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1. 发明授权

US07618520B2 Physical vapor deposition target constructions 有权
标题翻译：物理气相沉积目标结构
公开(公告)号：US07618520B2
公开(公告)日：2009-11-17
申请号：US11234615
申请日：2005-09-23
申请人： Chi tse Wu , Stephane Ferrasse , Frank C. Alford , Susanne Grabmeier , Werner H. Hort , Jaeyeon Kim , Susan D. Strothers , Andrew Wragg , Robert Prater
发明人： Chi tse Wu , Stephane Ferrasse , Frank C. Alford , Susanne Grabmeier , Werner H. Hort , Jaeyeon Kim , Susan D. Strothers , Andrew Wragg , Robert Prater
IPC分类号： C23C14/35
CPC分类号： C23C14/3407 , H01J37/3423 , H01J37/3426
摘要： The invention includes a target construction having a sputtering region and a flange region laterally outward relative to the sputtering region. The flange region has a front surface disposed on a front face of the construction and a back surface opposing the front surface. An o-ring groove is disposed within the flange region. The o-ring groove has a planar base surface which has a first width and has an orifice disposed along the front surface of the flange. The orifice has a second width as measured parallel relative to the base surface. The second width is greater than the first width. The flange surfaces can additionally be protected from rubbing by a layer of protective material.
摘要翻译：本发明包括具有溅射区域和相对于溅射区域横向向外的凸缘区域的目标结构。凸缘区域具有设置在结构的正面上的前表面和与前表面相对的后表面。 O形环槽设置在凸缘区域内。 O形环槽具有平坦的基面，其具有第一宽度并且具有沿凸缘的前表面设置的孔。孔口具有相对于基底表面平行测量的第二宽度。第二宽度大于第一宽度。凸缘表面可另外被保护，免受一层保护材料的摩擦。

2. 发明申请

US20060070876A1 Physical vapor deposition target constructions 有权
公开(公告)号：US20060070876A1
公开(公告)日：2006-04-06
申请号：US11234615
申请日：2005-09-23
申请人： Chi Wu , Stephane Ferrasse , Frank Alford , Susanne Grabmeier , Werner Hort , Jaeyeon Kim , Susan Strothers , Andrew Wragg , Robert Prater
发明人： Chi Wu , Stephane Ferrasse , Frank Alford , Susanne Grabmeier , Werner Hort , Jaeyeon Kim , Susan Strothers , Andrew Wragg , Robert Prater
IPC分类号： C23C14/00 , C23C14/32
CPC分类号： C23C14/3407 , H01J37/3423 , H01J37/3426
摘要： The invention includes a target construction having a sputtering region and a flange region laterally outward relative to the sputtering region. The flange region has a front surface disposed on a front face of the construction and a back surface opposing the front surface. An o-ring groove is disposed within the flange region. The o-ring groove has a planar base surface which has a first width and has an orifice disposed along the front surface of the flange. The orifice has a second width as measured parallel relative to the base surface. The second width is greater than the first width. The flange surfaces can additionally be protected from rubbing by a layer of protective material.

