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1. 发明授权

US06413436B1 Selective treatment of the surface of a microelectronic workpiece 有权
公开(公告)号：US06413436B1
公开(公告)日：2002-07-02
申请号：US09437926
申请日：1999-11-10
申请人： Brian Aegerter , Curt T. Dundas , Michael Jolley , Tom L. Ritzdorf , Steven L. Peace , Gary L. Curtis , Raymon F. Thompson
发明人： Brian Aegerter , Curt T. Dundas , Michael Jolley , Tom L. Ritzdorf , Steven L. Peace , Gary L. Curtis , Raymon F. Thompson
IPC分类号： C23F102
CPC分类号： H01L21/67017 , C23F1/18 , H01L21/32134 , H01L21/6708 , Y10S438/928 , Y10S438/963
摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

2. 发明授权

US06447633B1 Reactor for processing a semiconductor wafer 有权
公开(公告)号：US06447633B1
公开(公告)日：2002-09-10
申请号：US09710530
申请日：2000-11-09
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： C28F102
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

3. 发明授权

US06692613B2 Reactor for processing a semiconductor wafer 失效
标题翻译：用于处理半导体晶片的反应器
公开(公告)号：US06692613B2
公开(公告)日：2004-02-17
申请号：US10223974
申请日：2002-08-20
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： H01L2348
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
摘要翻译：用于处理半导体晶片或类似物品的方法包括在旋转晶片时旋转晶片并将其施加到晶片的第一侧的步骤。流体通过离心力在晶片的第一侧上在所有方向上径向向外流动。当流体从晶片的圆周边缘流出时，其被包含在环形储存器中，使得流体也流到晶片的第二侧的外部环形区域。开口允许流体从储存器流出。开口限定分流线的位置，超过该分隔线，流体不会在晶片的第二侧上行进。用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。晶片支撑在转子之间。转子由旋转电机旋转。处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。流体向外均匀地向各个方向流动。晶片支架自动提升晶片，从而当转子在加工后彼此分离时，可以通过机器人将其从反应器中移除。

4. 发明授权

US06423642B1 Reactor for processing a semiconductor wafer 有权
公开(公告)号：US06423642B1
公开(公告)日：2002-07-23
申请号：US09437711
申请日：1999-11-10
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： H01L21311
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

5. 发明授权

US06794291B2 Reactor for processing a semiconductor wafer 有权
标题翻译：用于处理半导体晶片的反应器
公开(公告)号：US06794291B2
公开(公告)日：2004-09-21
申请号：US10202074
申请日：2002-07-23
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： H01L21311
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
摘要翻译：用于处理半导体晶片或类似物品的设备包括具有由上下转子形成的处理室的反应器。晶片支撑在转子之间。转子由旋转电机旋转。处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。流体向外均匀地向各个方向流动。晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

6. 发明授权

US06900132B2 Single workpiece processing system 失效
标题翻译：单工件加工系统
公开(公告)号：US06900132B2
公开(公告)日：2005-05-31
申请号：US10691688
申请日：2003-10-22
申请人： Raymon F. Thompson , Jeffry A. Davis , Randy Harris , Dana R. Scranton , Ryan Pfeifle , Steven A. Peace , Brian Aegerter
发明人： Raymon F. Thompson , Jeffry A. Davis , Randy Harris , Dana R. Scranton , Ryan Pfeifle , Steven A. Peace , Brian Aegerter
IPC分类号： H01L21/00 , H01L21/3213 , H01L21/311
CPC分类号： H01L21/6715 , H01L21/32134 , H01L21/67017 , H01L21/6708 , Y10S438/913
摘要： A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.
摘要翻译：用于处理半导体晶片的系统在框架的台面上具有处理单元。过程单元和甲板具有精确的定位特征，例如锥形销，用于将处理单元精确地定位在甲板上。可以拆卸加工单元并安装在甲板上的更换过程单元，而无需重新校准装载/卸载机器人。这减少了更换过程单元并重新启动处理操作所需的时间。通过将未使用的液体从供应管线中抽出并将其抽回储存器来减少加工过程中的液体化学品消耗。

7. 发明授权

US06666922B2 System for processing a workpiece 失效
公开(公告)号：US06666922B2
公开(公告)日：2003-12-23
申请号：US09921845
申请日：2001-08-02
申请人： Gary L Curtis , Raymon F. Thompson
发明人： Gary L Curtis , Raymon F. Thompson
IPC分类号： C23C1600
CPC分类号： H01L21/67017 , B08B3/04 , H01L21/32134 , H01L21/6708 , Y10S134/902
摘要： An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a substantially closed processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. Multiple housings may be vertically stacked and rotated about a common rotation axis to simultaneously process multiple workpieces in a small space.

