanical planarization 有权
标题翻译：水解稳定的槽式抛光垫用于化学机械平面化
公开(公告)号：US06749485B1
公开(公告)日：2004-06-15
申请号：US09665841
申请日：2000-09-20
申请人： David B. James , Arun Vishwanathan , Lee Melbourne Cook , Peter A. Burke , David Shidner , Joseph K. So , John V. H. Roberts
发明人： David B. James , Arun Vishwanathan , Lee Melbourne Cook , Peter A. Burke , David Shidner , Joseph K. So , John V. H. Roberts
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B13/04 , B24B37/042 , B24D3/28 , Y10S451/921
摘要： An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness and hydrolytic stability.
摘要翻译：用于在半导体晶片上抛光金属镶嵌结构的改进的焊盘和工艺。该方法包括以下步骤：将聚合物片材的表面压在聚合物片材的表面上，并与含有亚微米级颗粒的含水基液体组合，并提供在压力下使晶片和抛光垫片相对运动的装置，接触导致平面去除所述晶片的表面，其中抛光垫在去除所述负载时具有低弹性恢复，使得片材的机械响应大大无弹性。改进的垫的特征在于具有高的能量耗散以及高的垫刚度和水解稳定性。

2. 发明授权

US06736709B1 Grooved polishing pads for chemical mechanical planarization 有权
标题翻译：用于化学机械平面化的凹槽抛光垫
公开(公告)号：US06736709B1
公开(公告)日：2004-05-18
申请号：US09631783
申请日：2000-08-03
申请人： David B. James , Arun Vishwanathan , Lee Melbourne Cook , Peter A. Burke , David Shidner , Joseph K. So , John V. H. Roberts
发明人： David B. James , Arun Vishwanathan , Lee Melbourne Cook , Peter A. Burke , David Shidner , Joseph K. So , John V. H. Roberts
IPC分类号： B24B500
CPC分类号： B24B37/26 , B24D3/28
摘要： An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing, pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad also exhibits a stable morphology that can be reproduced easily and consistently. The pad surface has macro-texture that includes perforations as well as surface groove designs The surface groove designs have specific relationships between groove depth and overall pad thickness and groove.area and land area. The pad of this invention resists glazing, thereby requiring less frequent and less aggressive conditioning. The benefits of such a polishing pad are low dishing of metal features, low oxide erosion, reduced pad conditioning, longer pad life, better slurry distribution and waste removal from the pad surface, high metal removal rates, good planarization, and lower defectivity (scratches and Light Point Defects).
摘要翻译：用于在半导体晶片上抛光金属镶嵌结构的改进的焊盘和工艺。该方法包括以下步骤：将聚合物片材的表面压在聚合物片材的表面上，与水性液体组合，任选地含有亚微米级的颗粒，并提供用于在压力下使晶片和抛光垫相对运动的装置，使得移动加压接触导致所述晶片的表面的平面去除，其中抛光垫在去除所述负载时具有低弹性恢复，使得片材的机械响应大大无弹性。改进的焊盘的特征在于具有高的能量耗散以及高焊盘刚度。该垫还具有稳定的形态，可以容易地和一致地再现。焊盘表面具有包括穿孔以及表面凹槽设计的宏观纹理。表面凹槽设计具有凹槽深度和总体垫厚度以及凹槽和凹槽面积之间的具体关系。本发明的垫子抵抗玻璃窗，从而需要较少的频繁和较不积极的调理。这种抛光垫的优点是金属特征的低凹陷，低氧化物侵蚀，减少的焊盘调节，更长的焊盘寿命，更好的浆料分布和从焊盘表面的废物移除，高金属去除速率，良好的平坦化和较低的缺陷（划痕和光点缺陷）。

