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1. 发明申请

US20060121256A1 Method of fabricating printed circuit board having thin core layer 失效
标题翻译：制造具有薄芯层的印刷电路板的方法
公开(公告)号：US20060121256A1
公开(公告)日：2006-06-08
申请号：US11086642
申请日：2005-03-22
申请人： Chong Kim , Dong Kim , Hyo Lee , Young Shin
发明人： Chong Kim , Dong Kim , Hyo Lee , Young Shin
IPC分类号： B32B3/00 , B32B37/00
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/205 , H05K3/28 , H05K2201/0355 , H05K2203/054 , H05K2203/1536 , Y10T29/49126 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926
摘要： Disclosed is a printed circuit board (PCB) having a thin core layer and a method of fabricating the same. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.
摘要翻译：公开了具有薄芯层的印刷电路板（PCB）及其制造方法。在该方法中，在剥离膜和预浸料坯上形成铜箔的基板被用作基底基板，并且在PCB的制造之后去除芯绝缘层，从而减小最终产品的厚度。

2. 发明申请

US20070059456A1 Negative C-type compensation film and method of preparing the same 有权
标题翻译：负C型补偿膜及其制备方法
公开(公告)号：US20070059456A1
公开(公告)日：2007-03-15
申请号：US11519009
申请日：2006-09-12
申请人： Hyo Lee , Dong Kim , Hee Kim , Dae Nam , Sang Ryu , Boong Jeong , Ju Cha , Ho Lee
发明人： Hyo Lee , Dong Kim , Hee Kim , Dae Nam , Sang Ryu , Boong Jeong , Ju Cha , Ho Lee
IPC分类号： C09K19/00 , B32B27/36 , B32B27/30 , B32B27/32 , B32B17/06
CPC分类号： B32B27/08 , B32B17/06 , B32B27/30 , B32B27/32 , B32B27/36 , B32B2307/418 , B32B2457/202 , G02F1/133634 , Y10T428/1036 , Y10T428/105 , Y10T428/266 , Y10T428/31504 , Y10T428/31507 , Y10T428/31935 , Y10T428/31938 , Y10T428/31971
摘要： Disclosed are a negative C-type compensation film and a method of preparing the same. The negative C-type compensation film includes a) a base layer, and b) a polymer layer comprising polyarylate prepared by a method comprising the step of copolymerizing divalent phenols, divalent aromatic carboxylic acid halides, and allyl bisphenol derivatives, the base layer and the polymer layer being sequentially layered. The compensation film is capable of being used for the negative C-type compensation film without a stretching process, significantly reduces the thickness of the compensation film, and has significantly improved interlayer adhesion force in a multilayer structure.
摘要翻译：公开了负C型补偿膜及其制备方法。负C型补偿膜包括a）基底层，以及b）包含通过包括共价二价酚，二价芳族羧酸酰卤和烯丙基双酚衍生物的步骤的方法制备的聚芳酯的聚合物层，基底层和聚合物层依次层叠。补偿膜能够用于负C型补偿膜而不进行拉伸处理，显着降低了补偿膜的厚度，并且在多层结构中显着改善了层间粘合力。

3. 发明申请

US20070060737A1 Novel polyarylate and method for preparing thereof 审中-公开
标题翻译：新型多芳基化合物及其制备方法
公开(公告)号：US20070060737A1
公开(公告)日：2007-03-15
申请号：US11518986
申请日：2006-09-12
申请人： Hyo Lee , Dong Kim , Hee Kim , Dae Nam , Sang Ryu , Boong Jeong , Ju Cha
发明人： Hyo Lee , Dong Kim , Hee Kim , Dae Nam , Sang Ryu , Boong Jeong , Ju Cha
IPC分类号： C08G63/19
CPC分类号： C08G63/193 , C08G63/547 , C08J5/18 , C08J2367/03 , C09D167/03 , C09D167/06
摘要： The present invention relates to a polyarylate prepared by a method comprising a step of copolymerizing divalent phenol, divalent aromatic carboxylic acid halide and the allyl bisphenol derivative. The polyarylate according to the invention is a novel polyarylate in which various functional groups can be introduced to the main chain of the polymer as well as the terminal of a polymer, and the concentration thereof can be adjusted. These functional groups allow improvement in the adhesion force by chemically bonding with the substrate or protective layer when coated, thus the polyarylate is suitably used for a film or a coating composition.
摘要翻译：本发明涉及一种通过包括使二价苯酚，二价芳族羧酸卤化物与烯丙基双酚衍生物共聚的方法制备的多芳基化合物。根据本发明的多芳基化合物是一种新的多芳基化合物，其中可以将各种官能团引入聚合物的主链以及聚合物的末端，并且可以调节其浓度。这些官能团通过在涂布时与基材或保护层进行化学键合来改善粘附力，因此多芳基化合物适合用于膜或涂料组合物。

