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1. 发明授权

US09275978B2 Three-terminal printed devices interconnected as circuits 有权
公开(公告)号：US09275978B2
公开(公告)日：2016-03-01
申请号：US14789454
申请日：2015-07-01
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Richard Austin Blanchard , Bradley S. Oraw
IPC分类号： H01L21/48 , H01L29/739 , H01L25/07 , H01L21/77 , H01L21/84 , H01L25/00 , H01L27/12 , H01L23/00 , H01L25/065 , H01L25/075
CPC分类号： H01L25/072 , H01L21/6835 , H01L21/77 , H01L21/84 , H01L24/05 , H01L24/06 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/95 , H01L24/97 , H01L25/0655 , H01L25/0753 , H01L25/50 , H01L27/12 , H01L2221/68327 , H01L2221/68381 , H01L2224/05552 , H01L2224/05555 , H01L2224/06051 , H01L2224/06181 , H01L2224/24137 , H01L2224/25105 , H01L2224/25174 , H01L2224/32225 , H01L2224/73267 , H01L2224/82104 , H01L2224/92244 , H01L2224/95085 , H01L2224/95101 , H01L2224/95115 , H01L2224/95144 , H01L2224/95145 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： A layer of microscopic, 3-terminal transistors is printed over a first conductor layer so that bottom electrodes of the transistors electrically contact the first conductor layer. A first dielectric layer overlies the first conductor layer, and a second conductor layer over the first dielectric layer contacts intermediate electrodes on the transistors between the bottom electrodes and top electrodes. A second dielectric layer overlies the second conductor layer, and a third conductor layer over the second dielectric layer contacts the top electrodes. The devices are thus electrically connected in parallel by a combination of the first conductor layer, the second conductor layer, and the third conductor layer. Separate groups of the devices may be interconnected to form more complex circuits. The resulting circuit may be a very thin flex-circuit.

2. 发明申请

US20150228622A1 CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTEGRATED CIRCUIT, ASSEMBLY DEVICE, AND FABRICATION METHOD OF THREE-DIMENSIONAL INTEGRATED CIRCUIT 有权
标题翻译：芯片支持基板，芯片支持方法，三维集成电路，组装设备和三维集成电路的制造方法
公开(公告)号：US20150228622A1
公开(公告)日：2015-08-13
申请号：US14427232
申请日：2013-09-13
申请人： TOHOKU UNIVERSITY
发明人： Mitsumasa Koyanagi , Tetsu Tanaka , Takafumi Fukushima
IPC分类号： H01L25/065 , H01L23/498 , B23K20/00 , B23K20/16 , B23K20/02 , H01L25/00 , H01L23/00
CPC分类号： H01L25/0657 , B23K20/002 , B23K20/023 , B23K20/16 , H01L21/52 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/147 , H01L23/3121 , H01L23/32 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L23/50 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2221/68327 , H01L2221/68368 , H01L2221/68381 , H01L2223/5442 , H01L2223/54426 , H01L2224/1145 , H01L2224/1146 , H01L2224/13023 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75611 , H01L2224/75701 , H01L2224/75723 , H01L2224/75745 , H01L2224/75753 , H01L2224/75901 , H01L2224/81002 , H01L2224/81121 , H01L2224/81143 , H01L2224/81193 , H01L2224/81203 , H01L2224/8138 , H01L2224/81395 , H01L2224/81904 , H01L2224/81907 , H01L2224/83191 , H01L2224/8385 , H01L2224/83907 , H01L2224/9202 , H01L2224/95001 , H01L2224/95145 , H01L2224/95146 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06593 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/1461 , H01L2924/15311 , H01L2924/00012 , H01L2224/81 , H01L2924/00014 , H01L2924/01047 , H01L2924/014 , H01L2224/83 , H01L2224/11 , H01L2924/00 , H01L2224/67
摘要： The present invention relates to a chip support substrate including a lyophilic region 4 that is formed on the substrate and that absorbs a chip 3A, and an electrode 6 that is formed on the substrate and in the lyophilic region and that generates electrostatic force in the chip, and to a chip support method including the steps of arranging the chip onto the lyophilic region of the chip support substrate with a liquid 15, the chip support substrate comprising the lyophilic region that is formed on the substrate, and the electrode that is formed on the substrate and in the lyophilic region, and generating the electrostatic force in the chip corresponding to the electrode by applying a voltage to the electrode.
摘要翻译：本发明涉及一种芯片支撑基板，其包括形成在基板上并吸收芯片3A的亲液性区域4，以及形成在基板上和亲液区域中并在芯片中产生静电力的电极6 以及包括以下步骤的芯片支持方法，该方法包括以下步骤：利用液体15将芯片布置在芯片支撑基板的亲液区域上，芯片支撑基板包括形成在基板上的亲液区域，以及形成在基板上的电极衬底和在亲液区域中，并通过向电极施加电压而产生对应于电极的芯片中的静电力。