3. 发明授权

US06488570B1 Method relating to a polishing system having a multi-phase polishing layer 有权
标题翻译：涉及具有多相抛光层的抛光系统的方法
公开(公告)号：US06488570B1
公开(公告)日：2002-12-03
申请号：US09665840
申请日：2000-09-20
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B41/047 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/30625
摘要： A method of making a polishing pad composition comprising a high modulus phase component and a low modulus phase component, and a method of polishing a semiconductor substrate by creating nanoasperities at a polishing interface between the polishing layer and the wafer during polishing by providing the high modulus phase component at the polishing interface, either as protrusions from the polishing layer, or by being released from the polishing layer into the polishing interface.
摘要翻译：一种制造包含高模量相成分和低模量相成分的抛光垫组合物的方法，以及通过在抛光过程中在抛光层和晶片之间的抛光界面处产生纳米级的抛光来提供半模量的方法抛光界面上的相分量，作为来自抛光层的突起，或通过从抛光层释放到抛光界面中。

4. 发明授权

US06739962B2 Polishing pads and methods relating thereto 有权
标题翻译：抛光垫及其相关方法
公开(公告)号：US06739962B2
公开(公告)日：2004-05-25
申请号：US10137056
申请日：2002-05-01
申请人： John V. H. Roberts , David B. James , Lee Melbourne Cook , Charles W. Jenkins
发明人： John V. H. Roberts , David B. James , Lee Melbourne Cook , Charles W. Jenkins
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B41/047 , B24D3/26 , B24D3/28
摘要： Polishing pads are provided having a polishing surface formed from a material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.
摘要翻译：提供具有由材料形成的抛光表面的抛光垫。抛光表面具有通过热成型工艺制成的形貌。地形由大和小的特征组成，有助于抛光液的流动，并促进平滑和平坦化。

5. 发明授权

US06287185B1 Polishing pads and methods relating thereto 有权
标题翻译：抛光垫及其相关方法
公开(公告)号：US06287185B1
公开(公告)日：2001-09-11
申请号：US09514717
申请日：2000-02-28
申请人： John V. H. Roberts , David B. James , Lee Melbourne Cook , Charles W. Jenkins
发明人： John V. H. Roberts , David B. James , Lee Melbourne Cook , Charles W. Jenkins
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B41/047 , B24D3/26 , B24D3/28
摘要： Polishing pads are provided having a polishing surface formed from a hydrophilic material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.
摘要翻译：抛光垫具有由亲水材料形成的抛光表面。抛光表面具有通过热成型工艺制成的形貌。地形由大和小的特征组成，有助于抛光液的流动，并促进平滑和平坦化。

6. 发明授权

US06231434B1 Polishing pads and methods relating thereto 有权
标题翻译：抛光垫及其相关方法
公开(公告)号：US06231434B1
公开(公告)日：2001-05-15
申请号：US09571920
申请日：2000-05-16
申请人： Lee Melbourne Cook , David B. James , Charles William Jenkins , Heinz F. Reinhardt , John V. H. Roberts , Raj Raghav Pillai
发明人： Lee Melbourne Cook , David B. James , Charles William Jenkins , Heinz F. Reinhardt , John V. H. Roberts , Raj Raghav Pillai
IPC分类号： B24D1100
CPC分类号： B24B37/24 , B24B37/042 , B24D3/26 , B24D3/28 , B24D18/0009 , B29C43/006 , B29C43/203
摘要： A polishing pad having a uniform, continuously interconnected porous surface. The pad is produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. The sintering process is conducted at a pressure in excess of 100 psi and in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other.
摘要翻译：抛光垫，具有均匀的连续互连的多孔表面。通过在高于玻璃化转变温度但不超过聚合物的熔点的温度下加压烧结热塑性聚合物的粉末压块来制备垫。烧结过程在超过100psi的压力下进行，并且在具有所需最终垫尺寸的模具中进行。在优选的方案中，使用两种聚合物粉末的混合物，其中一种聚合物的熔点比另一种低。

7. 发明授权

US06648733B2 Polishing pads and methods relating thereto 有权
公开(公告)号：US06648733B2
公开(公告)日：2003-11-18
申请号：US09848894
申请日：2001-05-04
申请人： John V. H. Roberts , David B. James , Lee Melbourne Cook , Ronald D. Bakule
发明人： John V. H. Roberts , David B. James , Lee Melbourne Cook , Ronald D. Bakule
IPC分类号： B24B100
CPC分类号： B24D3/28 , B24B37/26 , B24B41/047 , B24D3/26
摘要： A polishing pad with a polishing layer having a macro-texture and a micro-texture wherein the polishing layer is formed by solidifying a flowable material, the polishing layer further comprising hard domains and soft domains, each domain having an average size less than 100 microns.

