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1. 发明申请

US20130152688A1 MICRO-ELECTRO-MECHANICAL SENSING DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：微电子机械传感装置及其制造方法
公开(公告)号：US20130152688A1
公开(公告)日：2013-06-20
申请号：US13688099
申请日：2012-11-28
申请人： Chih-Ming Sun , Ming-Han Tsai
发明人： Chih-Ming Sun , Ming-Han Tsai
IPC分类号： G01P15/09 , B81C1/00 , G01P15/00
CPC分类号： G01P15/0802 , B81B2201/025 , B81C1/0015 , G01P15/00 , G01P15/09 , G01P15/0922 , G01P15/125 , G01P2015/0837
摘要： A micro-electro-mechanical sensing device including a substrate, a semiconductor layer, a supporting pillar, a first suspended arm, a connecting member, a second suspended arm, and a proof mass is provided. The semiconductor layer is disposed on or above the substrate. The supporting pillar is disposed on or above the semiconductor layer. The first suspended arm is disposed on the supporting pillar. The supporting connects a portion of the first suspended arm. The connecting member directly or indirectly connects another portion of the first suspended arm. The second suspended arm has a first surface and a second surface opposite to the first surface. The connecting member connects a portion of the first surface. The proof mass connects the second suspended arm and it includes a portion of the second suspended arm as a portion of the proof mass. A method for manufacturing the device is also provided.
摘要翻译：提供了一种包括衬底，半导体层，支撑柱，第一悬臂，连接构件，第二悬臂和校验块的微机电感测装置。半导体层设置在基板上或上方。支撑柱设置在半导体层上或上方。第一悬挂臂设置在支撑柱上。支撑件连接第一悬臂的一部分。连接构件直接或间接连接第一悬臂的另一部分。第二悬臂具有与第一表面相对的第一表面和第二表面。连接构件连接第一表面的一部分。检验质量块连接第二悬臂，并且其包括第二悬臂的一部分作为证明块的一部分。还提供了一种用于制造该装置的方法。

2. 发明申请

US20090090184A1 OUT-OF-PLANE SENSING DEVICE 有权
标题翻译：超平面感测装置
公开(公告)号：US20090090184A1
公开(公告)日：2009-04-09
申请号：US11944291
申请日：2007-11-21
申请人： Chuanwei WANG , Ming Han Tsai , Chih Ming Sun , Weileun Fang
发明人： Chuanwei WANG , Ming Han Tsai , Chih Ming Sun , Weileun Fang
IPC分类号： G01P15/13
CPC分类号： G01P15/125 , G01P15/18 , G01P2015/082 , G01P2015/084
摘要： An out-of-plane sensing device is provided. A proof mass is movable with respect to a substrate. A frame is positioned on the substrate and encloses the proof mass. At least one spring connects the proof mass to the frame so that the spring will exert a force on the proof mass to make the proof mass move back to its equilibrium position when the proof mass moves perpendicularly to the substrate. An electrode extends from the proof mass toward the frame. A counter electrode extends from the frame toward the proof mass, wherein the projection of the electrode onto the substrate overlaps with that of the counter electrode onto the substrate.
摘要翻译：提供了一种平面外感测装置。证明物质可相对于基底移动。框架定位在基板上并包围检测质量块。至少一个弹簧将检测质量块连接到框架上，使得弹簧将在证明物质上施加力，以使证明物质在垂直于基底移动时使证明物质移回到其平衡位置。电极从防弹块向框架延伸。反电极从框架朝向证明物质延伸，其中电极到基板上的突起与对电极的突起重叠在基板上。

3. 发明授权

US09070699B2 Micromachined structures 有权
标题翻译：微加工结构
公开(公告)号：US09070699B2
公开(公告)日：2015-06-30
申请号：US13343187
申请日：2012-01-04
申请人： Chuanwei Wang , Ming Han Tsai , Chih Ming Sun , Weileun Fang
发明人： Chuanwei Wang , Ming Han Tsai , Chih Ming Sun , Weileun Fang
IPC分类号： H01L21/00 , H01L49/02 , H01L29/84
CPC分类号： H01L28/60 , H01L29/84 , Y10T428/22
摘要： A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.
摘要翻译：微加工结构包括基底和悬挂结构。基板具有形成在其上的空腔。悬浮结构形成在基板的空腔上。悬浮结构包括第一金属层，第二金属层和位于第一和第二金属层之间的第一介电层，其中第一介电层具有通过形成在第一金属中的开口与空腔连通的第一开口层。

