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1. 发明授权

US09377802B1 Dynamic configuration of equivalent series resistance 有权
标题翻译：等效串联电阻的动态配置
公开(公告)号：US09377802B1
公开(公告)日：2016-06-28
申请号：US13414387
申请日：2012-03-07
申请人： Christopher P. Wyland , Romi Mayder , Paul Y. Wu
发明人： Christopher P. Wyland , Romi Mayder , Paul Y. Wu
IPC分类号： G05F1/652 , G05F1/63 , G05F1/44 , G05F1/12
CPC分类号： G05F1/652 , G05F1/12 , G05F1/44 , G05F1/63
摘要： In one embodiment, an integrated circuit (IC) includes a power distribution network having a first set of power distribution lines connected to a source voltage and a second set of power distribution lines connected to a ground voltage, and a first capacitor. A first variable resistive element is electrically coupled in series with the first capacitor between the first and second sets of power lines of the power distribution network. A control circuit is coupled to the variable resistive element and is configured and arranged to adjust a level of resistance of the first variable resistive element in response to an input signal. The adjustment of the level of resistance adjusts an equivalent series resistance of the power distribution network.
摘要翻译：在一个实施例中，集成电路（IC）包括配电网络，该配电网络具有连接到源极电压的第一组配电线路和连接到接地电压的第二组配电线路以及第一电容器。第一可变电阻元件与配电网络的第一和第二组电力线之间的第一电容器串联电耦合。控制电路耦合到可变电阻元件，并且被配置和布置成响应于输入信号调整第一可变电阻元件的电阻电平。电阻水平的调整调整配电网的等效串联电阻。

2. 发明授权

US08410579B2 Power distribution network 有权
标题翻译：配电网络
公开(公告)号：US08410579B2
公开(公告)日：2013-04-02
申请号：US12962613
申请日：2010-12-07
申请人： Atul V. Ghia , Christopher P. Wyland , Ketan Sodha , Paul T. Sasaki , Jian Tan , Paul Y. Wu , Romi Mayder
发明人： Atul V. Ghia , Christopher P. Wyland , Ketan Sodha , Paul T. Sasaki , Jian Tan , Paul Y. Wu , Romi Mayder
IPC分类号： H01L23/64 , H01L21/02
CPC分类号： H01L23/5223 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, an integrated circuit (IC) is presented. The IC includes first and second sets of power distribution lines formed in the IC. The IC includes first and second capacitors formed in one or more layers of the IC. A first plurality of vias couple a first input of the first and second capacitors to the first set of power distribution lines, and a second plurality of vias couple a second input of the first and second capacitors to the second set of power distribution lines. The first capacitor and the first plurality of vias and the second plurality of vias coupled thereto having an equivalent series resistance greater than an equivalent series resistance of the second capacitor and the first plurality of vias and the second plurality of vias coupled thereto.
摘要翻译：在一个实施例中，呈现集成电路（IC）。 IC包括形成在IC中的第一组和第二组配电线。 IC包括形成在IC的一个或多个层中的第一和第二电容器。第一多个通孔将第一和第二电容器的第一输入耦合到第一组配电线，以及第二多个通孔将第一和第二电容器的第二输入端耦合到第二组配电线路。第一电容器和第一多个通孔以及耦合到其上的第二多个通孔具有大于第二电容器和第一多个通孔和第二多个通孔耦合的等效串联电阻的等效串联电阻。

