专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050020001A1 Selective treatment of the surface of a microelectronic workpiece 审中-公开
标题翻译：选择性处理微电子工件的表面
公开(公告)号：US20050020001A1
公开(公告)日：2005-01-27
申请号：US10927259
申请日：2004-08-25
申请人： Brian Aegerter , Curt Dundas , Michael Jolley , Tom Ritzdorf , Steven Peace , Gary Curtis , Raymon Thompson
发明人： Brian Aegerter , Curt Dundas , Michael Jolley , Tom Ritzdorf , Steven Peace , Gary Curtis , Raymon Thompson
IPC分类号： H01L21/00 , H01L21/3213 , H01L21/8238
CPC分类号： H01L21/67017 , H01L21/32134 , H01L21/6708
摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral-margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.
摘要翻译：在用于处理诸如半导体晶片的工件的处理中，处理流体被选择性地从工件的前侧或后侧中的至少一个的外周边缘施加或排除。通过在工件和保持工件的反应器旋转的同时将一种或多种加工流体施加到工件来发生加工流体的排除和/或应用。处理流体的流量，流体压力和/或旋转速率用于控制从外周边缘选择性地施加或排除处理流体的程度。

2. 发明申请

US20050233589A1 Processes for removing residue from a workpiece 审中-公开
标题翻译：从工件上清除残留物的工艺
公开(公告)号：US20050233589A1
公开(公告)日：2005-10-20
申请号：US11151896
申请日：2005-06-14
申请人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
发明人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
IPC分类号： B08B3/00 , B44C1/22 , H01L21/00 , H01L21/302 , H01L21/311 , H01L21/3213
CPC分类号： H01L21/31111 , H01L21/32134 , H01L21/67051 , H01L21/6708
摘要： In a process for removing etch residue, liquid including an acid and an oxidizer is applied to the back side and peripheral edge of a wafer. The front or device side of the wafer is left unprocessed, or may be exposed to an inert fluid such as a purge gas (e.g., nitrogen or helium), to a rinse such as deionized water, or to another processing fluid such as a more highly diluted etchant. The front side of the wafer is either left unprocessed, or is processed to a lesser degree without damage to the underlying devices, metal interconnects or semiconductor layers.
摘要翻译：在去除蚀刻残留物的方法中，将包含酸和氧化剂的液体施加到晶片的背面和周缘。晶片的前部或装置侧未被处理，或者可以暴露于诸如清除气体（例如氮气或氦气）的惰性流体到漂洗液如去离子水，或者暴露于另一种处理流体，例如更多高度稀释的蚀刻剂。晶片的前侧要么是未加工的，要么被加工程度较小，而不会损坏底层器件，金属互连或半导体层。

3. 发明申请

US20060070638A1 Methods and apparatus for rinsing and drying 有权
标题翻译：冲洗和干燥的方法和设备
公开(公告)号：US20060070638A1
公开(公告)日：2006-04-06
申请号：US11292823
申请日：2005-12-02
申请人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
发明人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
IPC分类号： B08B3/00 , B08B7/00
CPC分类号： H01L21/67051 , B08B3/02 , H01L21/67028
摘要： A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.
摘要翻译：用于冲洗和干燥工件的方法包括将工件放置在室中并旋转工件。冲洗流体例如水通过腔室中的第一出口施加到工件上，漂洗流体通过离心力向外移动到工件的边缘，以冲洗工件。干燥流体，例如醇蒸汽，通过第一出口施加到工件上，干燥流体通过离心力向外移动到工件的边缘，以干燥工件。干燥流体有利地沿着穿过工件表面的冲洗流体的弯液面。冲洗流体或干燥流体或两种流体可以施加在工件的中心区域附近或其附近。

4. 发明申请

US20050217707A1 Selective processing of microelectronic workpiece surfaces 审中-公开
标题翻译：微电子工件表面的选择性处理
公开(公告)号：US20050217707A1
公开(公告)日：2005-10-06
申请号：US11133909
申请日：2005-05-21
申请人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
发明人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
IPC分类号： B08B3/00 , B44C1/22 , H01L21/00 , H01L21/302 , H01L21/311 , H01L21/3213
CPC分类号： H01L21/31111 , H01L21/32134 , H01L21/67051 , H01L21/6708
摘要： A processing fluid is selectively applied or excluded from an outer peripheral margin of the front side, back side, or both sides of a workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece is spinning. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.
摘要翻译：从工件的前侧，后侧或两侧的外周边缘选择性地施加或排除处理流体。处理流体的排除和/或应用是通过在工件旋转时将一种或多种加工流体施加到工件而发生的。使用一种或多种加工流体的流量，流体压力和/或旋转速率来控制从外周边缘选择性地施加或排除处理流体的程度。

