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1. 发明申请

US20060134869A1 Systems and methods for rectifying and detecting signals 有权
标题翻译：整流和检测信号的系统和方法
公开(公告)号：US20060134869A1
公开(公告)日：2006-06-22
申请号：US11015060
申请日：2004-12-17
申请人： Carl Picciotto , Peter Hartwell
发明人： Carl Picciotto , Peter Hartwell
IPC分类号： H01L21/336
CPC分类号： G01R31/2853
摘要： A first device has a surface and includes a plurality of at largest micrometer-scale geometry structures extending along its surface. The structures have a first portion and a second portion. A plurality of at largest micrometer-scale geometry conductors are coupled to the first portion of respective structures. A converter converts a signal in the first portion of the structures to a substantially direct current signal in the respective second portion. A sensor detects a level of a signal coupled from one of the conductors to a respective one of the structures.
摘要翻译：第一装置具有表面并且包括沿其表面延伸的多个最大的微米尺度的几何结构。该结构具有第一部分和第二部分。多个最大的微米尺度几何形状导体耦合到相应结构的第一部分。 A转换器将结构的第一部分中的信号转换成相应的第二部分中的基本上直流的信号。传感器检测从一个导体耦合到相应的一个结构的信号的电平。

2. 发明申请

US20060131714A1 Signal conduction for doped semiconductors 有权
标题翻译：掺杂半导体的信号传导
公开(公告)号：US20060131714A1
公开(公告)日：2006-06-22
申请号：US11015934
申请日：2004-12-17
申请人： Carl Picciotto , Peter Hartwell
发明人： Carl Picciotto , Peter Hartwell
IPC分类号： H01L21/48 , H01L29/94
CPC分类号： B81B7/0006 , B81B2203/06 , H01L23/48 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2225/06527 , H01L2225/06593 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2924/1461 , H01L2924/00 , H01L2224/0401
摘要： A first device has a surface and includes a micrometer-scale or smaller geometry doped semiconductor region extending along the surface. A second device has a surface opposite the surface of the first device and includes a micrometer-scale or smaller wire extending through the second device to a position in proximity to the surface of the second device. The first and second devices are displaceable between first and second positions relative to each other. The wire is not substantially electrically coupled to the doped semiconductor region in the first position and the wire is substantially electrically coupled to the doped semiconductor region in the second position. A potential applied to the wire affects the conductivity of the doped semiconductor region in the second position.
摘要翻译：第一器件具有表面并且包括沿表面延伸的微米级或更小的几何形状掺杂半导体区域。第二装置具有与第一装置的表面相对的表面，并且包括延伸穿过第二装置的微米级或更小的线到靠近第二装置的表面的位置。第一和第二装置可相对于彼此在第一和第二位置之间移位。导线在第一位置并不实质上电耦合到掺杂半导体区域，并且导线在第二位置中基本上电耦合到掺杂半导体区域。施加到导线的电位影响第二位置中掺杂半导体区域的导电性。

3. 发明授权

US07808061B2 Multi-die apparatus including moveable portions 有权
标题翻译：多模设备包括可移动部分
公开(公告)号：US07808061B2
公开(公告)日：2010-10-05
申请号：US11495363
申请日：2006-07-28
申请人： Peter Hartwell , Carl Picciotto
发明人： Peter Hartwell , Carl Picciotto
IPC分类号： H01L29/82
CPC分类号： B81C1/0023 , B81B3/0062 , B81B2201/0235 , B81B2201/11 , B81B2207/012 , B82Y10/00 , G01P15/08 , G01P15/125 , G01P15/18 , G11B9/1436
摘要： An electronic apparatus includes a first die, a second die, a third die, and a fourth die, wherein a portion of the second die and a portion of the third die are movably connected between the first die and the fourth die.
摘要翻译：电子设备包括第一模具，第二模具，第三模具和第四模具，其中第二模具的一部分和第三模具的一部分可移动地连接在第一模具和第四模具之间。

4. 发明申请

US20080023813A1 Multi-die apparatus including moveable portions 有权
标题翻译：多模设备包括可移动部分
公开(公告)号：US20080023813A1
公开(公告)日：2008-01-31
申请号：US11495363
申请日：2006-07-28
申请人： Peter Hartwell , Carl Picciotto
发明人： Peter Hartwell , Carl Picciotto
IPC分类号： H01L23/02
CPC分类号： B81C1/0023 , B81B3/0062 , B81B2201/0235 , B81B2201/11 , B81B2207/012 , B82Y10/00 , G01P15/08 , G01P15/125 , G01P15/18 , G11B9/1436
摘要： An electronic apparatus includes a first die, a second die, a third die, and a fourth die, wherein a portion of the second die and a portion of the third die are movably connected between the first die and the fourth die.
摘要翻译：电子设备包括第一模具，第二模具，第三模具和第四模具，其中第二模具的一部分和第三模具的一部分可移动地连接在第一模具和第四模具之间。