3. 发明申请

US20120139083A1 POWER DISTRIBUTION NETWORK 有权
标题翻译：功率分配网络
公开(公告)号：US20120139083A1
公开(公告)日：2012-06-07
申请号：US12962613
申请日：2010-12-07
申请人： Atul V. Ghia , Christopher P. Wyland , Ketan Sodha , Paul T. Sasaki , Jian Tan , Paul Y. Wu , Romi Mayder
发明人： Atul V. Ghia , Christopher P. Wyland , Ketan Sodha , Paul T. Sasaki , Jian Tan , Paul Y. Wu , Romi Mayder
IPC分类号： H01L21/02 , H01L21/8242
CPC分类号： H01L23/5223 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, an integrated circuit (IC) is presented. The IC includes first and second sets of power distribution lines formed in the IC. The IC includes first and second capacitors formed in one or more layers of the IC. A first plurality of vias couple a first input of the first and second capacitors to the first set of power distribution lines, and a second plurality of vias couple a second input of the first and second capacitors to the second set of power distribution lines. The first capacitor and the first plurality of vias and the second plurality of vias coupled thereto having an equivalent series resistance greater than an equivalent series resistance of the second capacitor and the first plurality of vias and the second plurality of vias coupled thereto.
摘要翻译：在一个实施例中，呈现集成电路（IC）。 IC包括形成在IC中的第一组和第二组配电线。 IC包括形成在IC的一个或多个层中的第一和第二电容器。第一多个通孔将第一和第二电容器的第一输入耦合到第一组配电线，以及第二多个通孔将第一和第二电容器的第二输入端耦合到第二组配电线路。第一电容器和第一多个通孔以及耦合到其上的第二多个通孔具有大于第二电容器和第一多个通孔和第二多个通孔耦合的等效串联电阻的等效串联电阻。

4. 发明授权

US09337138B1 Capacitors within an interposer coupled to supply and ground planes of a substrate 有权
标题翻译：插入器内的电容器耦合到衬底的电源和接地平面
公开(公告)号：US09337138B1
公开(公告)日：2016-05-10
申请号：US13416640
申请日：2012-03-09
申请人： Khaldoon S. Abugharbieh , Gregory Meredith , Christopher P. Wyland , Paul Y. Wu , Henley Liu , Sanjiv Stokes , Yong Wang
发明人： Khaldoon S. Abugharbieh , Gregory Meredith , Christopher P. Wyland , Paul Y. Wu , Henley Liu , Sanjiv Stokes , Yong Wang
IPC分类号： H01L23/52 , H01L23/522 , H01L23/66 , H01L49/02 , H01L23/498
CPC分类号： H01L23/5222 , H01L23/49822 , H01L23/5223 , H01L23/5385 , H01L23/642 , H01L23/66 , H01L24/16 , H01L28/40 , H01L2224/16227 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105
摘要： An embodiment of an apparatus to reduce supply voltage noise with capacitors of an interposer of a stacked die is disclosed. In this embodiment, an interposer is coupled to a first integrated circuit die using a first plurality of interconnects. A substrate is coupled to the interposer using a second plurality of interconnects. The substrate includes a supply voltage plane and a ground plane, each of which is coupled to the first integrated circuit die using the second plurality of interconnects, the interposer, and the first plurality of interconnects. The interposer includes capacitors coupled in parallel using the supply voltage plane, the ground plane, and the second plurality of interconnects, where capacitance from capacitors of the interposer is provided to the first integrated circuit die using the supply voltage plane and the ground plane of the substrate.
摘要翻译：公开了一种用于降低电源电压噪声的设备的实施例，该电容器具有堆叠管芯的插入器的电容器。在该实施例中，插入器使用第一多个互连件耦合到第一集成电路管芯。使用第二多个互连件将衬底耦合到插入器。基板包括电源电压平面和接地平面，每个基板使用第二多个互连，插入器和第一多个互连件耦合到第一集成电路管芯。插入器包括使用电源电压平面，接地平面和第二多个互连并联的电容器，其中使用电源电压平面和内插器的接地平面将插入器的电容器提供给第一集成电路管芯基质。

