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    • 1. 发明申请
    • Multi-unit Modular Stackable Switched Reluctance Motor System with Parallely Excited Low Reluctance Circumferential Magnetic Flux loops for High Torque Density Generation
    • 具有并联励磁低阻抗的多单元模块化可堆叠开关磁阻电机系统,用于高扭矩密度发电
    • US20120001502A1
    • 2012-01-05
    • US13174551
    • 2011-06-30
    • Yee-Chun LeeChung Ching Yang
    • Yee-Chun LeeChung Ching Yang
    • H02K37/08
    • H02K19/103H02K16/00H02K2201/12H02K2213/12
    • The present invention is a apparatus of multi-unit modular stackable switched reluctance motor system with parallely excited low reluctance circumferential magnetic flux loops for high torque density generation. For maximized benefits and advanced motor features, the present invention takes full combined advantages of both SRM architecture and “Axial Flux” architecture by applying “Axial Flux” architecture into SRM design without using any permanent magnet, by modularizing and stacking the “Axial Flux” SRM design for easy configuration and customization to satisfy various drive torque requirements and broad applications, and by incorporating an en energy recovery transformer for minimizing switching circuitry thus further lowering the cost and further increasing the reliability and robustness. Unlike prior arts, the present invention does not use any permanent magnet and this “Axial Flux” SRM system is modularized and stackable with many benefits.
    • 本发明是一种具有并联激励的低磁阻圆周磁通回路的多单元模块化可堆叠开关磁阻电动机系统的装置,用于高扭矩密度产生。 为了实现最大化的优点和先进的电机特性,本发明通过在不使用任何永磁体的情况下将“轴向通量”结构应用于SRM设计,通过模块化和堆叠“轴向通量”来充分利用SRM架构和“轴向通量” SRM设计易于配置和定制,以满足各种驱动扭矩要求和广泛的应用,并通过结合能量回收变压器来最小化开关电路,从而进一步降低成本,进一步提高可靠性和鲁棒性。 不同于现有技术,本发明不使用任何永磁体,并且这种“轴向通量”SRM系统具有许多优点的模块化和堆叠。
    • 7. 发明授权
    • Substrate bonding using a selenidation reaction
    • US06537846B2
    • 2003-03-25
    • US09823550
    • 2001-03-30
    • Heon LeeChung Ching Yang
    • Heon LeeChung Ching Yang
    • H01L2106
    • H01L21/2007H01L21/76251
    • A selenidation reaction for bonding one or more active substrates to a base substrate is disclosed. A bonded-substrate is fabricated by forming a first multi-stacked layer of selenium and indium on a bonding surface of an active substrate and forming a second multi-stacked layer of selenium and indium on a mounting surface of a base substrate. The first and second multi-stacked layers are placed into contact with each other with substantially no pressure. Then the active substrate and the base substrate are bonded to each other by annealing them in an inert ambient to form an indium-selenium compound bond layer that adhesively bonds the substrates to each other. The annealing can occur at a lower temperature than prior wafer-bonding processes and the first and second multi-stacked layers can be deposited over a wide range of relatively low temperatures including room temperature. Additionally, tellurium can be added to the selenium of either one or both of the first and second multi-stacked layers to reduce the annealing temperature and to form an indium-selenium-tellurium compound bond layer that adhesively bonds the substrates to each other. Elemental compounds or amorphous compounds can be used for the materials of the first and second multi-stacked layers to form a polycrystalline or amorphous compound bond layer respectively. One advantage of the compound bond layer is that it can be dissolved using a selective wet etching material so that the active substrate and the base substrate can be non-destructively detached from each other.