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1. 发明授权

US07102763B2 Methods and apparatus for processing microelectronic workpieces using metrology 有权
公开(公告)号：US07102763B2
公开(公告)日：2006-09-05
申请号：US09902491
申请日：2001-07-09
申请人： Thomas L. Ritzdorf , Steve L. Eudy , Gregory J. Wilson , Paul R. McHugh , Robert A. Weaver , Brian Aegerter , Curt Dundas , Steven L. Peace
发明人： Thomas L. Ritzdorf , Steve L. Eudy , Gregory J. Wilson , Paul R. McHugh , Robert A. Weaver , Brian Aegerter , Curt Dundas , Steven L. Peace
IPC分类号： G01B11/28 , H01L21/306 , B05C11/00
CPC分类号： H01L21/67173 , H01L21/67103 , H01L21/67178 , H01L21/6719 , H01L21/67219 , H01L21/6723 , H01L21/67751
摘要： A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.

2. 发明申请

US20050032391A1 Method for processing a semiconductor wafer 审中-公开
标题翻译：半导体晶片的处理方法
公开(公告)号：US20050032391A1
公开(公告)日：2005-02-10
申请号：US10941346
申请日：2004-09-14
申请人： Steven L. Peace , Gary Curtis , Raymon Thompson , Brian Aegerter , Curt Dundas
发明人： Steven L. Peace , Gary Curtis , Raymon Thompson , Brian Aegerter , Curt Dundas
IPC分类号： H01L21/306 , B08B3/04 , H01L21/00 , H01L21/3213 , H01L21/302 , H01L21/461
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
摘要翻译：用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。晶片支撑在转子之间。转子由旋转电机旋转。处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。流体向外均匀地向各个方向流动。晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

3. 发明申请

US20050233589A1 Processes for removing residue from a workpiece 审中-公开
标题翻译：从工件上清除残留物的工艺
公开(公告)号：US20050233589A1
公开(公告)日：2005-10-20
申请号：US11151896
申请日：2005-06-14
申请人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
发明人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
IPC分类号： B08B3/00 , B44C1/22 , H01L21/00 , H01L21/302 , H01L21/311 , H01L21/3213
CPC分类号： H01L21/31111 , H01L21/32134 , H01L21/67051 , H01L21/6708
摘要： In a process for removing etch residue, liquid including an acid and an oxidizer is applied to the back side and peripheral edge of a wafer. The front or device side of the wafer is left unprocessed, or may be exposed to an inert fluid such as a purge gas (e.g., nitrogen or helium), to a rinse such as deionized water, or to another processing fluid such as a more highly diluted etchant. The front side of the wafer is either left unprocessed, or is processed to a lesser degree without damage to the underlying devices, metal interconnects or semiconductor layers.
摘要翻译：在去除蚀刻残留物的方法中，将包含酸和氧化剂的液体施加到晶片的背面和周缘。晶片的前部或装置侧未被处理，或者可以暴露于诸如清除气体（例如氮气或氦气）的惰性流体到漂洗液如去离子水，或者暴露于另一种处理流体，例如更多高度稀释的蚀刻剂。晶片的前侧要么是未加工的，要么被加工程度较小，而不会损坏底层器件，金属互连或半导体层。

4. 发明授权

US06692613B2 Reactor for processing a semiconductor wafer 失效
标题翻译：用于处理半导体晶片的反应器
公开(公告)号：US06692613B2
公开(公告)日：2004-02-17
申请号：US10223974
申请日：2002-08-20
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： H01L2348
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
摘要翻译：用于处理半导体晶片或类似物品的方法包括在旋转晶片时旋转晶片并将其施加到晶片的第一侧的步骤。流体通过离心力在晶片的第一侧上在所有方向上径向向外流动。当流体从晶片的圆周边缘流出时，其被包含在环形储存器中，使得流体也流到晶片的第二侧的外部环形区域。开口允许流体从储存器流出。开口限定分流线的位置，超过该分隔线，流体不会在晶片的第二侧上行进。用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。晶片支撑在转子之间。转子由旋转电机旋转。处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。流体向外均匀地向各个方向流动。晶片支架自动提升晶片，从而当转子在加工后彼此分离时，可以通过机器人将其从反应器中移除。

5. 发明授权

US06423642B1 Reactor for processing a semiconductor wafer 有权
公开(公告)号：US06423642B1
公开(公告)日：2002-07-23
申请号：US09437711
申请日：1999-11-10
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： H01L21311
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

