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    • 2. 发明授权
    • Methods and apparatuses for effectively reducing gas residence time in a plasma processing chamber
    • 有效减少等离子体处理室中气体停留时间的方法和装置
    • US09299541B2
    • 2016-03-29
    • US13436728
    • 2012-03-30
    • Andreas Fischer
    • Andreas Fischer
    • H01J37/32
    • H01J37/32972
    • Methods and apparatuses for controlling plasma generation in a plasma processing chamber to reduce an effective residence time of by-product gases or to control in real time the concentration of certain polymer pre-cursors or reaction by-products in the plasma processing chamber are disclosed. The gas residence time is “effectively” reduced by reducing the plasma reaction for at least a portion of the process time. Thresholds can be provided to control when the plasma reaction is permitted to proceed at the full rate and when the plasma reaction is permitted to proceed at the reduced rate. By reducing the rate of plasma by-product generation at least for a portion of the process time, the by-product gas residence time may be effectively reduced to improve process results.
    • 公开了用于控制等离子体处理室中的等离子体产生以减少副产物气体的有效停留时间或实时控制等离子体处理室中某些聚合物前体或反应副产物的浓度的方法和装置。 通过在处理时间的至少一部分减少等离子体反应,“有效地”减少气体停留时间。 可以提供阈值以控制何时允许血浆反应以全速进行,并且允许血浆反应以降低的速率进行。 通过至少在一部分处理时间内降低等离子体副产物产生速率,可以有效地减少副产物气体停留时间以改善工艺结果。
    • 9. 发明授权
    • Plasma confinement structures in plasma processing systems and methods thereof
    • 等离子体处理系统中的等离子体约束结构及其方法
    • US08677590B2
    • 2014-03-25
    • US14022111
    • 2013-09-09
    • Eric HudsonAndreas Fischer
    • Eric HudsonAndreas Fischer
    • C23F1/00H01L21/306C23C16/50C23C16/509B25B27/14C23C16/06C23C16/22
    • C23C16/00C23F1/00H01J37/32082H01J37/32623
    • A method for manufacturing a plasma processing system is provided. The method includes providing a movable plasma-facing structure configured to surround a plasma that is generated during processing of a substrate. The method also includes disposing a movable electrically conductive structure outside of the movable plasma-facing structure, wherein both structures configured to be deployed and retracted as a single unit to facilitate handling of the substrate. The movable electrically conductive structure is radio frequency (RF) grounded during the plasma processing. During processing, the RF current from the plasma flows to the movable electrically conductive structure through the movable plasma-facing structure during the plasma processing. The method further includes coupling a set of conductive straps to the movable electrically conductive structure. The set of conductive straps accommodates the movable electrically conductive structure when it is deployed and retracted while providing the RF current a low impedance path to ground.
    • 提供了一种制造等离子体处理系统的方法。 该方法包括提供构造成围绕在衬底的处理期间产生的等离子体的可移动等离子体面向结构。 该方法还包括将可移动导电结构设置在可移动等离子体面向结构的外部,其中两个结构构造成作为单个单元展开和缩回以便于处理基板。 可移动导电结构是在等离子体处理期间接地的射频(RF)。 在处理期间,等离子体处理期间来自等离子体的RF电流通过可移动等离子体面向结构流动到可移动导电结构。 该方法还包括将一组导电带耦合到可移动导电结构。 一组导电带在展开和缩回时容纳可移动的导电结构,同时为RF电流提供一个低阻抗地线路径。
    • 10. 发明授权
    • Combined wafer area pressure control and plasma confinement assembly
    • 组合晶圆面积压力控制和等离子体约束组件
    • US08627783B2
    • 2014-01-14
    • US12361490
    • 2009-01-28
    • Andreas FischerAkira Koshiishi
    • Andreas FischerAkira Koshiishi
    • C23C16/455C23C16/50C23C16/505C23F1/00H01L21/306C23C16/06C23C16/22
    • H01J37/32642H01J37/32449H01J37/32623
    • A combined pressure control/plasma confinement assembly configured for confining a plasma and for at least partially regulating pressure in a plasma processing chamber during plasma processing of a substrate is provided. The assembly includes a movable plasma confinement structure having therein a plurality of perforations and configured to surround the plasma when deployed. The assembly also includes a movable pressure control structure disposed outside of the movable plasma confinement structure such that the movable plasma confinement structure is disposed between the plasma and the movable pressure control structure during the plasma processing, the movable pressure control structure being deployable and retractable along with the movable plasma confinement structure to facilitate handling of the substrate, the movable pressure control structure being independently movable relative to the movable plasma confinement structure to regulate the pressure by blocking at least a portion of the plurality of perforations.
    • 提供了一种组合的压力控制/等离子体限制组件,其被配置为限制等离子体并且用于在等离子体处理室中等离子体处理室中至少部分地调节压力。 组件包括可移动的等离子体限制结构,其中具有多个穿孔并且构造成在展开时包围等离子体。 组件还包括可移动压力控制结构,其设置在可移动等离子体限制结构的外部,使得等离子体约束结构在等离子体处理期间设置在等离子体和可移动压力控制结构之间,可移动压力控制结构可以沿着可展开和缩回 利用可移动的等离子体约束结构以便于处理衬底,可移动压力控制结构可相对于可移动等离子体限制结构独立地移动,以通过阻挡多个穿孔的至少一部分来调节压力。