4. 发明申请

US20150102701A1 MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE WITH ENHANCED STRUCTURAL STRENGTH 有权
标题翻译：具有增强结构强度的微电子机械系统装置
公开(公告)号：US20150102701A1
公开(公告)日：2015-04-16
申请号：US14505022
申请日：2014-10-02
申请人： Chih-Ming Sun , Ming-Han Tsai , Hsin-Hui Hsu , WeiChung Wang
发明人： Chih-Ming Sun , Ming-Han Tsai , Hsin-Hui Hsu , WeiChung Wang
IPC分类号： H02K1/06
CPC分类号： H02N1/006 , B81B3/0013 , B81B3/007 , B81B2203/0118
摘要： The invention provides a MEMS device with enhanced structural strength. The MEMS device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments. The metal segments are individually connected to an adjacent metal layer immediately under the top metal layer through at least one supporting pillar, and there is no dielectric layer between the metal segments and the adjacent metal layer immediately under the top metal layer. The metal layers except the top metal layer are respectively connected to their adjacent metal layers through at least one supporting pillar and a dielectric layer filling in between.
摘要翻译：本发明提供了具有增强的结构强度的MEMS器件。 MEMS器件包括多个金属层，包括具有多个金属段的顶部金属层。金属段通过至少一个支撑柱分别连接到顶部金属层正下方的相邻金属层，并且金属片段和紧邻在顶部金属层下面的相邻金属层之间没有电介质层。除了顶部金属层之外的金属层通过填充在其中的至少一个支撑柱和介电层分别连接到其相邻的金属层。

5. 发明申请

US20150097586A1 MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MICRO-ELECTRO- MECHANICAL SYSTEM COMPENSATION STRUCTURE 有权
标题翻译：微电子机械系统装置和微机电系统补偿结构
公开(公告)号：US20150097586A1
公开(公告)日：2015-04-09
申请号：US14499200
申请日：2014-09-28
申请人： Ming-Han Tsai , Chih-Ming Sun , Hsin-Hui Hsu
发明人： Ming-Han Tsai , Chih-Ming Sun , Hsin-Hui Hsu
IPC分类号： B81B7/02 , B81B3/00 , G01R27/26
CPC分类号： B81B3/0086
摘要： This invention provides a MEMS device, including: a mass structure having at least one anchor; at least one flexible structure connected with the mass structure at the at least one anchor; a plurality of top electrodes located above the mass structure and forming a top capacitor circuit with the mass structure; and a plurality of bottom electrodes located under the mass structure and forming a bottom capacitor circuit with the mass structure. The projections of the plural top electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor, and the projections of the plural bottom electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor. This invention also provides a MEMS compensation structure.
摘要翻译：本发明提供了一种MEMS装置，包括：具有至少一个锚的质量结构; 至少一个柔性结构，与所述质量结构在所述至少一个锚固件处连接; 多个顶部电极位于质量结构之上并形成具有质量结构的顶部电容器电路; 以及位于质量结构下方的多个底部电极，并形成具有质量结构的底部电容器电路。沿着质量结构的法线方向的质量结构上的多个顶部电极的突起位于锚固体的相对侧，沿着质量结构的法线方向在质量结构上的多个底部电极的突起位于在锚的相对侧。本发明还提供一种MEMS补偿结构。

6. 发明授权

US08524519B2 MEMS microphone device and method for making same 有权
公开(公告)号：US08524519B2
公开(公告)日：2013-09-03
申请号：US13135417
申请日：2011-07-06
申请人： Chuan-Wei Wang , Chih-Ming Sun
发明人： Chuan-Wei Wang , Chih-Ming Sun
IPC分类号： H01L21/00
CPC分类号： B81B7/0051 , H04R19/005 , H04R19/04
摘要： The present invention discloses a MEMS microphone device and its manufacturing method. The MEMS microphone device includes: a substrate including a first cavity; a MEMS device region above the substrate, wherein the MEMS device region includes a metal layer, a via layer, an insulating material region and a second cavity; a mask layer above the MEMS device region; a first lid having at least one opening communicating with the second cavity, the first lid being fixed above the mask layer; and a second lid fixed under the substrate.

7. 发明授权

US08105498B2 Method for fabricating variable parallel plate capacitors 有权
标题翻译：可变平行板电容器的制造方法
公开(公告)号：US08105498B2
公开(公告)日：2012-01-31
申请号：US11944317
申请日：2007-11-21
申请人： Chuanwei Wang , Ming Han Tsai , Chih Ming Sun , Weileun Fang
发明人： Chuanwei Wang , Ming Han Tsai , Chih Ming Sun , Weileun Fang
IPC分类号： B44C1/22
CPC分类号： H01L28/60 , H01L29/84 , Y10T428/22
摘要： A method for fabricating micromachined structures is provided. A structure including a dielectric layer, a metal layer and a passivation layer is formed, wherein the dielectric layer has a via thereon. An etching window is formed on the passivation layer. An etching solution is poured into the via through the etching window to perform a process of etching. After etching, the etching solution is removed and the passivation layer is removed. Finally, the structure is etched again to form the micromachined structure.
摘要翻译：提供了一种制造微加工结构的方法。形成包括电介质层，金属层和钝化层的结构，其中介电层在其上具有通孔。在钝化层上形成蚀刻窗口。将蚀刻溶液通过蚀刻窗口注入到通孔中以进行蚀刻处理。蚀刻后，除去蚀刻溶液，除去钝化层。最后，再次蚀刻结构以形成微加工结构。