5. 发明申请

US20050032391A1 Method for processing a semiconductor wafer 审中-公开
标题翻译：半导体晶片的处理方法
公开(公告)号：US20050032391A1
公开(公告)日：2005-02-10
申请号：US10941346
申请日：2004-09-14
申请人： Steven L. Peace , Gary Curtis , Raymon Thompson , Brian Aegerter , Curt Dundas
发明人： Steven L. Peace , Gary Curtis , Raymon Thompson , Brian Aegerter , Curt Dundas
IPC分类号： H01L21/306 , B08B3/04 , H01L21/00 , H01L21/3213 , H01L21/302 , H01L21/461
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
摘要翻译：用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。晶片支撑在转子之间。转子由旋转电机旋转。处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。流体向外均匀地向各个方向流动。晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

6. 发明授权

US07102763B2 Methods and apparatus for processing microelectronic workpieces using metrology 有权
公开(公告)号：US07102763B2
公开(公告)日：2006-09-05
申请号：US09902491
申请日：2001-07-09
申请人： Thomas L. Ritzdorf , Steve L. Eudy , Gregory J. Wilson , Paul R. McHugh , Robert A. Weaver , Brian Aegerter , Curt Dundas , Steven L. Peace
发明人： Thomas L. Ritzdorf , Steve L. Eudy , Gregory J. Wilson , Paul R. McHugh , Robert A. Weaver , Brian Aegerter , Curt Dundas , Steven L. Peace
IPC分类号： G01B11/28 , H01L21/306 , B05C11/00
CPC分类号： H01L21/67173 , H01L21/67103 , H01L21/67178 , H01L21/6719 , H01L21/67219 , H01L21/6723 , H01L21/67751
摘要： A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.

7. 发明授权

US06774056B2 Sonic immersion process system and methods 失效
标题翻译：声波沉浸工艺系统及方法
公开(公告)号：US06774056B2
公开(公告)日：2004-08-10
申请号：US10200043
申请日：2002-07-19
申请人： Jon Kuntz , Steven Peace , Ed Derks , Brian Aegerter
发明人： Jon Kuntz , Steven Peace , Ed Derks , Brian Aegerter
IPC分类号： H01L2131
CPC分类号： H01L21/68785 , H01L21/67057 , H01L21/67086 , H01L21/6715 , Y10S414/135 , Y10S414/136 , Y10S414/14 , Y10S438/906 , Y10S438/913
摘要： A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.
摘要翻译：用于处理半导体晶片或其它类似的平坦工件的处理系统具有包括工件保持器的头部。头部的电机旋转工件。头部升降器降低头部以将工件移动到碗中的液体浴中。声能被引入到液体中并通过液体传送到工件，以帮助加工。抬起头部以使工件进入冲洗位置。浴液被排出。工件通过基座中的径向喷嘴冲洗。头部被抬起到干燥的位置。往复摇摆臂将干燥流体喷射到旋转晶片的底表面上，以干燥晶片。

8. 发明授权

US06413436B1 Selective treatment of the surface of a microelectronic workpiece 有权
公开(公告)号：US06413436B1
公开(公告)日：2002-07-02
申请号：US09437926
申请日：1999-11-10
申请人： Brian Aegerter , Curt T. Dundas , Michael Jolley , Tom L. Ritzdorf , Steven L. Peace , Gary L. Curtis , Raymon F. Thompson
发明人： Brian Aegerter , Curt T. Dundas , Michael Jolley , Tom L. Ritzdorf , Steven L. Peace , Gary L. Curtis , Raymon F. Thompson
IPC分类号： C23F102
CPC分类号： H01L21/67017 , C23F1/18 , H01L21/32134 , H01L21/6708 , Y10S438/928 , Y10S438/963
摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