3. 发明申请

US20090045051A1 TARGET DESIGNS AND RELATED METHODS FOR COUPLED TARGET ASSEMBLIES, METHODS OF PRODUCTION AND USES THEREOF 有权
标题翻译：联合目标组件的目标设计及相关方法，生产方法及其用途
公开(公告)号：US20090045051A1
公开(公告)日：2009-02-19
申请号：US11838166
申请日：2007-08-13
申请人： Stephane Ferrasse , Werner H. Hort , Jaeyeon Kim , Frank C. Alford
发明人： Stephane Ferrasse , Werner H. Hort , Jaeyeon Kim , Frank C. Alford
IPC分类号： C23C14/50 , B21D39/00
CPC分类号： C23C14/3407 , B21K25/00 , H01J37/3414 , H01J37/3423 , H01J37/3426 , Y10T29/49826
摘要： Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component. Methods of forming a sputtering target are also described that comprises: a) providing a target surface component comprising a surface material; b) providing a core backing component having a coupling surface, a back surface and at least one open area; c) coupling the coupling surface to at least part of the target surface component, wherein at least part of the target surface component fits into the at least one open area of the core backing component.
摘要翻译：描述了溅射靶，其包括：a）包含靶材料的靶表面组分; b）具有联接表面，后表面和至少一个开放区域的芯背衬部件，其中所述耦合表面耦合到所述目标表面部件的至少一部分; 并且其中所述目标表面部件的至少一部分装配到所述芯背衬部件的至少一个开放区域中。在一些实施例中，目标表面部件，芯部背衬部件或其组合具有至少一个表面区域特征，其耦合到或位于芯背衬部件，目标表面部件或其组合的后表面中，其中表面面积特征增加了目标表面部件的冷却效果。还描述了形成溅射靶的方法，其包括：a）提供包含表面材料的靶表面组分; b）提供具有联接表面，后表面和至少一个开放区域的芯背衬部件; c）将所述耦合表面耦合到所述目标表面部件的至少一部分，其中所述目标表面部件的至少一部分装配到所述芯部背衬部件的所述至少一个开放区域中。

4. 发明授权

US08702919B2 Target designs and related methods for coupled target assemblies, methods of production and uses thereof 有权
标题翻译：耦合目标组件的目标设计和相关方法，生产方法及其用途
公开(公告)号：US08702919B2
公开(公告)日：2014-04-22
申请号：US11838166
申请日：2007-08-13
申请人： Stephane Ferrasse , Werner H. Hort , Jaeyeon Kim , Frank C. Alford
发明人： Stephane Ferrasse , Werner H. Hort , Jaeyeon Kim , Frank C. Alford
IPC分类号： C23C14/34
CPC分类号： C23C14/3407 , B21K25/00 , H01J37/3414 , H01J37/3423 , H01J37/3426 , Y10T29/49826
摘要： Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component. Methods of forming a sputtering target are also described that comprises: a) providing a target surface component comprising a surface material; b) providing a core backing component having a coupling surface, a back surface and at least one open area; c) coupling the coupling surface to at least part of the target surface component, wherein at least part of the target surface component fits into the at least one open area of the core backing component.
摘要翻译：描述了溅射靶，其包括：a）包含靶材料的靶表面组分; b）具有联接表面，后表面和至少一个开放区域的芯背衬部件，其中所述耦合表面耦合到所述目标表面部件的至少一部分; 并且其中所述目标表面部件的至少一部分装配到所述芯背衬部件的至少一个开放区域中。在一些实施例中，目标表面部件，芯部背衬部件或其组合具有至少一个表面区域特征，其耦合到或位于芯背衬部件，目标表面部件或其组合的后表面中，其中表面面积特征增加了目标表面部件的冷却效果。还描述了形成溅射靶的方法，其包括：a）提供包含表面材料的靶表面组分; b）提供具有联接表面，后表面和至少一个开放区域的芯背衬部件; c）将所述耦合表面耦合到所述目标表面部件的至少一部分，其中所述目标表面部件的至少一部分装配到所述芯部背衬部件的所述至少一个开放区域中。

