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1. 发明申请

US20070144258A1 Accelerometer 失效
标题翻译：加速度计
公开(公告)号：US20070144258A1
公开(公告)日：2007-06-28
申请号：US11591617
申请日：2006-11-02
申请人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
发明人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P2015/0814
摘要： An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.
摘要翻译：加速度计包括固定单元和可移动单元。固定单元具有多个第一电极部分和多个第二电极部分。可移动单元与固定单元连接，并且包括具有开口的主体，多个第三电极部分和多个第四电极部分。第三电极部分分别相对于第一电极部分设置在主体的外侧。第四电极部分设置在开口内的主体的内侧，分别相对于第二电极部分设置。

2. 发明授权

US07412888B2 Accelerometer 失效
标题翻译：加速度计
公开(公告)号：US07412888B2
公开(公告)日：2008-08-19
申请号：US11591617
申请日：2006-11-02
申请人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
发明人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P2015/0814
摘要： An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.
摘要翻译：加速度计包括固定单元和可移动单元。固定单元具有多个第一电极部分和多个第二电极部分。可移动单元与固定单元连接，并且包括具有开口的主体，多个第三电极部分和多个第四电极部分。第三电极部分分别相对于第一电极部分设置在主体的外侧。第四电极部分设置在开口内的主体的内侧，分别相对于第二电极部分设置。

3. 发明授权

US07989904B2 Micro-electromechanical device and manufacturing method thereof 有权
标题翻译：微机电装置及其制造方法
公开(公告)号：US07989904B2
公开(公告)日：2011-08-02
申请号：US12016889
申请日：2008-01-18
申请人： Cheng-Chang Lee , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
发明人： Cheng-Chang Lee , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
IPC分类号： H01L27/14
CPC分类号： B81C1/0019
摘要： A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.
摘要翻译：微机电器件包括衬底，第一图案化导电层，第二图案化导电层和第一图案化阻挡层。第一图案化导电层设置在基板上。第二图案化导电层设置在第一图案化导电层上。第一图案化阻挡层与第一图案化导电层和第二图案化导电层连接。此外，还公开了一种制造微机电装置的方法。

4. 发明授权

US07884624B2 Capacitance sensing structure 有权
标题翻译：电容感测结构
公开(公告)号：US07884624B2
公开(公告)日：2011-02-08
申请号：US11956527
申请日：2007-12-14
申请人： Horng-Jou Wang , Hsieh-Shen Hsieh , Chao-Jui Liang , Cheng-Chang Lee , Chao-Qing Wang , Zong-Ting Yuan , Huang-Kun Chen , Tai-Kang Shing
发明人： Horng-Jou Wang , Hsieh-Shen Hsieh , Chao-Jui Liang , Cheng-Chang Lee , Chao-Qing Wang , Zong-Ting Yuan , Huang-Kun Chen , Tai-Kang Shing
IPC分类号： G01R27/26
CPC分类号： G01P15/125 , G01C19/5755 , G01C19/5769 , G01P15/18
摘要： A capacitance sensing structure includes a substrate, a sensing electrode layer, at least one stack layer and a conductive body. The sensing electrode layer is formed on or in the substrate. The stack layer is formed on the sensing electrode layer. The conductive body is disposed over and corresponding to the sensing electrode layer and the stack layer.
摘要翻译：电容感测结构包括衬底，感测电极层，至少一个堆叠层和导电体。感测电极层形成在衬底上或衬底中。堆叠层形成在感测电极层上。导电体设置在感测电极层和堆叠层之上并对应于感测电极层和堆叠层。

5. 发明申请

US20080217787A1 MICRO-ELECTROMECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：微机电装置及其制造方法
公开(公告)号：US20080217787A1
公开(公告)日：2008-09-11
申请号：US12016889
申请日：2008-01-18
申请人： Cheng-Chang LEE , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
发明人： Cheng-Chang LEE , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： B81C1/0019
摘要： A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.
摘要翻译：微机电器件包括衬底，第一图案化导电层，第二图案化导电层和第一图案化阻挡层。第一图案化导电层设置在基板上。第二图案化导电层设置在第一图案化导电层上。第一图案化阻挡层与第一图案化导电层和第二图案化导电层连接。此外，还公开了一种制造微机电装置的方法。