3. 发明申请

US20140261613A1 PHOTOELECTROCHEMICALLY DRIVEN SELF-ASSEMBLY 有权
标题翻译：光电化学自动组装
公开(公告)号：US20140261613A1
公开(公告)日：2014-09-18
申请号：US14061576
申请日：2013-10-23
申请人： Sandia Corporation
发明人： Gregory N. Nielson , Murat Okandan
IPC分类号： H01L31/18 , H01L31/05
CPC分类号： H01L31/0504 , H01L27/142 , H01L31/0475 , H01L31/1876 , H01L2224/95 , H01L2224/95085 , H01L2224/95145 , Y02E10/50 , Y02P70/521
摘要： Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate.
摘要翻译：本文描述的各种技术涉及将电子设备组装到微系统中。电子设备被设置在解决方案中。光可以应用于解决方案中的电子设备。电子设备可以响应于施加到溶液中的电子设备的光而产生电流，并且电流可以引起功能化电子设备表面上的区域的电化学反应。附加地或替代地，施加到解决方案中的电子设备的光可以使得电子设备产生电场，其可以使电子设备定向和/或引起电子设备相对于接收基板的移动。此外，接收基板上的电极可以被偏置以吸引并形成与具有表面上的官能化区域的电子设备的连接。微系统可以包括接收基板和连接到接收基板的电子设备。

4. 发明申请

US20130126081A1 METHOD OF FORMING A MICRO LED STRUCTURE AND ARRAY OF MICRO LED STRUCTURES WITH AN ELECTRICALLY INSULATING LAYER 有权
标题翻译：形成微型LED结构的方法和微型LED结构与电绝缘层的阵列
公开(公告)号：US20130126081A1
公开(公告)日：2013-05-23
申请号：US13436260
申请日：2012-03-30
申请人： Hsin-Hua Hu , Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law
发明人： Hsin-Hua Hu , Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law
IPC分类号： B32B38/10 , H01L33/46 , H01L33/60
CPC分类号： H01L33/08 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L27/156 , H01L33/0079 , H01L33/405 , H01L2224/7598 , H01L2224/83 , H01L2224/95145 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
摘要翻译：描述了将微器件和微器件阵列制造和传送到接收衬底的方法。在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。

5. 发明申请

US20130122633A1 METHOD FOR FABRICATING SOLAR CELL COMPRISING CONDENSER LENS AND PHOTOELECTRIC CONVERSION ELEMENT 有权
标题翻译：用于制造包含冷凝器透镜和光电转换元件的太阳能电池的方法
公开(公告)号：US20130122633A1
公开(公告)日：2013-05-16
申请号：US13724938
申请日：2012-12-21
申请人： PANASONIC CORPORATION
发明人： Hidekazu ARASE , Tohru NAKAGAWA
IPC分类号： H01L31/18
CPC分类号： H01L31/18 , G02B3/0056 , H01L31/02008 , H01L31/0504 , H01L31/052 , H01L31/0543 , H01L2224/95085 , H01L2224/95145 , H01L2924/10329 , Y02E10/52
摘要： The purpose of the present invention is to provide a method for disposing a photoelectric conversion element accurately on the focal point of a condenser lens.The method of the present invention comprises a step of forming a focal point on the reverse surface of the condenser lens to be a hydrophilic region, a step of removing the remained photoresist to obtain the condenser lens having the reverse surface where the hydrophilic region is surrounded by a water-repellent region formed of the fluoroalkylsilane film and a step of disposing the photoelectric conversion element on the hydrophilic region to obtain the solar cell comprising the condenser lens and the photoelectric conversion element.
摘要翻译：本发明的目的是提供一种将光电转换元件精确地设置在聚光透镜的焦点上的方法。本发明的方法包括在聚光镜的背面上形成作为亲水区域的焦点的步骤，除去残留的光致抗蚀剂以获得具有亲水区域被包围的相反表面的聚光透镜的步骤通过由氟代烷基硅烷膜形成的防水区域和将该光电转换元件设置在亲水区域上以获得包括聚光透镜和光电转换元件的太阳能电池的步骤。