5. 发明授权

US5931580A Apparatus for measuring junction temperature 失效
标题翻译：用于测量结温的装置
公开(公告)号：US5931580A
公开(公告)日：1999-08-03
申请号：US898448
申请日：1997-07-21
申请人： Christopher P. Wyland
发明人： Christopher P. Wyland
IPC分类号： G01K7/01 , G01K1/14 , G01K7/00
CPC分类号： G01K7/015 , G01K7/01
摘要： The junction temperature of a die inside an electronic component is empirically determined by use of a board simulator that simulates a target board on which the electronic component is to be operated. The board simulator includes a thermoelectric cooler used to electrically control the board simulator's thermal resistivity. The board simulator's thermal resistivity is determined in a first calibration step by measuring the difference in temperatures between two thermocouples mounted on two sides of the board simulator. Then, the board simulator is attached to a test component that includes a heating element and a temperature sensor. In a second calibration step, for a known thermal power generated by the heating element, the junction temperature of the test component is measured for different values of thermal resistivity of the board simulator. Next in a measurement step, the user determines the thermal resistivity of the target board. Then the user uses the measured resistivity to look up the junction temperature of the test component from the calibration measurements, which is the estimated junction temperature of the electronic component. The board simulator includes a heat sink, a peltier device coupled to the heat sink and an optional coupon coupled to the peltier device. The coupon can be formed of the same material as the target board, or of a different material of a known thermal conductivity.
摘要翻译：通过使用模拟要在其上操作电子部件的目标板的电路板模拟器来经验地确定电子部件内的管芯的结温。板模拟器包括用于电控制板模拟器的热阻率的热电冷却器。板模拟器的热电阻率通过测量安装在板模拟器两侧的两个热电偶之间的温度差在第一校准步骤中确定。然后，将板模拟器连接到包括加热元件和温度传感器的测试部件。在第二校准步骤中，对于由加热元件产生的已知热功率，测量板模拟器的不同热阻率值来测试测试部件的结温。接下来在测量步骤中，用户确定目标板的热电阻率。然后，用户使用测量的电阻率从校准测量中查找测试部件的结温，这是电子部件的估计结温。板模拟器包括散热器，耦合到散热器的珀耳帖器件和耦合到珀耳帖器件的可选优惠券。优惠券可以由与目标板相同的材料或具有已知导热性的不同材料形成。

6. 发明授权

US6084770A Device and method for convective cooling of an electronic component 失效
标题翻译：电子部件对流冷却的装置和方法
公开(公告)号：US6084770A
公开(公告)日：2000-07-04
申请号：US890945
申请日：1997-07-09
申请人： Christopher P. Wyland
发明人： Christopher P. Wyland
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H01L23/3677 , H01L23/367 , H01L2924/0002
摘要： A heat sink mounted on an electronic component causes a thermal plume effect so that air adjacent to the electronic component moves through one or more channels in the heat sink in a direction substantially transverse to and away from the electronic component. The heat sink includes a base attachable to the electronic component, a support member mounted on and substantially transverse to the base, and a heat exchanger mounted on the support member and spaced away from the base. The heat exchanger has at least one entry hole adjacent to the base, at least one exit hole at a distance from the entry hole, and one or more channels adjacent to the support member and in flow communication with the entry hole and the exit hole.
摘要翻译：安装在电子部件上的散热器引起热羽流效应，使得靠近电子部件的空气沿着基本横向于和远离电子部件的方向移动到散热器中的一个或多个通道。散热器包括可附接到电子部件的基座，安装在基座上并基本上横向于基座的支撑构件，以及安装在支撑构件上并与基座间隔开的热交换器。热交换器具有与基座相邻的至少一个进入孔，与进入孔相距一定距离的至少一个出口孔和与支撑构件相邻并与进入孔和出口孔流动连通的一个或多个通道。

7. 发明授权

US5457340A Leadframe with power and ground planes 失效
公开(公告)号：US5457340A
公开(公告)日：1995-10-10
申请号：US986951
申请日：1992-12-07
申请人： Thomas H. Templeton, Jr. , Christopher P. Wyland , David L. Campbell
发明人： Thomas H. Templeton, Jr. , Christopher P. Wyland , David L. Campbell
IPC分类号： H01L23/495 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/49541 , H01L23/49503 , H01L24/49 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/48464 , H01L2224/49171 , H01L2224/49179 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107
摘要： A leadframe for use in an integrated circuit package is described. The leadframe comprises a plurality of electrically conductive leads, a die attach pad, and an electrically conductive ring or rings formed generally around the circumference of the die attach pad and between the die attach pad and leads. In one embodiment, at least one of the leads is formed integrally with each ring. The die attach pad may also be formed integrally with one or more leads. In another embodiment, the ring or rings are formed so that they are electrically isolated from the die attach pad, and the die attach pad, leads, and ring or rings are all formed in substantially the same plane. In some embodiments, the ring or rings are broken into electrically isolated sections. Each of the ring sections (and die attach pad, if appropriate) may be electrically connected to a voltage source outside the integrated circuit package (e.g., a power supply or ground). The leadframe is formed from a single sheet of material by, for instance, stamping or etching. The leadframe may be used in either ceramic or plastic packages. The leadframe reduces switching noise and crosstalk, allows more flexibility in placement of power and/or ground bond pads on the die, and allows provision of ground and power planes in an integrated circuit package that is thinner than previous integrated circuit packages containing both ground and power planes.