4. 发明授权

US08990666B2 Decoder, method of operating the same, and apparatuses including the same 有权
标题翻译：解码器，其操作方法和包括该解码器的设备
公开(公告)号：US08990666B2
公开(公告)日：2015-03-24
申请号：US13234130
申请日：2011-09-15
申请人： Jae Phil Kong , Hwa Seok Oh , Dong Kim
发明人： Jae Phil Kong , Hwa Seok Oh , Dong Kim
IPC分类号： H03M13/00 , G06F11/10 , H03M13/15
CPC分类号： G06F11/1008 , G06F11/108 , H03M13/1515 , H03M13/152 , H03M13/1545 , H03M13/6502
摘要： A decoder, a method of decoding and systems implementing the same are disclosed. In one example, the method includes calculating syndrome values from input codewords, generating an error location polynomial about the codewords using the syndrome values, determining an error count in the codewords using the error location polynomial, and adjusting power consumption of a circuit in response to the determined error count in the codewords. In one example, a frequency of a clock signal to be provided to a search circuit may be determined based on the error count, and the clock signal may be provided having the determined frequency to a search circuit, such as a Chien search circuit.
摘要翻译：公开了解码器，解码方法及其实现方法。在一个示例中，该方法包括从输入码字计算校正子值，使用校正子值生成关于码字的误差位置多项式，使用误差位置多项式确定码字中的误差计数，以及响应于在码字中确定的错误计数。在一个示例中，可以基于错误计数来确定要提供给搜索电路的时钟信号的频率，并且可以向诸如Chien搜索电路的搜索电路提供具有确定的频率的时钟信号。

5. 发明申请

US20080038144A1 High strength alloys 有权
标题翻译：高强度合金
公开(公告)号：US20080038144A1
公开(公告)日：2008-02-14
申请号：US11788858
申请日：2007-04-20
申请人： Phillip Maziasz , John Shingledecker , Michael Santella , Joachim Schneibel , Vinod Sikka , Harold Vinegar , Randy John , Dong Kim
发明人： Phillip Maziasz , John Shingledecker , Michael Santella , Joachim Schneibel , Vinod Sikka , Harold Vinegar , Randy John , Dong Kim
IPC分类号： C22C38/44 , C22C30/02 , C22C38/02 , C22C38/04 , C22C38/08 , C22C38/12 , C22C38/16 , C22C38/18 , C22C38/58 , E21B36/00 , C22C38/48 , C22C38/20 , C22C38/22 , C22C38/26 , C22C38/38 , C22C38/40 , C22C38/42
CPC分类号： E21B43/2401 , B32B1/08 , B32B9/002 , B32B9/045 , B32B15/013 , B32B15/015 , B32B2307/202 , B32B2307/208 , C21D6/002 , C21D6/007 , C21D2211/001 , C21D2211/004 , C21D2211/005 , C22C38/02 , C22C38/04 , C22C38/10 , C22C38/12 , C22C38/14 , C22C38/24 , C22C38/28 , C22C38/30 , E21B36/04 , G05F1/10 , Y10S166/902 , Y10T307/406
摘要： High strength metal alloys are described herein. At least one composition of a metal alloy includes chromium, nickel, copper, manganese, silicon, niobium, tungsten and iron. System, methods, and heaters that include the high strength metal alloys are described herein. At least one heater system may include a canister at least partially made from material containing at least one of the metal alloys. At least one system for heating a subterranean formation may include a tubular that is at least partially made from a material containing at least one of the metal alloys.
摘要翻译：本文描述了高强度金属合金。至少一种金属合金组成包括铬，镍，铜，锰，硅，铌，钨和铁。包括高强度金属合金的系统，方法和加热器在本文中描述。至少一个加热器系统可以包括至少部分地由包含至少一种金属合金的材料制成的罐。用于加热地下地层的至少一个系统可以包括至少部分地由包含至少一种金属合金的材料制成的管状体。

