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1. 发明授权

US06783562B2 Nonwoven abrasive composite 失效
标题翻译：无纺布磨料复合材料
公开(公告)号：US06783562B2
公开(公告)日：2004-08-31
申请号：US10154239
申请日：2002-05-22
申请人： Howell N. Smith
发明人： Howell N. Smith
IPC分类号： B24D1100
CPC分类号： A47L13/16 , A61K8/0208 , A61K2800/28 , A61Q19/10 , B24D3/002 , B24D11/005 , B32B5/26 , D04H1/559 , D04H1/593
摘要： A nonwoven composite cleaning pad is disclosed. The cleaning pad includes a first nonwoven layer having an absorbent surface. A second nonwoven layer is laminated to the first layer, and a plurality of abrasive polymer formations are provided on the exposed surface of the second layer.
摘要翻译：公开了一种非织造复合清洁垫。清洁垫包括具有吸收表面的第一非织造层。将第二非织造层层压到第一层上，并且在第二层的暴露表面上提供多个磨料聚合物层。

2. 发明授权

US06736714B2 Polishing silicon wafers 失效
公开(公告)号：US06736714B2
公开(公告)日：2004-05-18
申请号：US08941386
申请日：1997-09-30
申请人： Walter Dudovicz
发明人： Walter Dudovicz
IPC分类号： B24D1100
CPC分类号： B24B37/205 , B24B21/04 , B24B37/26 , B24D11/06
摘要： An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.

3. 发明授权

US06648743B1 Chemical mechanical polishing pad 有权
标题翻译：化学机械抛光垫
公开(公告)号：US06648743B1
公开(公告)日：2003-11-18
申请号：US09946253
申请日：2001-09-05
申请人： Peter A. Burke
发明人： Peter A. Burke
IPC分类号： B24D1100
CPC分类号： B24B37/26
摘要： A polishing pad for use in chemical mechanical polishing of a semiconductor substrate is described. The polishing pad comprises a substantially flat disk having a polishing surface for contacting the substrate. The polishing surface, which has a central region and a peripheral region, is segmented by a set of substantially parallel linear grooves. The grooves include central grooves which traverse the central region of the polishing surface, and peripheral grooves which traverse the peripheral region of the polishing surface. The central grooves have central groove dimensions, including a central groove width and pitch. The peripheral grooves have peripheral groove dimensions, including a peripheral groove width and pitch. At least one of the central groove dimensions, i.e. the width or the pitch, is different from the corresponding peripheral groove dimension. This difference in groove dimensions from the center to the edge of the polishing surface introduces a difference in the polishing surface area provided near the peripheral region as compared to the central region of the pad. As the polishing pad spins in relation to the substrate being processed, the variation in polishing surface area across the polishing surface results in a difference in the rate of material removal near the periphery of the substrate as compared to the rate of material removal near the substrate center. Thus, by providing a variation in the width or pitch of the grooves across the polishing surface of the pad, the invention provides for a corresponding radial variation in the polishing rate distribution across the polishing surface.
摘要翻译：描述了用于半导体衬底的化学机械抛光的抛光垫。抛光垫包括具有用于接触基底的抛光表面的基本平坦的盘。具有中心区域和周边区域的抛光表面被一组基本平行的直线槽分割。凹槽包括穿过研磨表面的中心区域的中心凹槽和横过研磨表面的周边区域的周向槽。中心槽具有中心槽尺寸，包括中心槽宽度和间距。周边槽具有周边槽尺寸，包括周边槽宽度和间距。中心槽尺寸中的至少一个，即宽度或间距，与相应的外围槽尺寸不同。与抛光表面的中心到边缘的槽尺寸的这种差异引起了与衬垫的中心区域相比在外围区域附近提供的抛光表面区域的差异。当抛光垫相对于被处理的基板旋转时，抛光表面的抛光表面面积的变化导致与衬底附近的材料去除速率相比，衬底周边附近的材料去除率差异中央。因此，通过在焊盘的抛光表面上提供槽的宽度或间距的变化，本发明提供了穿过抛光表面的抛光速率分布的对应的径向变化。

4. 发明授权

US06602123B1 Finishing pad design for multidirectional use 失效
标题翻译：整理垫设计用于多方向使用
公开(公告)号：US06602123B1
公开(公告)日：2003-08-05
申请号：US10243879
申请日：2002-09-13
申请人： Markus Naujok
发明人： Markus Naujok
IPC分类号： B24D1100
CPC分类号： B24B37/24
摘要： A polishing pad (for example, polishing pad 305) for use in polarization of a semiconductor wafer (for example, semiconductor wafer 420), the polishing pad 305 featuring a plurality of different polishing surfaces, depending upon the direction of the movement of the polishing pad 305. The polishing pad 305 may take the form of a polishing disc or a polishing belt. The polarization of the semiconductor wafer 420 can then take place at a fewer number of polishing stations, thereby reducing the amount of time needed and reducing the probability of damage to the semiconductor wafer 420.
摘要翻译：用于半导体晶片（例如，半导体晶片420）的偏振的抛光垫（例如，抛光垫305），具有多个不同抛光表面的抛光垫305，其取决于抛光的移动方向抛光垫305可以采取抛光盘或抛光带的形式。然后半导体晶片420的极化可以在较少数量的抛光站进行，从而减少所需的时间量并降低对半导体晶片420的损坏概率。

5. 发明授权

US06585579B2 Chemical mechanical planarization or polishing pad with sections having varied groove patterns 失效
公开(公告)号：US06585579B2
公开(公告)日：2003-07-01
申请号：US09905332
申请日：2001-07-13
申请人： Alan J. Jensen , Brian S. Thornton
发明人： Alan J. Jensen , Brian S. Thornton
IPC分类号： B24D1100
CPC分类号： B24B37/26 , B24B21/04 , B24D11/001 , B24D11/04
摘要： A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