5. 发明申请

US20080041720A1 Novel manufacturing design and processing methods and apparatus for PVD targets 审中-公开
标题翻译： PVD目标的新型制造设计和加工方法和设备
公开(公告)号：US20080041720A1
公开(公告)日：2008-02-21
申请号：US11504130
申请日：2006-08-14
申请人： Jaeyeon Kim , Susan D. Strothers , Ira G. Nolander
发明人： Jaeyeon Kim , Susan D. Strothers , Ira G. Nolander
IPC分类号： C23C14/00
CPC分类号： C23C14/3407 , H01J37/3414 , H01J37/3435
摘要： Methods for producing PVD sputtering targets comprising extended sidewalls are described that include: a) bonding a surface material to a core material to produce a rough part; b) forming the rough part; and in some embodiments, c) utilizing at least one machining step to form the target. In addition, methods for producing PVD sputtering targets comprising extended sidewalls are described herein that include: a) concurrently bonding a surface material to a core material to produce a rough part and forming the rough part; and in some embodiments, b) utilizing at least one machining step to form the target. PVD sputtering targets and related apparatus formed by and utilizing these methods are also described herein.
摘要翻译：描述了用于制造包括延伸侧壁的PVD溅射靶的方法，其包括：a）将表面材料粘结到芯材以产生粗糙部分; b）形成粗糙部分; 并且在一些实施例中，c）利用至少一个加工步骤来形成所述靶。另外，本文描述了用于制造包括延伸侧壁的PVD溅射靶的方法，其包括：a）将表面材料同时粘合到芯材以产生粗糙部分并形成粗糙部分; 并且在一些实施例中，b）利用至少一个加工步骤来形成所述目标。本文还描述了通过并利用这些方法形成的PVD溅射靶和相关装置。

6. 发明申请

US20060278520A1 Use of DC magnetron sputtering systems 审中-公开
标题翻译：使用直流磁控溅射系统
公开(公告)号：US20060278520A1
公开(公告)日：2006-12-14
申请号：US11150900
申请日：2005-06-13
申请人： Eal Lee , Robert Prater , Nicole Truong , Jaeyeon Kim
发明人： Eal Lee , Robert Prater , Nicole Truong , Jaeyeon Kim
IPC分类号： C23C14/32 , C23C14/00
CPC分类号： C23C14/3407 , C23C14/564
摘要： A DC magnetron sputtering system is described that comprises an anodic shield; a cathodic target that comprises at least one sidewall; a plasma ignition arc; and a catch-ring coupled to and located around the shield. Another DC magnetron sputtering system is described that comprises an anodic shield; a cathodic target comprising at least one recess, cavity or a combination thereof and at least one protrusion; and a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the at least one recess, cavity or a combination thereof, the at least one protrusion or a combination thereof. Yet another DC magnetron sputtering system is described herein that comprises an anodic shield comprising at least one protrusion; a cathodic target comprising at least one recess, cavity or a combination thereof; and a plasma ignition arc, whereby the arc is located at the point of least resistance between the at least one protrusion coupled to the anodic shield and the at least one protrusion, recess or cavity. Methods are also provided whereby the gas turbulence effect is mitigated, such methods including providing an anodic shield; providing a cathodic target comprising at least one recess, cavity or a combination thereof and at least one protrusion; and initiating a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the at least one recess, cavity or a combination thereof, the at least one protrusion or a combination thereof. Additional methods include providing an anodic shield; providing a cathodic target that comprises at least one sidewall; providing a catch-ring coupled to and around the shield; and initiating a plasma ignition arc.
摘要翻译：描述了包括阳极屏蔽的直流磁控溅射系统; 包括至少一个侧壁的阴极靶; 等离子体点火电弧; 以及联接到并位于护罩周围的卡环。描述了包括阳极屏蔽的另一个DC磁控溅射系统; 包括至少一个凹部，空腔或其组合以及至少一个突起的阴极靶; 以及等离子体点火电弧，由此电弧位于阳极屏蔽和至少一个凹部，空腔或其组合之间的最小阻力点处，该至少一个突起或其组合。本文描述了另一个DC磁控溅射系统，其包括包括至少一个突起的阳极屏蔽; 包括至少一个凹部，空腔或其组合的阴极靶; 和等离子体点火电弧，由此电弧位于耦合到阳极屏蔽的至少一个突起与至少一个突起，凹部或空腔之间的最小阻力点。还提供了减轻气体紊流效应的方法，包括提供阳极屏蔽的方法; 提供阴极靶，其包括至少一个凹部，空腔或其组合以及至少一个突起; 以及启动等离子体点火电弧，由此所述电弧位于所述阳极屏蔽和所述至少一个凹部，空腔或其组合之间的最小阻力点处，所述至少一个突起或其组合。附加方法包括提供阳极屏蔽; 提供包括至少一个侧壁的阴极靶; 提供耦合到屏蔽件周围的卡环; 并启动等离子体点火电弧。