5. 发明申请

US20060131677A1 Systems and methods for electrically coupling wires and conductors 有权
标题翻译：用于电连接电线和导体的系统和方法
公开(公告)号：US20060131677A1
公开(公告)日：2006-06-22
申请号：US11015468
申请日：2004-12-17
申请人： Carl Picciotto , Peter Hartwell
发明人： Carl Picciotto , Peter Hartwell
IPC分类号： H01L23/02 , H01L27/14 , H01L29/82 , H01L29/84
CPC分类号： H01L23/5382 , H01L21/485 , H01L2924/0002 , H05K1/0239 , H05K1/0268 , H05K3/303 , H05K2203/163 , H05K2203/166 , Y02P70/613 , H01L2924/00
摘要： A first device includes a micrometer-scale or smaller geometry first conductor. A second device includes a micrometer-scale or smaller second conductor. An actuator the first and second devices relative to each other between first and second positions. Signals are substantially coupled between the first and second conductors in the first position and not in the second position.
摘要翻译：第一装置包括千分尺或更小几何形状的第一导体。第二装置包括微米级或更小的第二导体。致动器，第一和第二装置在第一和第二位置之间相对于彼此。在第一位置而不是在第二位置，信号基本上联接在第一和第二导体之间。

6. 发明申请

US20060130955A1 Methods and systems for aligning and coupling devices 有权
公开(公告)号：US20060130955A1
公开(公告)日：2006-06-22
申请号：US11016131
申请日：2004-12-17
申请人： Carl Picciotto , Peter Hartwell
发明人： Carl Picciotto , Peter Hartwell
IPC分类号： B32B37/00
CPC分类号： B81C3/002 , B81C2203/051 , H01L24/29 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/83894 , H01L2224/95145 , H01L2225/06531 , H01L2924/01322 , H01L2924/078 , H01L2924/14 , H01L2924/30105
摘要： A first device has a micrometer-scale or smaller first structure and is flexibly coupled to a first substrate. A second device has a micrometer-scale or smaller second structure and is coupled to a second substrate. At least one actuator displaces at least one of the first and second devices relative to the other in response to a control signal. The control signal is generated by a controller to align the first and second structures and to control the at least one actuator to connect the displaced first and second devices.

7. 发明申请

US20060283465A1 Smart drug delivery system and a method of implementation thereof 审中-公开
标题翻译：智能药物输送系统及其实施方法
公开(公告)号：US20060283465A1
公开(公告)日：2006-12-21
申请号：US11155985
申请日：2005-06-16
申请人： Janice Nickel , Peter Hartwell , Sean Zhang
发明人： Janice Nickel , Peter Hartwell , Sean Zhang
IPC分类号： G06F19/00 , A61K9/22
CPC分类号： A61B5/076 , A61B5/0205 , A61B5/024 , A61B5/0816 , A61B5/14532 , A61B5/4839 , A61M5/148 , A61M5/1723 , A61M2037/0023 , A61M2205/0244 , A61M2205/0294 , A61M2205/3515 , A61M2205/3523 , A61M2205/3561 , A61M2205/3569 , A61M2205/3584 , A61M2205/3592 , A61M2205/6054 , A61M2205/8212 , A61M2205/825 , A61M2205/8256 , A61M2205/8293 , A61M2230/201 , G06Q50/24
摘要： A smart drug delivery system is disclosed. The system includes a sensor component, an analytical component coupled to the sensor component and a drug delivery component coupled to the analytical component for delivering a drug to a host.
摘要翻译：公开了一种智能药物递送系统。该系统包括传感器组件，耦合到传感器组件的分析组件和耦合到分析组件的药物递送组件，用于将药物递送到宿主。

