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    • 1. 发明授权
    • Method and apparatus for detecting endpoint during plasma etching of thin films
    • 用于在薄膜等离子体蚀刻期间检测端点的方法和装置
    • US06908846B2
    • 2005-06-21
    • US10401114
    • 2003-03-27
    • Brian K. McMillinEric HudsonJeffrey Marks
    • Brian K. McMillinEric HudsonJeffrey Marks
    • H01L21/311H01L21/66H01L21/768H01L21/4763H01L21/302H01L23/48
    • H01L21/76829H01J37/32963H01L21/31116H01L21/31138H01L21/76801H01L21/76807H01L22/26
    • A method for controlling a plasma etch process while etching a layer stack having a first layer disposed above an end-point generating layer is disclosed. The method includes etching through the first layer and at least partially through the end-point generating layer while monitoring an absorption rate of a light beam traversing an interior portion of the plasma processing chamber, wherein the end-point generating layer is selected from a material that produces a detectable change in the absorption rate when etched. The end-point generating layer is characterized by at least one of a first characteristic and a second characteristic. The first characteristic is an insufficient thickness to function as an etch stop layer, and the second characteristic is an insufficient selectivity to etchants employed to etch through the first layer to function as the etch stop layer. The method additionally includes generating an end-point signal upon detecting the detectable change.
    • 公开了一种用于在蚀刻具有设置在端点产生层上方的第一层的层堆叠的同时控制等离子体蚀刻工艺的方法。 该方法包括:在监测穿过等离子体处理室的内部部分的光束的吸收率的同时,蚀刻穿过第一层并且至少部分地穿过端点产生层,其中端点产生层选自材料 其在蚀刻时产生可检测的吸收速率变化。 端点产生层的特征在于第一特征和第二特性中的至少一个。 第一特征是不足以用作蚀刻停止层的厚度,并且第二特性对于用于蚀刻通过第一层以用作蚀刻停止层的蚀刻剂的选择性不足。 该方法还包括在检测到可检测变化时产生端点信号。
    • 8. 发明申请
    • Electronic Knob for Tuning Radial Etch Non-Uniformity at VHF Frequencies
    • 用于调谐VHF频率径向蚀刻非均匀性的电子旋钮
    • US20140054268A1
    • 2014-02-27
    • US13594768
    • 2012-08-24
    • Zhigang ChenEric Hudson
    • Zhigang ChenEric Hudson
    • H05H1/46B44C1/22
    • H01L21/70H01J37/32091H01J37/32183
    • System and methods for plasma processing of a wafer include a chamber with an electrode having a support surface and an outer edge region defined thereon. A radio frequency power is communicated to the electrode via a conductive delivery connection and returned through a conductive return connection. A capacitance is applied to a first end that causes appropriate capacitive adjustment and opposite impedance adjustment at a second end of the conductive delivery connection that is coupled to a dielectric surround structure that surrounds the electrode. The dielectric surround structure presents the opposite impedance adjustment near an outer edge of the electrode, such that increasing the capacitance at the first end causes a corresponding increase of impedance at the second end and a corresponding increase in voltage distribution near the outer edge region of the electrode that decreases toward a center of the support surface of the electrode.
    • 用于等离子体处理晶片的系统和方法包括具有电极的室,其具有支撑表面和限定在其上的外边缘区域。 射频功率通过导电输送连接传送到电极,并通过导电返回连接返回。 电容被施加到第一端,其导致适当的电容调整,并且在导电输送连接的第二端处相反阻抗调节,该第二端耦合到围绕电极的电介质环绕结构。 电介质环绕结构在电极的外边缘附近呈现相反的阻抗调节,使得增加第一端处的电容导致在第二端处的阻抗相应增加,并且在外部边缘区域附近的电压分布相应增加 电极朝向电极的支撑表面的中心减小。
    • 9. 发明授权
    • Tunable uniformity in a plasma processing system
    • 等离子体处理系统的可调均匀性
    • US08635971B2
    • 2014-01-28
    • US11393753
    • 2006-03-31
    • Eric Hudson
    • Eric Hudson
    • C23C16/00C23F1/00H01L21/306H05H1/00
    • H01J37/32082H01J37/32321H01J37/32339
    • A method of tuning the uniformity of a plasma with a large sheath potential by locally affecting the density of a plasma is provided. The method comprises illuminating a body exposed to the plasma with electromagnetic radiation from a source, wherein the body and the source are cooperatively configured such that the body will generate photoelectrons upon exposure to the radiation from the source. An example of such electromagnetic radiation is vacuum ultraviolet light, and an example of such a body is the edge ring surrounding a semiconductor substrate. Photoelectrons emitted from the edge ring, captured by the plasma, and accelerated into the plasma with sufficient energy to cause ionization, locally increase plasma density. The source of radiation can be a plurality of discrete sources or one or more extended sources. The source can be arranged to provide substantively uniform illumination, or can illuminate according to a non-uniform intensity distribution to compensate for existing non-uniformities in the plasma density or in the plasma process. Such sources can be embedded in the inner or outer electrode part of a multi-piece showerhead electrode assembly, or elsewhere in the chamber.
    • 提供了通过局部影响等离子体的密度来调整具有大鞘电位的等离子体的均匀性的方法。 该方法包括用来自源的电磁辐射来照射暴露于等离子体的物体,其中主体和源被协同地配置,使得当暴露于来自源的辐射时,主体将产生光电子。 这种电磁辐射的一个例子是真空紫外线,这样的一个实例是包围半导体衬底的边缘环。 从边缘环发射的光电子由等离子体捕获并以足够的能量加速到等离子体中以引起电离,局部地增加等离子体密度。 辐射源可以是多个离散源或一个或多个扩展源。 源可以被布置为提供实质上均匀的照明,或者可以根据不均匀的强度分布照亮以补偿等离子体密度或等离子体处理中现有的不均匀性。 这样的源可以嵌入在多件式喷头电极组件的内部或外部电极部分中,或者室内的其他地方。