6. 发明授权

US08399986B2 Method for performing parallel stochastic assembly 有权
标题翻译：执行并行随机组合的方法
公开(公告)号：US08399986B2
公开(公告)日：2013-03-19
申请号：US13072558
申请日：2011-03-25
申请人： Massimo Mastrangeli , Caroline Whelan , Wouter Ruythooren
发明人： Massimo Mastrangeli , Caroline Whelan , Wouter Ruythooren
IPC分类号： H01L23/34 , H01L21/00 , H05K3/20
CPC分类号： H01L25/50 , H01L24/80 , H01L24/95 , H01L2224/95085 , H01L2224/95101 , H01L2224/95145 , H01L2224/95146 , H01L2924/01019 , H01L2924/10253 , Y10T29/49128 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178 , H01L2924/00
摘要： A method of positioning at least 2 chips simultaneously on a substrate by parallel stochastic assembly in a first liquid is disclosed. In one aspect, the chips are directed to target sites on the substrate within the first liquid. The target sites are covered with a second liquid. The second liquid and the first liquid are immiscible. The chips are attracting the first liquid. A predetermined surface is chosen or treated on each chip such that it is selectively attracted by the second liquid and attracting the first liquid.
摘要翻译：公开了一种通过在第一液体中的平行随机组装将至少2个芯片同时定位在衬底上的方法。在一个方面，芯片被引导到第一液体内的基板上的目标位置。目标地点被第二液体覆盖。第二液体和第一液体是不混溶的。这些芯片吸引了第一批液体。在每个芯片上选择或处理预定表面，使得其被第二液体选择性地吸引并吸引第一液体。

7. 发明授权

US08390537B2 Method of assembling displays on substrates 有权
标题翻译：在基板上组装显示的方法
公开(公告)号：US08390537B2
公开(公告)日：2013-03-05
申请号：US12590720
申请日：2009-11-12
申请人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
发明人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
IPC分类号： G09G3/20
CPC分类号： G09F9/30 , G09F9/33 , G09G3/001 , H01L24/95 , H01L2224/95145 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： Various embodiments of methods and systems for designing and constructing displays from multiple light-modulating elements are disclosed. Display elements having different light-modulating and self-assembling characteristics may be used during display assembly and operation.
摘要翻译：公开了用于从多个光调制元件设计和构造显示器的方法和系统的各种实施例。可以在显示组装和操作期间使用具有不同光调制和自组装特性的显示元件。