8. 发明授权

US06436794B1 Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer 失效
标题翻译：在处理转子晶片的介质侧之前，使用硒化晶片接合的ARS移动器的工艺流程
公开(公告)号：US06436794B1
公开(公告)日：2002-08-20
申请号：US09860453
申请日：2001-05-21
申请人： Heon Lee , Chung-Ching Yang , Peter Hartwell
发明人： Heon Lee , Chung-Ching Yang , Peter Hartwell
IPC分类号： H01L2130
CPC分类号： G11B9/1436 , B81C1/00896 , B82Y10/00 , G01Q80/00 , G11B9/10 , G11B9/1463 , H01L21/68 , H01L25/50 , H01L2924/0002 , H01L2924/00
摘要： An improved process flow for an atomic resolution storage (ARS) system deposits conductive electrodes on a media side of a rotor wafer before wafer thinning process, i.e., grinding and CMP, thus protecting the conductive electrodes on a media surface from the grinding process. In addition, the CMOS circuitry is formed in a stator wafer at a relatively later stage. Therefore, the CMOS circuitry is less likely to be damaged by heat processing. In addition, some of the necessary processing may be performed with loosened thermal budget. Finally, because wafer bonding of the rotor wafer and the stator wafer is performed at a later stage, there is less probability of degradation of the wafer bonding. Accordingly, device yield may be enhanced, leading to lower manufacturing cost.
摘要翻译：用于原子分辨率存储（ARS）系统的改进的工艺流程在晶片变薄处理（即研磨和CMP）之前在转子晶片的介质侧上沉积导电电极，从而保护介质表面上的导电电极免受研磨过程。此外，CMOS电路在相对较晚的阶段形成在定子晶片中。因此，CMOS电路不太可能被热处理所损坏。另外，一些必要的处理可以用松散的热预算执行。最后，由于转子晶片和定子晶片的晶片接合在稍后的阶段进行，所以晶片接合的劣化的可能性降低。因此，可以提高装置产量，从而降低制造成本。

9. 发明申请

US20060021962A1 Method of fabricating a sharp protrusion 失效
公开(公告)号：US20060021962A1
公开(公告)日：2006-02-02
申请号：US10902762
申请日：2004-07-30
申请人： Peter Hartwell , Uija Yoon
发明人： Peter Hartwell , Uija Yoon
IPC分类号： B44C1/22 , C23F1/00
CPC分类号： H01J9/025 , G01Q70/16 , G01Q80/00 , H01J2201/30407 , H01J2329/00
摘要： A method of fabricating a sharp protrusion on an underlayer is disclosed. A tip layer is deposited on an underlayer and then a mask layer is deposited on the tip layer. The mask layer is patterned with a beam-and-hat pattern that is used to form a beam-and-hat mask in the mask layer. Portions of the tip layer that are not covered by the beam-and-hat mask are isotropically etched to form a tip including a vertex. Beam portions of the beam-and-hat mask support the hat portion and prevent a release of the hat portion during the isotropic etching process. An anisotropic etch process can be used prior to the isotropic etching process to change a character of the tip. The underlayer can be patterned and etched to form a cantilever that includes the sharp protrusion extending outward of a surface of the cantilever.

10. 发明授权

US06440820B1 Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer 失效
标题翻译：在处理转子晶片的介质侧之后使用硒化晶片接合的ARS移动器的工艺流程
公开(公告)号：US06440820B1
公开(公告)日：2002-08-27
申请号：US09860452
申请日：2001-05-21
申请人： Heon Lee , Chung-Ching Yang , Peter Hartwell
发明人： Heon Lee , Chung-Ching Yang , Peter Hartwell
IPC分类号： H01L2130
CPC分类号： G11B9/1418 , B82Y10/00 , G01Q80/00 , G11B9/1463
摘要： An improved process flow for an atomic resolution storage (ARS) system deposits conductive electrodes, together with a protective layer, on a media side of a rotor wafer before most of other device processing, thus preserving a surface for ARS storage media from subsequent wafer thinning process. CMOS circuitry is also formed in a stator wafer at a later stage. Therefore, the CMOS circuitry is less likely to be damaged by heat processing. In addition, processing of the media side of the rotor wafer may be performed with loosened thermal budget. Finally, because the media side of the rotor wafer is processed before wafer bonding of the rotor wafer and the stator wafer, there is less probability of degradation of the wafer bonding. Therefore, device yield may be enhanced, leading to lower manufacturing cost.
摘要翻译：原子分辨率存储（ARS）系统的改进的处理流程在其他器件处理之前大部分其它器件处理之前，将转移晶片的介质侧上的导电电极与保护层一起放置在一起，从而保留了ARS存储介质从后续晶片变薄的表面处理。在稍后阶段也在定子晶片中形成CMOS电路。因此，CMOS电路不太可能被热处理所损坏。此外，可以以松散的热量预算来执行转子晶片的介质侧的处理。最后，因为转子晶片的介质侧在转子晶片和定子晶片的晶片接合之前被处理，所以晶片键合的劣化的可能性降低。因此，可以提高装置产量，导致制造成本降低。

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