6. 发明申请

US20060144565A1 Heat dissipation devices and fabrication methods thereof 审中-公开
标题翻译：散热装置及其制造方法
公开(公告)号：US20060144565A1
公开(公告)日：2006-07-06
申请号：US11315244
申请日：2005-12-23
申请人： Hsin-Chang Tsai , Horng-Jou Wang , Darren Chen , Tai-Kang Shing
发明人： Hsin-Chang Tsai , Horng-Jou Wang , Darren Chen , Tai-Kang Shing
IPC分类号： H05K7/20 , F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/025 , F28D15/0266 , F28F2210/02 , H01L2924/0002 , H01L2924/00
摘要： This invention id related to a heat dissipation device comprises a case having a heat dissipation path, a backflow path, a first link path, and a second link path for working fluid to circulate therein. The heat dissipation path and the backflow path are positioned in the different height levels individually. The working fluid will not be more easily have turbulence. The reduction of heat dissipation efficiency will be improved. And the working fluid will not be necessary to limit covering the liquid state and gaseous state both.
摘要翻译：本发明涉及一种散热装置，其特征在于，具有：具有散热路径的壳体，回流路径，第一连结路径，以及工作流体在其中循环的第二连杆路径。散热路径和回流路径分别位于不同的高度水平。工作液不会更容易产生紊流。降低散热效率将得到改善。并且工作流体不需要限制覆盖液体状态和气态两者。

7. 发明申请

US20060119457A1 Micro-switch 审中-公开
标题翻译：微动开关
公开(公告)号：US20060119457A1
公开(公告)日：2006-06-08
申请号：US11283991
申请日：2005-11-22
申请人： Hsin-Chang Tsai , Chia-Hua Chu , Horng-Jou Wang , Tai-Kang Shing
发明人： Hsin-Chang Tsai , Chia-Hua Chu , Horng-Jou Wang , Tai-Kang Shing
IPC分类号： H01H51/22
CPC分类号： H01H59/0009
摘要： A micro-switch. The micro-switch comprises at least one base, at least one fixed portion, and at least one switch component. The base comprises at least one first terminal and at least one first drive unit. The fixed portion is protruded higher than the base. The switch component comprises at least one deflection structure and at least one reverse structure. The deflection structure comprises at least one second terminal and at least one second drive unit. The second terminal corresponds to the first terminal and the second drive unit corresponds to the first drive unit. The reverse structure comprises one end connected to the fixed portion and another end connected to the deflection structure.
摘要翻译：一个微动开关微型开关包括至少一个基座，至少一个固定部分和至少一个开关部件。底座包括至少一个第一端子和至少一个第一驱动单元。固定部分比基座突出。开关部件包括至少一个偏转结构和至少一个反向结构。偏转结构包括至少一个第二端子和至少一个第二驱动单元。第二端子对应于第一端子，第二驱动单元对应于第一驱动单元。反向结构包括连接到固定部分的一端和连接到偏转结构的另一端。

8. 发明授权

US08153461B2 Light-emitting diode apparatus and manufacturing method thereof 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US08153461B2
公开(公告)日：2012-04-10
申请号：US13207889
申请日：2011-08-11
申请人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
发明人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
IPC分类号： H01L21/00 , H01L33/60
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L2933/0091
摘要： A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.
摘要翻译：发光二极管（LED）装置包括导热基板，导热粘合剂层，外延层，电流扩展层和微型或纳米粗糙结构。导热粘合剂层设置在导热基板上。外延层与导电粘合剂层相对设置，并具有第一半导体层，有源层和第二半导体层。电流扩散层设置在外延层的第二半导体层和导热粘合剂层之间。微结构或纳米粗糙结构设置在外延层的第一半导体层上。此外，还公开了一种LED装置的制造方法。

9. 发明申请

US20110300650A1 LIGHT-EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US20110300650A1
公开(公告)日：2011-12-08
申请号：US13207889
申请日：2011-08-11
申请人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
发明人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
IPC分类号： H01L33/60
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L2933/0091
摘要： A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.
摘要翻译：发光二极管（LED）装置包括导热基板，导热粘合剂层，外延层，电流扩散层和微型或纳米粗糙结构。导热粘合剂层设置在导热基板上。外延层与导电粘合剂层相对设置，并具有第一半导体层，有源层和第二半导体层。电流扩散层设置在外延层的第二半导体层和导热粘合剂层之间。微结构或纳米粗糙结构设置在外延层的第一半导体层上。此外，还公开了一种LED装置的制造方法。

10. 发明授权

US08017962B2 Light-emitting diode apparatus and manufacturing method thereof 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US08017962B2
公开(公告)日：2011-09-13
申请号：US12193271
申请日：2008-08-18
申请人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
发明人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
IPC分类号： H01L33/60
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L2933/0091
摘要： A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.
摘要翻译：发光二极管（LED）装置包括导热基板，导热粘合剂层，外延层，电流扩散层和微型或纳米粗糙结构。导热粘合剂层设置在导热基板上。外延层与导电粘合剂层相对设置，并具有第一半导体层，有源层和第二半导体层。电流扩散层设置在外延层的第二半导体层和导热粘合剂层之间。微结构或纳米粗糙结构设置在外延层的第一半导体层上。此外，还公开了一种LED装置的制造方法。

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