8. 发明授权

US08389212B1 Method for the electronic analysis of a sample oligonucleotide sequence 失效
标题翻译：样品寡核苷酸序列的电子分析方法
公开(公告)号：US08389212B1
公开(公告)日：2013-03-05
申请号：US09358788
申请日：1999-07-22
申请人： Michael J. Heller , Eugene Tu
发明人： Michael J. Heller , Eugene Tu
IPC分类号： C07H21/04 , C12M1/00 , G01N27/00
CPC分类号： B01L3/5085 , B01J19/0046 , B01J19/0093 , B01J2219/00315 , B01J2219/00317 , B01J2219/00527 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00612 , B01J2219/00617 , B01J2219/00626 , B01J2219/00637 , B01J2219/00641 , B01J2219/00644 , B01J2219/00653 , B01J2219/00659 , B01J2219/00686 , B01J2219/00689 , B01J2219/00713 , B01J2219/0072 , B01J2219/00722 , B01J2219/00725 , B01J2219/00731 , B01L3/502707 , B01L2300/0636 , B01L2300/0645 , B01L2300/0829 , B01L2300/0877 , B01L2400/0421 , B82Y5/00 , B82Y10/00 , C07B2200/11 , C07H21/00 , C07K1/04 , C07K1/045 , C07K1/047 , C12Q1/6813 , C12Q1/6816 , C12Q1/6825 , C12Q1/6837 , C40B40/06 , C40B40/10 , C40B40/12 , C40B60/14 , G01N27/3276 , G11C13/0014 , G11C13/0019 , G11C19/00 , H01L24/95 , H01L25/50 , H01L29/6656 , H01L29/6659 , H01L29/66628 , H01L29/7834 , H01L2224/45124 , H01L2224/45144 , H01L2224/95085 , H01L2224/95145 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12033 , H01L2924/12043 , H01L2924/15788 , Y10S435/808 , Y10S435/814 , Y10S436/805 , Y10T436/25125 , C12Q2565/515 , C12Q2565/607 , H01L2924/00 , H01L2224/48
摘要： A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats. These reactions include nucleic acid hybridization, antibody/antigen reaction, diagnostics, and biopolymer synthesis. The device can be fabricated using both microlithographic and micro-machining techniques. The device can electronically control the transport and attachment of specific binding entities to specific micro-locations. The specific binding entities include molecular biological molecules such as nucleic acids and polypeptides. The device can subsequently control the transport and reaction of analytes or reactants at the addressed specific micro-locations. The device is able to concentrate analytes and reactants, remove non-specifically bound molecules, provide stringency control for DNA hybridization reactions, and improve the detection of analytes. The device can be electronically replicated.
摘要翻译：设计制造了一种自寻址的自组装微电子器件，主动执行和控制微步形式的多步分子生物反应。这些反应包括核酸杂交，抗体/抗原反应，诊断和生物聚合物合成。该器件可以使用微光刻和微加工技术制造。该设备可以电子控制特定绑定实体到特定微位置的传输和附着。特异性结合实体包括分子生物学分子，例如核酸和多肽。该装置随后可以控制分析物或反应物在寻址的特定微位置的转运和反应。该装置能够浓缩分析物和反应物，去除非特异性结合的分子，为DNA杂交反应提供严格控制，并改善分析物的检测。该设备可以电子复制。

9. 发明授权

US08382544B2 Method of repairing a display assembled on a substrate 有权
标题翻译：修复组装在基板上的显示器的方法
公开(公告)号：US08382544B2
公开(公告)日：2013-02-26
申请号：US13134269
申请日：2011-06-02
申请人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
发明人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
IPC分类号： F23Q23/08
CPC分类号： G09F9/30 , G09F21/02 , H01L24/95 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/00
摘要： Various embodiments of methods and systems for designing and constructing displays from multiple light-modulating elements are disclosed. Display elements having different light-modulating and self-assembling characteristics may be used during display assembly and operation.
摘要翻译：公开了用于从多个光调制元件设计和构造显示器的方法和系统的各种实施例。可以在显示组装和操作期间使用具有不同光调制和自组装特性的显示元件。

10. 发明授权

US08300007B2 Self assembling display with substrate 有权
标题翻译：自组装显示与基板
公开(公告)号：US08300007B2
公开(公告)日：2012-10-30
申请号：US11497793
申请日：2006-08-02
申请人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
发明人： W. Daniel Hillis , Nathan P. Myhrvold , Clarence T. Tegreene , Lowell L. Wood, Jr. , Victoria Y. H. Wood
IPC分类号： G09G3/34 , G09G3/30
CPC分类号： G09F9/30 , G09F21/02 , H01L24/95 , H01L2224/95145 , H01L2924/12041 , H01L2924/14 , H01L2924/00
摘要： Various embodiments of methods and systems for designing and constructing displays from multiple light-modulating elements are disclosed. Display elements having different light-modulating and self-assembling characteristics may be used during display assembly and operation.
摘要翻译：公开了用于从多个光调制元件设计和构造显示器的方法和系统的各种实施例。可以在显示组装和操作期间使用具有不同光调制和自组装特性的显示元件。

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