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    • 4. 发明申请
    • CHAMBER FILLER KIT FOR PLASMA ETCH CHAMBER USEFUL FOR FAST GAS SWITCHING
    • 用于快速气体切换的等离子体气室的室内填充试剂盒
    • US20130244440A1
    • 2013-09-19
    • US13421188
    • 2012-03-15
    • Jon McChesneyTheo PanagopoulosAlex PatersonCraig Blair
    • Jon McChesneyTheo PanagopoulosAlex PatersonCraig Blair
    • H01L21/3065
    • H01J37/32477C23C16/4404H01J37/321H01J37/32458H01L21/30655
    • A chamber filler kit for an inductively coupled plasma processing chamber in which semiconductor substrates are processed by inductively coupling RF energy through a window facing a substrate supported on a cantilever chuck. The kit includes at least one chamber filler which reduces the lower chamber volume in the chamber below the chuck. The fillers of the kit can be mounted in a standard chamber having a chamber volume of over 60 liters and by using different sized chamber fillers it is possible to reduce the chamber volume to provide desired gas flow conductance and accommodate changes in vacuum pressure during processing of the substrate. The chamber filler kit can be used to modify a standard chamber to accommodate different processing regimes such as rapid alternating processes wherein wide pressure changes are needed without varying a gap between the substrate and the window.
    • 一种用于电感耦合等离子体处理室的腔室填充器套件,其中通过将RF能量通过面向支撑在悬臂卡盘上的衬底的窗口感应耦合来处理半导体衬底。 该套件包括至少一个室填充物,其减小了在卡盘下方的腔室中的下室体积。 套件的填充物可以安装在具有超过60升的室容积的标准室中,并且通过使用不同尺寸的室填料,可以减小室体积以提供期望的气体流动传导并适应处理过程中真空压力的变化 底物。 腔室填充套件可用于修改标准室以适应不同的处理方式,例如需要宽压力变化的快速交替过程,而不改变衬底和窗口之间的间隙。