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    • 3. 发明申请
    • Self-test architecture to implement data column redundancy in a RAM
    • 在RAM中实现数据列冗余的自检架构
    • US20050055173A1
    • 2005-03-10
    • US10658940
    • 2003-09-09
    • Steven EustisKrishnendu MondalMichael OuelletteJeremy Rowland
    • Steven EustisKrishnendu MondalMichael OuelletteJeremy Rowland
    • G01R31/28G01R31/00G06F19/00G11C29/00G11C29/12G11C29/44
    • G11C29/846G11C29/44G11C29/4401G11C29/72G11C2029/1208
    • Self-test architectures are provided to implement data column and row redundancy with a totally integrated self-test and repair capability in a Random Access Memory (RAM), either a Dynamic RAM (DRAM) or a Static Ram (SRAM), and are particularly applicable to compileable memories and to embedded RAM within microprocessor or logic chips. The invention uses two passes of self-test of a memory. The first pass of self-test determines the worst failing column, the column with the largest number of unique failing row addresses. After completion of the first pass of self-test, the spare column is allocated to replace the worst failing column. In the second pass of self-test, the BIST (Built In Self-Test) collects unique failing row addresses as it does today for memories with spare rows only. At the completion of the second pass of self-test, the spare rows are then allocated. Once the second pass of self-test is completed, the column and unique failing row addresses are transported to the e-fuse macros and permanently stored in the chip.
    • 提供自检架构以在随机存取存储器(RAM),动态RAM(DRAM)或静态RAM(SRAM)中实现完全集成的自检和修复能力的数据列和行冗余,特别是 适用于可编程存储器和微处理器或逻辑芯片内嵌入的RAM。 本发明使用存储器的两次自检。 自检的第一次通过确定最差的列,最大数量唯一的失败行地址的列。 自检完成后,备用列被分配以替代最差的故障列。 在自检的第二次通过中,BIST(内置自检)收集了唯一的失败的行地址,因为它现在仅用于具有备用行的存储器。 在完成自我测试的第二次通过后,然后分配备用行。 一旦自检的第二次通过完成,列和唯一的故障行地址被传输到电子熔丝宏并永久存储在芯片中。
    • 6. 发明申请
    • COMPILABLE MEMORY STRUCTURE AND TEST METHODOLOGY FOR BOTH ASIC AND FOUNDRY TEST ENVIRONMENTS
    • 可编程存储器结构和测试方法用于两个ASIC和基准测试环境
    • US20060176745A1
    • 2006-08-10
    • US10906147
    • 2005-02-04
    • Steven EustisJames MonzelSteven OaklandMichael Ouellette
    • Steven EustisJames MonzelSteven OaklandMichael Ouellette
    • G11C29/00
    • G11C29/48G11C29/1201G11C2029/3202
    • A memory structure configured for supporting multiple test methodologies includes a first plurality of multiplexers configured for selectively coupling at least one data input path and at least one address path between an external customer connection and a corresponding internal memory connection associated therewith. A second multiplexer is configured for selectively coupling an input of a test latch between a functional memory array connection and a memory logic connection coupled to the at least one data input path, with an output of the test latch defining a data out customer connection. Flush logic is further configured to direct data from the memory logic connection to the data out customer connection during a test of logic associated with a customer chip, thereby facilitating observation of the memory logic connection at the customer chip, wherein test elements of the memory structure comprise a scan architecture of a first type, and test elements of the customer chip comprise a scan architecture of a second type.
    • 配置用于支持多种测试方法的存储器结构包括:第一多个复用器,被配置为选择性地耦合至少一个数据输入路径和外部客户连接与与其相关联的对应的内部存储器连接之间的至少一个地址路径。 第二多路复用器被配置用于在功能存储器阵列连接和耦合到所述至少一个数据输入路径的存储器逻辑连接之间选择性地耦合测试锁存器的输入,测试锁存器的输出定义数据输出客户连接。 冲洗逻辑还被配置为在与客户芯片相关联的逻辑的测试期间将数据从存储器逻辑连接引导到数据输出客户连接,从而有助于观察客户芯片处的存储器逻辑连接,其中存储器结构的测试元件 包括第一类型的扫描架构,并且客户芯片的测试元件包括第二类型的扫描架构。
    • 8. 发明申请
    • Memory testing
    • 内存测试
    • US20050120284A1
    • 2005-06-02
    • US10727239
    • 2003-12-02
    • Michael OuelletteJeremy Rowland
    • Michael OuelletteJeremy Rowland
    • G11C29/44G11C29/00
    • G11C29/1201G11C29/44G11C2029/0405G11C2029/3202G11C2029/3602
    • A structure comprising a memory chip and a tester for testing the memory chip, and a method for operating the structure. The memory chip comprises a BIST (Built-in Self Test) circuit, a plurality of RAMs (Random Access Memories). A first RAM is selected for testing by scanning in a select value into a RAM select register in the BIST. While the BIST performs a first testing pass for the first RAM, the tester collects cycle numbers of the failing cycles. Then, the BIST performs a second testing pass for the first RAM. At each failing cycle identified during the first testing pass, the BIST pauses so that the content of the location of the first RAM associated with the failing cycle and the state of the BIST can be extracted out of the memory chip. The testing procedures for the other RAMs are similar to that of the first RAM.
    • 一种包括存储器芯片和用于测试存储芯片的测试器的结构,以及用于操作该结构的方法。 存储器芯片包括BIST(内置自检)电路,多个RAM(随机存取存储器)。 通过将选择值扫描到BIST中的RAM选择寄存器中,选择第一个RAM进行测试。 当BIST执行第一个RAM的第一次测试通过时,测试仪将收集故障周期的周期数。 然后,BIST对第一个RAM执行第二次测试。 在第一测试通过期间识别的每个故障循环中,BIST暂停,使得与故障循环相关联的第一RAM的位置的内容和BIST的状态的内容可以从存储器芯片中提取出来。 其他RAM的测试程序与第一个RAM的测试程序相似。