7. 发明授权

US09180753B2 Integrated cooling system for eco-friendly vehicle 有权
标题翻译：环保车辆集成冷却系统
公开(公告)号：US09180753B2
公开(公告)日：2015-11-10
申请号：US12957078
申请日：2010-11-30
申请人： Jaeyeon Kim , Manhee Park
发明人： Jaeyeon Kim , Manhee Park
IPC分类号： B60H1/32 , F25B7/00 , F25B25/00 , F25D23/12 , B60H1/00 , B60L3/00 , B60L11/14 , B60K1/00
CPC分类号： B60H1/3202 , B60H1/00885 , B60H1/323 , B60H2001/00928 , B60H2001/3289 , B60H2001/3292 , B60K2001/005 , B60L3/0023 , B60L11/14 , B60L11/1874 , B60L11/1892 , B60L2240/36 , F25B5/04 , Y02T10/70 , Y02T10/7077 , Y02T10/88
摘要： The present invention makes it possible to integrate and control in one circuit the systems, such as electric power components, a driving motor, a stack, and an AC condenser which have the maximum enthalpy under similar operational temperature and use conditions, by using an integrated radiator. Therefore, it is possible to minimize air-through resistance of the radiator for cooling the stack and the electric power components and ensure smooth and stable cooling performance of the stack, electric power components, and AC condenser while improving fuel efficiency by reducing the condensation pressure of the air conditioner. Further, it is possible to improve cooling efficiency by non-repeatedly arranging heat exchangers, and reduce the weight of a vehicle, volume of the parts, and the manufacturing cost, by avoiding using too many parts, such as a radiator, a water pump, and a reservoir tank.
摘要翻译：本发明使得可以在一个电路中集成和控制在类似的工作温度和使用条件下具有最大焓的系统，例如电力部件，驱动电动机，堆垛和AC电容器，散热器。因此，可以使散热器的空气通过阻力最小化，以使堆叠和电力部件冷却，并且通过降低冷凝压力来提高燃料效率，确保堆叠，电力部件和AC冷凝器的平滑且稳定的冷却性能的空调。此外，通过避免使用太多的部件（例如散热器，水泵），可以通过不重复地布置热交换器来提高冷却效率，并且减少车辆的重量，部件的体积和制造成本，和一个储罐。

8. 发明申请

US20110132017A1 COOLING SYSTEM FOR ECO-FRIENDLY VEHICLE 有权
标题翻译：生态友好车辆冷却系统
公开(公告)号：US20110132017A1
公开(公告)日：2011-06-09
申请号：US12906782
申请日：2010-10-18
申请人： Jaeyeon Kim , Manhee Park
发明人： Jaeyeon Kim , Manhee Park
IPC分类号： F25D31/00 , F25D17/02 , F25D17/06
CPC分类号： H01M8/04731 , B60H1/00278 , B60H2001/00307 , B60K2001/005 , F01P3/18 , F01P2003/187 , F01P2050/24 , F01P2060/14 , H01M8/04029 , H01M8/04074 , Y02E60/50 , Y02T10/88
摘要： A cooling system for an eco-friendly vehicle, may include an unified radiator that cools working fluid flowing therethrough to cool an electric power component and an air-cooling type AC condenser, respectively, a pump that is disposed in a series with the unified radiator to pump up the working fluid in the unified radiator to the electric power component or the water-cooling type AC condenser, a first branch pipe and a second branch pipe that connect the electric power components with the water-cooling type AC condenser in parallel for the unified radiator and the pump, and a valve connected to the first and second branch pipes and disposed to selectively supply the working fluid from the pump to the first branch pipe and the second branch pipe.
摘要翻译：用于环保车辆的冷却系统可以包括统一的散热器，其冷却流过其中的工作流体以分别冷却电力部件和空气冷却型AC冷凝器，与分散的散热器串联设置的泵将统一散热器中的工作流体泵送到电力部件或水冷式AC冷凝器，将电力部件与水冷式AC冷凝器并联连接的第一分支管和第二分支管，统一的散热器和泵，以及连接到第一和第二分支管的阀，并且设置成选择性地将工作流体从泵供给到第一分支管和第二分支管。