9. 发明申请

US20060118132A1 Cleaning with electrically charged aerosols 审中-公开
标题翻译：用带电气溶胶清洗
公开(公告)号：US20060118132A1
公开(公告)日：2006-06-08
申请号：US11005553
申请日：2004-12-06
申请人： Eric Bergman , Dana Scranton , Brian Aegerter
发明人： Eric Bergman , Dana Scranton , Brian Aegerter
IPC分类号： B08B3/12 , B08B3/00
CPC分类号： B08B3/02 , B08B3/10 , B08B3/12 , B08B2203/0288 , H01L21/02052 , H01L21/67051
摘要： In a method for cleaning a wafer, the wafer is placed a processing chamber. A layer or film of liquid is provided on the wafer. Electrically charged aerosol droplets of a liquid are formed and directed to the workpiece. The charged aerosol particles accumulate on the workpiece. This creates an electrical charge on the workpiece. Contaminant particles on the workpiece are released and/or repelled by the electrical charge and are carried away in the liquid layer. The liquid layer is optionally continuously replenished with fresh liquid. The liquid layer may be thinned out in a localized aerosol impingement area, via a jet of gas, to allow the electrical charge of the aerosol to better collect on or near the surface of the workpiece.
摘要翻译：在清洁晶片的方法中，将晶片放置在处理室中。在晶片上设置一层或多层液体。形成液体的带电气溶胶液滴并将其导向工件。带电气溶胶颗粒聚集在工件上。这会在工件上产生电荷。工件上的污染物颗粒被电荷释放和/或排斥，并在液体层中被带走。任选地用新鲜液体连续补充液体层。液体层可以通过气体喷射在局部气溶胶冲击区域中变薄，以允许气溶胶的电荷更好地收集在工件的表面上或附近。

10. 发明申请

US20070000527A1 Workpiece support for use in a process vessel and system for treating microelectronic workpieces 审中-公开
标题翻译：用于处理微电子工件处理容器和系统的工件支架
公开(公告)号：US20070000527A1
公开(公告)日：2007-01-04
申请号：US11172162
申请日：2005-06-30
申请人： Brian Aegerter , Daniel Woodruff , Coby Grove , Gregory Wilson
发明人： Brian Aegerter , Daniel Woodruff , Coby Grove , Gregory Wilson
IPC分类号： B08B3/00
CPC分类号： H01L21/68728 , H01L21/67173 , H01L21/6719 , H01L21/67751 , H01L21/68785
摘要： A workpiece support apparatus for use in a process vessel and process system for treating semiconductor workpieces. The process vessel is to be utilized in an integrated tool for wet chemical treatment of a semiconductor workpiece. The workpiece support apparatus includes a rotor having a central cavity and guide pins mounted at an outer perimeter. A workpiece support having extendable workpiece support fingers is connected to the rotor. The extendable workpiece support fingers are moveable from a first position to a second position. A bellows seal connects the workpiece support to the rotor. A fluid delivery tube is positioned in the central cavity of the rotor and connected to a supply of fluid. When the extendable workpiece support fingers are in the first position, the guide pins of the rotor cannot interfere with the loading of a workpiece onto the extendable workpiece support fingers, and when the extendable workpiece support fingers are in the second position, a pressurized fluid is delivered through the delivery tube to create a low pressure region adjacent an inner surface of the workpiece, lifting the workpiece off the extendable workpiece support fingers, exposing the entire backside of the workpiece for processing.
摘要翻译：用于处理容器的工件支撑装置和用于处理半导体工件的处理系统。该处理容器用于半导体工件的湿化学处理的集成工具中。工件支撑装置包括具有安装在外周的中心腔和导销的转子。具有可延伸的工件支撑指的工件支撑件连接到转子。可伸展工件支撑指可从第一位置移动到第二位置。波纹管密封将工件支撑件连接到转子。流体输送管定位在转子的中心空腔中并连接到流体供应源。当可延伸的工件支撑指状件处于第一位置时，转子的引导销不会干扰工件对可延伸的工件支撑指的加载，并且当可延伸的工件支撑指状件处于第二位置时，加压流体是通过输送管输送以产生邻近工件的内表面的低压区域，将工件从可延伸的工件支撑指状物上提起，暴露工件的整个背面进行处理。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式