8. 发明授权

US06622737B2 Micro-environment chamber and system for rinsing and drying a semiconductor workpiece 有权
公开(公告)号：US06622737B2
公开(公告)日：2003-09-23
申请号：US10217716
申请日：2002-08-13
申请人： Gary L. Curtis , Raymon F. Thompson
发明人： Gary L. Curtis , Raymon F. Thompson
IPC分类号： B08B304
CPC分类号： H01L21/67017 , B08B3/04 , H01L21/32134 , H01L21/67075 , H01L21/6708 , Y10S134/902
摘要： In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

9. 发明授权

US06264752B1 Reactor for processing a microelectronic workpiece 失效
标题翻译：用于处理微电子工件的反应器
公开(公告)号：US06264752B1
公开(公告)日：2001-07-24
申请号：US09113435
申请日：1998-07-10
申请人： Gary L. Curtis , Raymon F. Thompson
发明人： Gary L. Curtis , Raymon F. Thompson
IPC分类号： C23L1600
CPC分类号： H01L21/67017 , B08B3/04 , H01L21/32134 , H01L21/6708
摘要： An apparatus for processing a microelectronic workpiece in a micro-environment is set forth. The apparatus includes a first chamber member having an interior chamber wall and a second chamber member having an interior chamber wall. The first and second chamber members are adapted for relative movement between a loading position in which the first and second chamber members are distal one another and a processing position in which the first and second chamber members are proximate one another to define a processing chamber. At least one workpiece support assembly is disposed between the first and second chamber members for supporting the microelectronic workpiece. The workpiece support assembly is operable to space the workpiece a first distance, x1, from an interior chamber wall of at least one of the first and second chamber members when the first and second chamber members are in the loading position and to space the workpiece a second distance, x2, from the interior chamber wall when the first and second chamber members are in the processing position, wherein x1>x2.
摘要翻译：阐述了在微环境中处理微电子工件的装置。该装置包括具有内部室壁的第一室构件和具有内部室壁的第二室构件。第一和第二室构件适于在第一和第二室构件彼此远离的装载位置和第一和第二室构件彼此靠近以限定处理室的处理位置之间的相对运动。至少一个工件支撑组件设置在第一和第二室构件之间，用于支撑微电子工件。工件支撑组件可操作以当第一和第二室构件处于装载位置时将工件与第一和第二室构件中的至少一个室内构件的内室壁隔开第一距离x1，并使工件空间第二距离x2，当第一和第二腔室构件处于加工位置时，其中x1> x2。

10. 发明授权

US5678320A Semiconductor processing systems 失效
标题翻译：半导体处理系统
公开(公告)号：US5678320A
公开(公告)日：1997-10-21
申请号：US415240
申请日：1995-04-03
申请人： Raymon F. Thompson , Robert W. Berner , Gary L. Curtis , Stephen P. Culliton , Blaine G. Wright
发明人： Raymon F. Thompson , Robert W. Berner , Gary L. Curtis , Stephen P. Culliton , Blaine G. Wright
IPC分类号： B65G49/07 , H01L21/00 , H01L21/673 , H01L21/677 , F26B17/24
CPC分类号： H01L21/67781 , H01L21/67173 , H01L21/67313 , H01L21/67326 , H01L21/67742 , H01L21/67754 , H01L21/67769 , H01L21/67772 , H01L21/67775 , H01L21/67778 , Y10S134/902 , Y10S414/138 , Y10S414/14 , Y10S414/141
摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.
摘要翻译：用于处理诸如集成电路晶片，平板显示器，半导体衬底和数据盘的半导体产品的处理器。处理器具有接收物品载体中的物品的接口部分。接口部分将物品从载体转移到处理阵列中。具有自动臂组件的输送机将物品阵列移动到处理站之间和处理站之间。处理站从与接口部分相邻的封闭区域进行访问。

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