8. 再颁专利

USRE36907E Leadframe with power and ground planes 失效
标题翻译：带电源和地平面的引线框架
公开(公告)号：USRE36907E
公开(公告)日：2000-10-10
申请号：US947843
申请日：1997-10-09
申请人： Thomas H. Templeton, Jr. , Christopher P. Wyland , David L. Campbell
发明人： Thomas H. Templeton, Jr. , Christopher P. Wyland , David L. Campbell
IPC分类号： H01L23/495 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/49541 , H01L23/49503 , H01L24/49 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/48464 , H01L2224/49171 , H01L2224/49179 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107
摘要： A leadframe for use in an integrated circuit package is described. The leadframe comprises a plurality of electrically conductive leads, a die attach pad, and an electrically conductive ring or rings formed generally around the circumference of the die attach pad and between the die attach pad and leads. In one embodiment, at least one of the leads is formed integrally with each ring. The die attach pad may also be formed integrally with one or more leads. In another embodiment, the ring or rings are formed so that they are electrically isolated from the die attach pad, and the die attach pad, leads, and ring or rings are all formed in substantially the same plane. In some embodiments, the ring or rings are broken into electrically isolated sections. Each of the ring sections (and die attach pad, if appropriate) may be electrically connected to a voltage source outside the integrated circuit package (e.g., a power supply or ground). The leadframe is formed from a single sheet of material by, for instance, stamping or etching. The leadframe may be used in either ceramic or plastic packages. The leadframe reduces switching noise and crosstalk, allows more flexibility in placement of power and/or ground bond pads on the die, and allows provision of ground and power planes in an integrated circuit package that is thinner than previous integrated circuit packages containing both ground and power planes.
摘要翻译：描述了用于集成电路封装的引线框架。引线框架包括多个导电引线，管芯附接焊盘，以及通常围绕管芯附接焊盘的圆周形成并且在管芯附接焊盘和引线之间形成的导电环或环。在一个实施例中，至少一个引线与每个环一体形成。管芯附接垫也可以与一个或多个引线一体地形成。在另一个实施例中，环或环被形成为使得它们与管芯附接垫电隔离，并且管芯附接垫，引线和环或环都形成在基本上相同的平面中。在一些实施例中，环或环被分解成电隔离部分。每个环形部分（以及管芯附接垫，如果适用）可以电连接到集成电路封装（例如，电源或接地）之外的电压源。引线框架通过例如冲压或蚀刻由单片材料形成。引线框架可用于陶瓷或塑料封装。引线框降低了开关噪声和串扰，允许在芯片上放置电源和/或接地焊盘的更大灵活性，并且允许在集成电路封装中提供接地和电源平面，其比先前的集成电路封装薄，包含地和电力飞机

