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    • 5. 发明申请
    • TARGET DESIGNS AND RELATED METHODS FOR COUPLED TARGET ASSEMBLIES, METHODS OF PRODUCTION AND USES THEREOF
    • 联合目标组件的目标设计及相关方法,生产方法及其用途
    • US20090045051A1
    • 2009-02-19
    • US11838166
    • 2007-08-13
    • Stephane FerrasseWerner H. HortJaeyeon KimFrank C. Alford
    • Stephane FerrasseWerner H. HortJaeyeon KimFrank C. Alford
    • C23C14/50B21D39/00
    • C23C14/3407B21K25/00H01J37/3414H01J37/3423H01J37/3426Y10T29/49826
    • Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component. Methods of forming a sputtering target are also described that comprises: a) providing a target surface component comprising a surface material; b) providing a core backing component having a coupling surface, a back surface and at least one open area; c) coupling the coupling surface to at least part of the target surface component, wherein at least part of the target surface component fits into the at least one open area of the core backing component.
    • 描述了溅射靶,其包括:a)包含靶材料的靶表面组分; b)具有联接表面,后表面和至少一个开放区域的芯背衬部件,其中所述耦合表面耦合到所述目标表面部件的至少一部分; 并且其中所述目标表面部件的至少一部分装配到所述芯背衬部件的至少一个开放区域中。 在一些实施例中,目标表面部件,芯部背衬部件或其组合具有至少一个表面区域特征,其耦合到或位于芯背衬部件,目标表面部件或其组合的后表面中,其中表面 面积特征增加了目标表面部件的冷却效果。 还描述了形成溅射靶的方法,其包括:a)提供包含表面材料的靶表面组分; b)提供具有联接表面,后表面和至少一个开放区域的芯背衬部件; c)将所述耦合表面耦合到所述目标表面部件的至少一部分,其中所述目标表面部件的至少一部分装配到所述芯部背衬部件的所述至少一个开放区域中。
    • 6. 发明授权
    • Target designs and related methods for coupled target assemblies, methods of production and uses thereof
    • 耦合目标组件的目标设计和相关方法,生产方法及其用途
    • US08702919B2
    • 2014-04-22
    • US11838166
    • 2007-08-13
    • Stephane FerrasseWerner H. HortJaeyeon KimFrank C. Alford
    • Stephane FerrasseWerner H. HortJaeyeon KimFrank C. Alford
    • C23C14/34
    • C23C14/3407B21K25/00H01J37/3414H01J37/3423H01J37/3426Y10T29/49826
    • Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component. Methods of forming a sputtering target are also described that comprises: a) providing a target surface component comprising a surface material; b) providing a core backing component having a coupling surface, a back surface and at least one open area; c) coupling the coupling surface to at least part of the target surface component, wherein at least part of the target surface component fits into the at least one open area of the core backing component.
    • 描述了溅射靶,其包括:a)包含靶材料的靶表面组分; b)具有联接表面,后表面和至少一个开放区域的芯背衬部件,其中所述耦合表面耦合到所述目标表面部件的至少一部分; 并且其中所述目标表面部件的至少一部分装配到所述芯背衬部件的至少一个开放区域中。 在一些实施例中,目标表面部件,芯部背衬部件或其组合具有至少一个表面区域特征,其耦合到或位于芯背衬部件,目标表面部件或其组合的后表面中,其中表面 面积特征增加了目标表面部件的冷却效果。 还描述了形成溅射靶的方法,其包括:a)提供包含表面材料的靶表面组分; b)提供具有联接表面,后表面和至少一个开放区域的芯背衬部件; c)将所述耦合表面耦合到所述目标表面部件的至少一部分,其中所述目标表面部件的至少一部分装配到所述芯部背衬部件的所述至少一个开放区域中。
    • 7. 发明授权
    • Use of DC magnetron sputtering systems
    • 使用直流磁控溅射系统
    • US08398833B2
    • 2013-03-19
    • US12988016
    • 2009-04-14
    • Eal H. LeeJaeyeon Kim
    • Eal H. LeeJaeyeon Kim
    • C23C14/35
    • C23C14/3407C23C14/35C23C14/564H01J37/3408H01J37/3426H01J37/3429H01J37/3435H01J37/3441
    • Field-enhanced sputtering targets are disclosed that include: a core material; and a surface material, wherein at least one of the core material or the surface material has a field strength design profile and wherein the sputtering target comprises a substantially uniform erosion profile. Target assembly systems are also disclosed that include a field-enhanced sputtering target; and an anodic shield. Additionally, methods of producing a substantially uniform erosion on a sputtering target are described that include: providing an anodic shield; providing a cathodic field-enhanced target; and initiating a plasma ignition arc, whereby the arc is located at the point of least resistance between the anodic shield and the cathodic field-enhanced target.
    • 公开了场增强溅射靶,其包括:芯材料; 和表面材料,其中所述芯材料或表面材料中的至少一个具有场强设计曲线,并且其中所述溅射靶包括基本均匀的侵蚀曲线。 还公开了包括场增强溅射靶的目标组装系统; 和阳极屏蔽。 此外,描述了在溅射靶上产生基本均匀的侵蚀的方法,其包括:提供阳极屏蔽; 提供阴极场增强目标; 并启动等离子体点火电弧,由此电弧位于阳极屏蔽和阴极场增强靶之间的最小电阻点。