8. 发明授权

US06245679B1 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers 有权
公开(公告)号：US06245679B1
公开(公告)日：2001-06-12
申请号：US09498267
申请日：2000-02-03
申请人： Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
发明人： Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
IPC分类号： H01L2100
CPC分类号： B24B37/26 , B24B37/04 , B24B41/047 , B24B57/02 , B24D3/28 , B24D3/34 , G11B23/0021
摘要： An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.

9. 发明授权

US6019666A Mosaic polishing pads and methods relating thereto 失效
标题翻译：马赛克抛光垫及其相关方法
公开(公告)号：US6019666A
公开(公告)日：2000-02-01
申请号：US74667
申请日：1998-05-08
申请人： John V. H. Roberts , Lee Melbourne Cook , David B. James , Heinz F. Reinhardt
发明人： John V. H. Roberts , Lee Melbourne Cook , David B. James , Heinz F. Reinhardt
IPC分类号： B24B37/26 , B24B41/047 , B24D7/06 , B24D13/14 , B24D99/00 , B24B1/00
CPC分类号： B24B37/26 , B24B41/047 , B24D7/066
摘要： This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece.
摘要翻译：本发明提供抛光垫瓦片，其抛光垫片的几何形状和表面特征可以布置成形成在接缝处具有通道的马赛克垫片，这有利于在抛光工件期间抛光流体的流动。

10. 发明授权

US6017265A Methods for using polishing pads 失效
标题翻译：使用抛光垫的方法
公开(公告)号：US6017265A
公开(公告)日：2000-01-25
申请号：US782717
申请日：1997-01-13
申请人： Lee Melbourne Cook , David B. James , Charles William Jenkins , Heinz F. Reinhardt , John V. H. Roberts , Raj Raghav Pillai
发明人： Lee Melbourne Cook , David B. James , Charles William Jenkins , Heinz F. Reinhardt , John V. H. Roberts , Raj Raghav Pillai
IPC分类号： B24B37/04 , B24D3/26 , B24D3/28 , B24D13/14 , B24D18/00 , B29C43/00 , B24B1/00
CPC分类号： B29C43/006 , B24B37/042 , B24B37/24 , B24D18/0009 , B24D3/26 , B24D3/28
摘要： Polymer-based pads useful for polishing objects, particularly integrated circuits, having interconnected porosity which is uniform in all directions, and where the solid portion of said pad consists of a uniform continuously interconnected polymer material of greater than 50% of the gross volume of the article, are produced directly to final shape and dimension by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer and at a pressure in excess of 100 psi in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other. When pressure sintered at a temperature not to exceed the melting point of the lower melting powder, the increased stiffness afforded by incorporation of the higher melting polymer component gives improved mechanical strength to the sintered product. Conditions for producing the pads of this invention are such that the polymer powder particles from which the pads are produced essentially retain their original shape and are point bonded to form the pad.
摘要翻译：用于抛光物体，特别是集成电路的聚合物基垫，具有在所有方向上均匀的相互连接的孔隙度，并且其中所述垫的固体部分由大于总体积的50％的均匀的连续相互连接的聚合物材料组成制品通过在高于玻璃化转变温度但不超过聚合物的熔点并且在具有所需的模具的模具中的压力超过100psi的压力下加压烧结热塑性聚合物的粉末压块直接制成最终形状和尺寸最终垫尺寸。在优选的方案中，使用两种聚合物粉末的混合物，其中一种聚合物的熔点比另一种低。当在不超过下熔融粉末的熔点的温度下进行压力烧结时，通过引入较高熔点的聚合物组分提供的增加的刚性使烧结产品具有改善的机械强度。制造本发明的焊盘的条件使得制造焊盘的聚合物粉末颗粒基本上保持其原始形状并且被点焊以形成焊盘。

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