6. 发明授权

US06447633B1 Reactor for processing a semiconductor wafer 有权
公开(公告)号：US06447633B1
公开(公告)日：2002-09-10
申请号：US09710530
申请日：2000-11-09
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： C28F102
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

7. 发明申请

US20060070638A1 Methods and apparatus for rinsing and drying 有权
标题翻译：冲洗和干燥的方法和设备
公开(公告)号：US20060070638A1
公开(公告)日：2006-04-06
申请号：US11292823
申请日：2005-12-02
申请人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
发明人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
IPC分类号： B08B3/00 , B08B7/00
CPC分类号： H01L21/67051 , B08B3/02 , H01L21/67028
摘要： A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.
摘要翻译：用于冲洗和干燥工件的方法包括将工件放置在室中并旋转工件。冲洗流体例如水通过腔室中的第一出口施加到工件上，漂洗流体通过离心力向外移动到工件的边缘，以冲洗工件。干燥流体，例如醇蒸汽，通过第一出口施加到工件上，干燥流体通过离心力向外移动到工件的边缘，以干燥工件。干燥流体有利地沿着穿过工件表面的冲洗流体的弯液面。冲洗流体或干燥流体或两种流体可以施加在工件的中心区域附近或其附近。

8. 发明申请

US20050217707A1 Selective processing of microelectronic workpiece surfaces 审中-公开
标题翻译：微电子工件表面的选择性处理
公开(公告)号：US20050217707A1
公开(公告)日：2005-10-06
申请号：US11133909
申请日：2005-05-21
申请人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
发明人： Brian Aegerter , Curt Dundas , Tom Ritzdorf , Gary Curtis , Michael Jolley
IPC分类号： B08B3/00 , B44C1/22 , H01L21/00 , H01L21/302 , H01L21/311 , H01L21/3213
CPC分类号： H01L21/31111 , H01L21/32134 , H01L21/67051 , H01L21/6708
摘要： A processing fluid is selectively applied or excluded from an outer peripheral margin of the front side, back side, or both sides of a workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece is spinning. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.
摘要翻译：从工件的前侧，后侧或两侧的外周边缘选择性地施加或排除处理流体。处理流体的排除和/或应用是通过在工件旋转时将一种或多种加工流体施加到工件而发生的。使用一种或多种加工流体的流量，流体压力和/或旋转速率来控制从外周边缘选择性地施加或排除处理流体的程度。

9. 发明申请

US20050020001A1 Selective treatment of the surface of a microelectronic workpiece 审中-公开
标题翻译：选择性处理微电子工件的表面
公开(公告)号：US20050020001A1
公开(公告)日：2005-01-27
申请号：US10927259
申请日：2004-08-25
申请人： Brian Aegerter , Curt Dundas , Michael Jolley , Tom Ritzdorf , Steven Peace , Gary Curtis , Raymon Thompson
发明人： Brian Aegerter , Curt Dundas , Michael Jolley , Tom Ritzdorf , Steven Peace , Gary Curtis , Raymon Thompson
IPC分类号： H01L21/00 , H01L21/3213 , H01L21/8238
CPC分类号： H01L21/67017 , H01L21/32134 , H01L21/6708
摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral-margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.
摘要翻译：在用于处理诸如半导体晶片的工件的处理中，处理流体被选择性地从工件的前侧或后侧中的至少一个的外周边缘施加或排除。通过在工件和保持工件的反应器旋转的同时将一种或多种加工流体施加到工件来发生加工流体的排除和/或应用。处理流体的流量，流体压力和/或旋转速率用于控制从外周边缘选择性地施加或排除处理流体的程度。

10. 发明授权

US06794291B2 Reactor for processing a semiconductor wafer 有权
标题翻译：用于处理半导体晶片的反应器
公开(公告)号：US06794291B2
公开(公告)日：2004-09-21
申请号：US10202074
申请日：2002-07-23
申请人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
发明人： Steven L. Peace , Gary L. Curtis , Raymon F. Thompson , Brian Aegerter , Curt T. Dundas
IPC分类号： H01L21311
CPC分类号： H01L21/6715 , B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/6708 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
摘要翻译：用于处理半导体晶片或类似物品的设备包括具有由上下转子形成的处理室的反应器。晶片支撑在转子之间。转子由旋转电机旋转。处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。流体向外均匀地向各个方向流动。晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

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