6. 发明授权

US06575824B2 Abrasive molding and abrasive disc provided with same 失效
公开(公告)号：US06575824B2
公开(公告)日：2003-06-10
申请号：US09867535
申请日：2001-05-31
申请人： Hideto Kuramochi , Satoshi Kondoh , Yoshinori Harada , Mutsumi Asano
发明人： Hideto Kuramochi , Satoshi Kondoh , Yoshinori Harada , Mutsumi Asano
IPC分类号： B24D1100
CPC分类号： B24B37/24 , B24D11/00
摘要： An abrasive molding comprising at least 90% by weight, based on the abrasive molding, of an inorganic material having a stock hardness of 50-400 kg/mm2, and said abrasive molding having a relative density of 20-70% and an average particle diameter of 0.001-50 &mgr;m. The abrasive molding preferably has pores having a pore size distribution such that the integrated pore volume of pores having a diameter of 0.01-1 &mgr;m is at least 20% of the integrated total pore volume of the entire pores, and the integrated pore volume of pores having a diameter of 1-360 &mgr;m is in the range of 10% to 70% of the integrated total pore volume of the entire pores. The abrasive molding is suitable for polishing a material having a Vickers hardness not larger than 300 kg/mm2.

7. 发明授权

US06575821B2 Abrasive belt for a belt grinding machine 有权
公开(公告)号：US06575821B2
公开(公告)日：2003-06-10
申请号：US09838770
申请日：2001-04-19
申请人： Peter Jöst
发明人： Peter Jöst
IPC分类号： B24D1100
CPC分类号： B24B55/08 , B24D11/00
摘要： An abrasive belt for a belt grinding machine has a support layer, an intermediate layer connected to the support layer, and an abrasive layer connected to the intermediate layer. The support layer transmits a drive output of the belt grinding machine onto the abrasive layer. The abrasive layer allows flow of grinding particles through the abrasive layer. The intermediate layer also allows flow of the grinding particles through the intermediate layer, and the support layer allows flow of the grinding particles through the support layer.

8. 发明授权

US06561890B2 Polishing pad 失效
标题翻译：抛光垫
公开(公告)号：US06561890B2
公开(公告)日：2003-05-13
申请号：US09895300
申请日：2001-07-02
申请人： Shigeru Tominaga
发明人： Shigeru Tominaga
IPC分类号： B24D1100
CPC分类号： B24B37/24 , B24D3/28 , B24D3/346
摘要： A polishing pad for use in chemical mechanical polishing is formed of silicone rubber. An abrasive fine inorganic powder and a reinforcing fine silica powder are dispersed in the silicone rubber, and the inorganic powder has a particle size of 0.01-100 &mgr;m and is contained in the amount of 10-85 wt.% of the silicone rubber.
摘要翻译：用于化学机械抛光的抛光垫由硅橡胶形成。无机粉末分散在硅橡胶中，无机粉末的粒径为0.01〜100μm，硅橡胶的含量为10-85重量％。

9. 再颁专利

USRE37997E1 Polishing pad with controlled abrasion rate 失效
标题翻译：抛光垫具有受控的磨损率
公开(公告)号：USRE37997E1
公开(公告)日：2003-02-18
申请号：US08624783
申请日：1996-03-27
申请人： Mark E. Tuttle
发明人： Mark E. Tuttle
IPC分类号： B24D1100
CPC分类号： B24D11/00 , B24B7/228 , B24B13/01 , B24B37/26
摘要： A polishing pad is provided, having its face shaped to produce controlled nonuniform removal of material from a workpiece. Non-uniformity is produced as a function of distance from the pad's rotational axis (the working radius). The pad face is configured with both raised, contact regions and voided, non-contact regions such that arcuate abrasive contact varies nonuniformly as a function of distance from the pad's rotational axis. Void density at any distance may be produced by several techniques such as varying void size as a function of working radius or varying the number of voids per unit area as a function of working radius. Either technique produces variation in voided area per total unit area for rings of pad surface concentric with the rotational axis having infintesimally small width.
摘要翻译：提供了一种抛光垫，其表面形状可以从工件上产生受控的不均匀的材料去除。产生与衬垫旋转轴距离（工作半径）的函数的不均匀性。衬垫面配置有凸起，接触区域和空隙的非接触区域，使得弧形磨料接触作为距衬垫旋转轴线的距离的函数不均匀地变化。任何距离处的空隙密度可以通过几种技术产生，例如作为工作半径的函数改变空隙尺寸或者改变作为工作半径的函数的每单位面积的空隙数。任一技术产生与具有正面小的宽度的旋转轴线同心的垫表面的环的每单位面积的空隙面积的变化。

10. 发明授权

US06383065B1 Catalytic reactive pad for metal CMP 有权
标题翻译：金属CMP催化反应垫
公开(公告)号：US06383065B1
公开(公告)日：2002-05-07
申请号：US09766759
申请日：2001-01-22
申请人： Steven K. Grumbine , Christopher C. Streinz , Brian L. Mueller
发明人： Steven K. Grumbine , Christopher C. Streinz , Brian L. Mueller
IPC分类号： B24D1100
CPC分类号： B24B37/24 , B24D3/346
摘要： A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other electronic devices.
摘要翻译：一种抛光垫，包括抛光垫基材和具有多种氧化态的催化剂，其中含有催化剂的抛光垫与氧化剂结合使用以化学机械抛光与集成电路和其它电子器件相关的金属特征。

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