8. 发明授权

US09783409B2 Micro-electro-mechanical system device and micro-electro-mechanical system compensation structure 有权
公开(公告)号：US09783409B2
公开(公告)日：2017-10-10
申请号：US14499200
申请日：2014-09-28
申请人： Ming-Han Tsai , Chih-Ming Sun , Hsin-Hui Hsu
发明人： Ming-Han Tsai , Chih-Ming Sun , Hsin-Hui Hsu
IPC分类号： G01R27/26 , B81B3/00
CPC分类号： B81B3/0086
摘要： This invention provides a MEMS device, including: a mass structure having at least one anchor; at least one flexible structure connected with the mass structure at the at least one anchor; a plurality of top electrodes located above the mass structure and forming a top capacitor circuit with the mass structure; and a plurality of bottom electrodes located under the mass structure and forming a bottom capacitor circuit with the mass structure. The projections of the plural top electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor, and the projections of the plural bottom electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor. This invention also provides a MEMS compensation structure.

9. 发明授权

US09302901B2 Micro-electro-mechanical system device with enhanced structural strength 有权
标题翻译：具有增强结构强度的微机电系统装置
公开(公告)号：US09302901B2
公开(公告)日：2016-04-05
申请号：US14505022
申请日：2014-10-02
申请人： Chih-Ming Sun , Ming-Han Tsai , Hsin-Hui Hsu , WeiChung Wang
发明人： Chih-Ming Sun , Ming-Han Tsai , Hsin-Hui Hsu , WeiChung Wang
IPC分类号： H01L29/84 , B81B3/00
CPC分类号： H02N1/006 , B81B3/0013 , B81B3/007 , B81B2203/0118
摘要： The invention provides a MEMS device with enhanced structural strength. The MEMS device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments. The metal segments are individually connected to an adjacent metal layer immediately under the top metal layer through at least one supporting pillar, and there is no dielectric layer between the metal segments and the adjacent metal layer immediately under the top metal layer. The metal layers except the top metal layer are respectively connected to their adjacent metal layers through at least one supporting pillar and a dielectric layer filling in between.
摘要翻译：本发明提供了具有增强的结构强度的MEMS器件。 MEMS器件包括多个金属层，包括具有多个金属段的顶部金属层。金属段通过至少一个支撑柱分别连接到顶部金属层正下方的相邻金属层，并且金属片段和紧邻在顶部金属层下面的相邻金属层之间没有电介质层。除了顶部金属层之外的金属层通过填充在其中的至少一个支撑柱和介电层分别连接到其相邻的金属层。

10. 发明授权

US09010185B2 Three-dimensional micro-electro-mechanical-system sensor 有权
标题翻译：三维微机电系统传感器
公开(公告)号：US09010185B2
公开(公告)日：2015-04-21
申请号：US13482989
申请日：2012-05-29
申请人： Ming-Han Tsai , Chih-Ming Sun
发明人： Ming-Han Tsai , Chih-Ming Sun
IPC分类号： G01P15/125 , G01P15/18 , G01P15/08
CPC分类号： G01P15/125 , G01P15/18 , G01P2015/082 , G01P2015/084 , G01P2015/0845
摘要： The present invention discloses a three-dimensional micro-electro-mechanical-system sensor. The sensor includes movable first electrodes, plural movable second electrodes, plural fixed third electrodes, and plural fixed fourth electrodes. The first electrodes and their adjacent third electrodes form at least one first capacitor and at least one second capacitor, and the second electrodes and their adjacent fourth electrodes form at least one third capacitor. The capacitance change of the first capacitor reflects the displacement of the proof mass along a first axis, the capacitance change of the second capacitor reflects the displacement of the proof mass along a second axis, and the capacitance change of the third capacitor reflects the displacement of the proof mass along a third axis. The first, second, and third axes define a three-dimensional coordinate system.
摘要翻译：本发明公开了一种三维微机电系统传感器。传感器包括可移动的第一电极，多个可移动的第二电极，多个固定的第三电极和多个固定的第四电极。第一电极及其相邻的第三电极形成至少一个第一电容器和至少一个第二电容器，并且第二电极及其相邻的第四电极形成至少一个第三电容器。第一电容器的电容变化反映了沿着第一轴的检测质量块的位移，第二电容器的电容变化反映了沿第二轴的检验质量块的位移，并且第三电容器的电容变化反映了第三电容器的位移沿着第三轴的检验质量。第一，第二和第三轴定义三维坐标系。

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