6. 发明申请

US20080000098A1 Drying machine and method for controlling the same 有权
标题翻译：干燥机及其控制方法
公开(公告)号：US20080000098A1
公开(公告)日：2008-01-03
申请号：US11706435
申请日：2007-02-15
申请人： Chul Choi , Dae Yang , Chong Ryu , Jea Wee , Young Kim , Sang Hun Bae , Chang Son , Dong Kim , Young Son
发明人： Chul Choi , Dae Yang , Chong Ryu , Jea Wee , Young Kim , Sang Hun Bae , Chang Son , Dong Kim , Young Son
IPC分类号： D06F58/04 , F26B21/02
CPC分类号： D06F58/203 , D06F58/04 , D06F58/28
摘要： A drying machine is disclosed. The drying machine includes a selectively rotatable drum receiving an object to be dried, a steam supply member having one side connected to a steam generator and the other side connected to the drum, and a swirler installed in the steam supply member at a predetermined position for swirling steam flowing through the steam supply member. A method for controlling the drying machine includes heating a drum, supplying steam generated in a steam generator into the drum, and supplying hot air into the drum. The drying machine having the above described configuration can efficiently eliminate creases of clothes.
摘要翻译：公开了干燥机。干燥机包括容纳待干燥物体的可选择性地旋转的滚筒，具有连接到蒸汽发生器的一侧的蒸汽供应构件和连接到滚筒的另一侧;以及在预定位置处安装在蒸汽供应构件中的旋流器，蒸汽通过蒸汽供应构件流动。一种用于控制干燥机的方法包括加热滚筒，将在蒸汽发生器中产生的蒸汽供应到滚筒中，并将热空气供应到滚筒中。具有上述构造的干燥机能够有效地消除衣服的褶皱。

7. 发明申请

US20070279940A1 Optical Sheet and Backlight Assembly Having the Same 有权
标题翻译：光学片和背光组件具有相同的功能
公开(公告)号：US20070279940A1
公开(公告)日：2007-12-06
申请号：US11734611
申请日：2007-04-12
申请人： Cheul Kim , Sang Kim , Jong Huh , Dong Kim , Ju Lee , Min Kim , Hyun Shin , Yong Kim
发明人： Cheul Kim , Sang Kim , Jong Huh , Dong Kim , Ju Lee , Min Kim , Hyun Shin , Yong Kim
IPC分类号： F21V8/00 , G02B5/02
CPC分类号： G02B5/045
摘要： Provided are embodiments of an optical sheet and a backlight assembly having the optical sheet. The optical sheet can include a body, a plurality of protrusions, and a plurality of embossed portions. The body can form a substrate. One surface of the body can be provided in a planar shape, and the other surface of the body can include the plurality of protrusions, where the protrusions have a triangular shaped cross-section. Each of the protrusions can be configured with the plurality of embossed, which may be formed by a microlens pattern.
摘要翻译：提供了具有光学片的光学片和背光组件的实施例。光学片可以包括主体，多个突起和多个压花部分。身体可以形成底物。身体的一个表面可以设置成平面形状，并且主体的另一个表面可以包括多个突起，其中突起具有三角形的横截面。每个突起可以配置有多个压花，其可以由微透镜图案形成。