9. 发明授权

US6111199A Integrated circuit package using a gas to insulate electrical conductors 失效
标题翻译：集成电路封装采用气体绝缘电导体
公开(公告)号：US6111199A
公开(公告)日：2000-08-29
申请号：US057015
申请日：1998-04-07
申请人： Christopher P. Wyland , Richard L. Guilhamet
发明人： Christopher P. Wyland , Richard L. Guilhamet
IPC分类号： H01L23/055 , H01L23/08 , H01L23/20 , H01L23/28
CPC分类号： H01L23/055 , H01L23/08 , H01L23/20 , H01L2224/45144 , H01L2224/48091 , H01L2224/49109 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/30107
摘要： An integrated circuit package includes a number of electrical conductors that are completely or at least partially surrounded by a gas instead of a solid material (having no cavities) used in the prior art. Such use of a gas reduces the dielectric constant in a region around each of the electrical conductors, as compared to the dielectric constant of a solid dielectric material. In one implementation, a number of leads are kept separated from a substrate by a number of electrically conductive support members attached to the substrate. Each lead is electrically coupled (e.g. by a bond wire) to a die pad on a die that is supported by the package in the normal manner. The leads are initially formed as portions of a lead frame (e.g. by etching or stamping), and are held separate from each other by the respective support members. The support members are electrically coupled (e.g. by traces and vias in the substrate) to terminals (e.g. pins, balls or lands) of the package. The substrate of such a package can be formed of a non-solid material, such as a foam (e.g. of polyimide) or a mesh (e.g. of graphite strands).
摘要翻译：集成电路封装包括多个电导体，其完全或至少部分地被气体包围，而不是现有技术中使用的固体材料（无空腔）。与固体电介质材料的介电常数相比，这种气体的使用降低了每个电导体周围区域的介电常数。在一个实施方案中，许多引线通过连接到基板的多个导电支撑构件与基板保持分离。每个引线例如通过接合线电耦合到以正常方式由封装件支撑的管芯上的管芯焊盘。引线最初形成为引线框架的部分（例如通过蚀刻或冲压），并且通过相应的支撑构件彼此分离。支撑构件电耦合（例如通过衬底中的迹线和通孔）到封装的端子（例如，引脚，球或焊盘）。这种包装的基材可以由非固体材料形成，例如泡沫（例如聚酰亚胺）或网状物（例如石墨丝）。

10. 发明授权

US5870517A Package including self-aligned laser diode and method of aligning a laser diode 失效
标题翻译：封装包括自对准激光二极管和对准激光二极管的方法
公开(公告)号：US5870517A
公开(公告)日：1999-02-09
申请号：US946332
申请日：1997-10-07
申请人： Christopher P. Wyland
发明人： Christopher P. Wyland
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4225 , H01L2224/48091
摘要： A laser diode alignment package has a substrate with capacitive alignment pads. A charge generator is configured to charge or discharge each of the capacitive alignment pad to a respective voltage in response to an instruction from a processor. A laser diode chip has a conductive die paddle rigidly attached thereto and the laser diode chip is movably positioned on the substrate. The conductive die paddle is positioned with respect to the alignment pads such that when the respective voltages are applied the capacitive alignment pads, Coulomb forces will move the conductive die paddle with respect to the substrate. A feedback mechanism measures the optical power passing through the optical fiber. A processor estimates based on this measured optical power level what voltage should be applied to each of the capacitive coupling pads in order to apply Coulomb forces necessary to align the laser diode chip to the optical fiber. The processor then sends charging instructions to the charge generator. The alignment process can be fully automated thus minimizing the risk of human error. The structure and method require few, if any, moving mechanical parts in order to align the laser and requires little or no heavy equipment.
摘要翻译：激光二极管校准封装具有带电容对准焊盘的衬底。电荷发生器被配置为响应于来自处理器的指令将电容对准焊盘中的每一个充电或放电到相应的电压。激光二极管芯片具有刚性地附接到其上的导电芯片，激光二极管芯片可移动地定位在基板上。导电芯片相对于对准焊盘定位，使得当各个电压施加电容对准焊盘时，库仑力将相对于衬底移动导电裸片。反馈机构测量通过光纤的光功率。处理器基于该测量的光功率水平来估计应该施加到每个电容耦合焊盘的电压，以便施加将激光二极管芯片对准光纤所需的库仑力。处理器然后向充电发生器发送充电指令。对齐过程可以完全自动化，从而将人为错误的风险降至最低。结构和方法需要很少（如果有的话）移动的机械部件，以便对准激光器并且需要很少的或不需要重的设备。

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