9. 发明授权

US08398833B2 Use of DC magnetron sputtering systems 有权
标题翻译：使用直流磁控溅射系统
公开(公告)号：US08398833B2
公开(公告)日：2013-03-19
申请号：US12988016
申请日：2009-04-14
申请人： Eal H. Lee , Jaeyeon Kim
发明人： Eal H. Lee , Jaeyeon Kim
IPC分类号： C23C14/35
CPC分类号： C23C14/3407 , C23C14/35 , C23C14/564 , H01J37/3408 , H01J37/3426 , H01J37/3429 , H01J37/3435 , H01J37/3441
摘要： Field-enhanced sputtering targets are disclosed that include: a core material; and a surface material, wherein at least one of the core material or the surface material has a field strength design profile and wherein the sputtering target comprises a substantially uniform erosion profile. Target assembly systems are also disclosed that include a field-enhanced sputtering target; and an anodic shield. Additionally, methods of producing a substantially uniform erosion on a sputtering target are described that include: providing an anodic shield; providing a cathodic field-enhanced target; and initiating a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the cathodic field-enhanced target.
摘要翻译：公开了场增强溅射靶，其包括：芯材料; 和表面材料，其中所述芯材料或表面材料中的至少一个具有场强设计曲线，并且其中所述溅射靶包括基本均匀的侵蚀曲线。还公开了包括场增强溅射靶的目标组装系统; 和阳极屏蔽。此外，描述了在溅射靶上产生基本均匀的侵蚀的方法，其包括：提供阳极屏蔽; 提供阴极场增强目标; 并启动等离子体点火电弧，由此电弧位于阳极屏蔽和阴极场增强靶之间的最小电阻点。

10. 发明申请

US20090078570A1 TARGET/BACKING PLATE CONSTRUCTIONS, AND METHODS OF FORMING TARGET/BACKING PLATE CONSTRUCTIONS 审中-公开
标题翻译：目标/背板结构及其形成目标/背板结构的方法
公开(公告)号：US20090078570A1
公开(公告)日：2009-03-26
申请号：US12259998
申请日：2008-10-28
申请人： Wuwen Yi , Ravi Rastogi , Jaeyeon Kim , Brett Clark , Susan D. Storhers , Michael Pinter , Janine K. Kardokus
发明人： Wuwen Yi , Ravi Rastogi , Jaeyeon Kim , Brett Clark , Susan D. Storhers , Michael Pinter , Janine K. Kardokus
IPC分类号： C23C14/34 , B23K1/20 , B23K28/00 , B23K20/08
CPC分类号： C23C14/3414 , H01J37/3426 , H01J37/3491
摘要： Target/backing plate constructions and methods of forming target/backing plate constructions are disclosed herein. The targets and backing plates can be bonded to one another through an appropriate interlayer. The targets can comprise one or more of titanium, tantalum, titanium zirconium, hafnium, niobium, vanadium, tungsten, copper or a combination thereof. The interlayer can comprise one or more of silver, copper, nickel, tin, titanium and indium. Target/backing plate constructions of the present invention can have bond strengths of at least 20 ksi and an average grain size within the target of less than 80 microns.
摘要翻译：本文公开了靶/背板结构和形成靶/背板结构的方法。靶材和背板可以通过适当的中间层彼此粘结。靶可以包括钛，钽，钛锆，铪，铌，钒，钨，铜或其组合中的一种或多种。中间层可以包括银，铜，镍，锡，钛和铟中的一种或多种。本发明的靶/背板结构可以具有至少20ksi的键合强度和小于80微米的目标内的平均晶粒尺寸。

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