8. 发明申请

US20070249095A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US20070249095A1
公开(公告)日：2007-10-25
申请号：US11769489
申请日：2007-06-27
申请人： Moon Song , Dong Kim , Jin Ryu
发明人： Moon Song , Dong Kim , Jin Ryu
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/3114 , H01L24/10 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.
摘要翻译：本文公开了用于数字光学仪器的半导体封装及其制造方法。半导体封装包括由硅材料制成的晶片，并且在其一个侧表面上形成有焊盘电极，IR滤光器通过粘结剂分别附着在晶片的焊盘电极上，分别与焊盘电极电连接，在与晶片电极相对的晶片的另一侧表面上形成的通孔以及每个端子的一侧连接的凸起电极。通过采用晶片级封装技术，本发明能够使具有图像传感器（称为互补金属氧化物半导体（CMOS）或电荷耦合器件（CCD））的半导体封装的尺寸最小化，从而降低半导体封装的制造成本并大量实现生产。

9. 发明申请

US20070165149A1 Liquid crystal display panel and manufacturing method thereof 有权
标题翻译：液晶显示面板及其制造方法
公开(公告)号：US20070165149A1
公开(公告)日：2007-07-19
申请号：US11487075
申请日：2006-07-14
申请人： Jeong Kim , Dong Kim , Yeong Kwon
发明人： Jeong Kim , Dong Kim , Yeong Kwon
IPC分类号： G02F1/1343
CPC分类号： G02F1/134336 , G02F1/13454 , G02F1/136213 , G02F1/136286
摘要： A liquid crystal display (LCD) panel and manufacturing method thereof capable of ensuring an aperture ratio while reducing the number of data lines by a change of an arrangement structure of subpixels includes a plurality of subpixels constituting a display region, a plurality of thin film transistors (TFTs) connected respectively to the plurality of subpixels, a plurality of gate lines connected to the TFTs and formed along long sides of the subpixels, a plurality of data lines connected to the TFTs and formed along short sides of the subpixels, a plurality of storage lines formed to pass through the subpixels along the short sides of the subpixels, a first common storage line connected commonly to one end of each of the plurality of storage lines, and a second common storage line connected commonly to an opposite end of each of the plurality of storage lines.
摘要翻译：一种液晶显示器（LCD）面板及其制造方法，其能够通过子像素的配置结构的改变来确保开口率同时减少数据线的数量，包括构成显示区域的多个子像素，多个薄膜晶体管（TFT），分别连接到所述多个子像素，多个栅极线，连接到所述TFT并沿所述子像素的长边形成;多个数据线，连接到所述TFT并沿所述子像素的短边形成;多个栅极线，形成为沿着子像素的短边穿过子像素的存储线，共同连接到多个存储线中的每一个的一端的第一公共存储线，以及共同连接到每个的相对端的第二公共存储线多条存储线。

10. 发明申请

US20070157790A1 Locking tailpiece 有权
标题翻译：锁定尾巴
公开(公告)号：US20070157790A1
公开(公告)日：2007-07-12
申请号：US11330712
申请日：2006-01-12
申请人： Dong Kim , Hyung Park , James Rosenberg , Richard Akers
发明人： Dong Kim , Hyung Park , James Rosenberg , Richard Akers
IPC分类号： G10D3/04
CPC分类号： G10D3/04
摘要： Included herein is an instrument component for mounting to the body of an instrument having strings, for example a guitar. The instrument component comprises a plurality of attachment devices, an elongated bracket, and a biasing element. The elongated bracket includes a plurality of attachment apertures where each aperture includes a center and is shaped to accept one of the attachment devices. A biasing element is positioned in each attachment aperture wherein each biasing element engages one of the attachment devices. Each biasing element includes a plurality of protrusions wherein each protrusion biases the attachment device toward the center of the attachment aperture.
摘要翻译：这里包括用于安装到具有弦的乐器的身体的乐器部件，例如吉他。仪器部件包括多个附接装置，细长支架和偏置元件。细长支架包括多个附接孔，其中每个孔包括一个中心并成形为接受一个连接装置。偏置元件定位在每个附接孔中，其中每个偏置元件接合附接装置中的一个。每个偏置元件包括多个突起，其中每个突出部朝着连接孔的中心偏压附接装置。

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