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    • 8. 发明授权
    • Multi-step removal of excess emitter material in fabricating
electron-emitting device
    • 在制造电子发射器件时多步去除过量的发射极材料
    • US6027632A
    • 2000-02-22
    • US904967
    • 1997-07-30
    • N. Johan KnallDuane A. HavenRoger W. BartonWilliam H. CreelChristopher J. Spindt
    • N. Johan KnallDuane A. HavenRoger W. BartonWilliam H. CreelChristopher J. Spindt
    • B81C1/00C25F3/14H01J9/02C25F3/02
    • H01J9/025
    • Excess emitter material (52B) is removed in multiple steps during the fabrication of an electron-emitting device. A structure is initially provided in which a dielectric layer (44) overlies a non-insulating region (42), control electrodes (80 or 46/80) overlie the dielectric layer, openings (48/50) extend through the control electrodes and dielectric layer, electron-emissive elements (52A) formed with emitter material are situated in the openings, and an excess layer (52B) of the emitter material overlies the control electrodes and the dielectric layer. Portions of the excess emitter material overlying the dielectric layer in the spaces between the control electrodes are initially removed, preferably with etchant that directly attacks the emitter material. Portions (52C) of the excess emitter material overlying the control electrodes above the electron-emissive elements are subsequently removed to expose the electron-emissive elements.
    • 在制造电子发射器件期间,多个发射极材料(52B)被多个步骤去除。 首先提供一种结构,其中介电层(44)覆盖在非绝缘区域(42)上,控制电极(80或46/80)覆盖在电介质层上,开口(48/50)延伸穿过控制电极和电介质 由发射体材料形成的层,电子发射元件(52A)位于开口中,发射极材料的过剩层(52B)覆盖在控制电极和电介质层上。 最初除去在控制电极之间的空间中覆盖电介质层的多余发射体材料的部分,最好用直接攻击发射极材料的蚀刻剂。 随后去除覆盖电子发射元件上方的控制电极的过量发射体材料的部分(52℃)以露出电子发射元件。