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1. 发明授权

US07385394B2 Integrated magnetic sensor component 有权
标题翻译：集成磁传感器组件
公开(公告)号：US07385394B2
公开(公告)日：2008-06-10
申请号：US11453365
申请日：2006-06-15
申请人： Albert Auburger , Jochen Dangelmaier , Alfred Gottlieb , Martin Petz , Uwe Schindler , Horst Theuss
发明人： Albert Auburger , Jochen Dangelmaier , Alfred Gottlieb , Martin Petz , Uwe Schindler , Horst Theuss
IPC分类号： G01R33/02 , H05K7/04 , G01B7/30
CPC分类号： G01R33/06 , G01P3/488 , G01P15/105
摘要： A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.
摘要翻译：公开了用于测量磁场强度的传感器部件。在一个实施例中，传感器部件包含测量磁场强度的多个引线和传感器半导体芯片。传感器半导体芯片在其主动上侧具有焊盘。这些焊盘与引线电连接。传感器部件还包含一个附着在引线上的磁铁。传感器半导体芯片布置在磁体的上侧。传感器部件还具有与传感器半导体芯片共用公共边界并围绕传感器半导体芯片，磁体和引线部分的第一模具化合物。

2. 发明申请

US20070145972A1 Integrated magnetic sensor component 有权
标题翻译：集成磁传感器组件
公开(公告)号：US20070145972A1
公开(公告)日：2007-06-28
申请号：US11453365
申请日：2006-06-15
申请人： Albert Auburger , Jochen Dangelmaier , Alfred Gottlieb , Martin Petz , Uwe Schindler , Horst Theuss
发明人： Albert Auburger , Jochen Dangelmaier , Alfred Gottlieb , Martin Petz , Uwe Schindler , Horst Theuss
IPC分类号： G01R33/02
CPC分类号： G01R33/06 , G01P3/488 , G01P15/105
摘要： A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.
摘要翻译：公开了用于测量磁场强度的传感器部件。在一个实施例中，传感器部件包含测量磁场强度的多个引线和传感器半导体芯片。传感器半导体芯片在其主动上侧具有焊盘。这些焊盘与引线电连接。传感器部件还包含一个附着在引线上的磁铁。传感器半导体芯片布置在磁体的上侧。传感器部件还具有与传感器半导体芯片共用公共边界并围绕传感器半导体芯片，磁体和引线部分的第一模具化合物。

3. 发明授权

US4830252A Hammer-activated, powder-actuated drive tool 失效
标题翻译：锤式激活，粉末驱动的驱动工具
公开(公告)号：US4830252A
公开(公告)日：1989-05-16
申请号：US889953
申请日：1986-07-23
申请人： Alfred Gottlieb , Joseph B. Wirtes
发明人： Alfred Gottlieb , Joseph B. Wirtes
IPC分类号： B25C1/14
CPC分类号： B25C1/146
摘要： The invention concerns improvements in a hammer-activated, powder-actuated drive tool comprising an elongated tubular housing, a tubular piston guide telescopically received extending from the front end of the housing, a piston telescopically movable within the piston guide, a chamber secured to the rear end of the piston guide for mounting a power load therein, and an activating assembly mounted on the tubular housing rearwardly of the chamber and comprising an elongate member slidably mounted relative to the housing and having a rear end extending outwardly of the housing at the rear end thereof and a forward end extending within the housing for contact with a power load mounted within the chamber. One improvement comprises providing the tubular housing with an internal bushing for slidably mounting the elongate activating member formed as a one-piece integrally molded member which experiences substantially no mechanical loading due to the activation of the power load. A further improvement comprises the provision of a retaining member for retaining a power load within the chamber without regard for the orientation of the tool, when the piston guide is in a retracted position. Yet a further improvement comprises a combined piston guide frictional engagement and retaining and piston resetting means mounted to the tubular housing for frictional engagement and retaining engagement with the piston guide and for engagement with the piston for effecting resetting motion thereof relative to the piston guide.
摘要翻译：本发明涉及一种锤击活化的粉末驱动的驱动工具的改进，其包括细长的管状壳体，从壳体的前端延伸伸缩的管状活塞导向件，可活塞地在活塞导向件内移动的活塞，活塞引导件的后端，用于在其中安装动力负载;以及启动组件，其安装在所述管状壳体的所述腔室的后方，并且包括可相对于所述壳体可滑动地安装的细长构件，并且具有在所述壳体的后部向外延伸的后端其端部在壳体内延伸以与安装在腔室内的动力负载接触。一个改进包括为管状壳体提供内部衬套，用于可滑动地安装形成为一体式模制构件的细长致动构件，其由于功率负载的激活而基本上不受机械负载的影响。进一步的改进包括提供保持构件，用于当活塞导向件处于缩回位置时，保持在腔室内的动力负载而不考虑工具的定向。另外的改进包括组合的活塞导向器摩擦接合以及安装到管状壳体上的保持和活塞复位装置，用于与活塞导向件摩擦接合和保持接合，并与活塞接合以实现其相对于活塞导向件的复位运动。

4. 发明授权

US06732590B1 Pressure sensor and process for producing the pressure sensor 有权
标题翻译：压力传感器和制造压力传感器的过程
公开(公告)号：US06732590B1
公开(公告)日：2004-05-11
申请号：US10301096
申请日：2002-11-20
申请人： Alfred Gottlieb , Martin Schröder
发明人： Alfred Gottlieb , Martin Schröder
IPC分类号： G01L916
CPC分类号： B60C23/0408 , G01L19/147 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： The invention relates to a pressure sensor with an MEM structure (micro electro mechanical structure), which has a hollow housing in which a semiconductor chip with a pressure-sensitive area is arranged. In its interior and with parts of the semiconductor chip, the housing is covered by a first plastic compound, which has a lower level of deformation than a second plastic compound, which partly covers the pressure-sensitive area of the semiconductor chip.
摘要翻译：本发明涉及具有MEM结构（微机电结构）的压力传感器，其具有中空壳体，其中布置有具有压敏区域的半导体芯片。在其内部和部分半导体芯片中，壳体被第一塑料复合物覆盖，第一塑料复合物具有比部分覆盖半导体芯片的压敏区域的第二塑料化合物更低的变形水平。

5. 发明授权

US06538895B2 TSOP memory chip housing configuration 有权
标题翻译： TSOP内存芯片外壳配置
公开(公告)号：US06538895B2
公开(公告)日：2003-03-25
申请号：US10047815
申请日：2002-01-15
申请人： Andreas Wörz , Alfred Gottlieb , Bernd Römer
发明人： Andreas Wörz , Alfred Gottlieb , Bernd Römer
IPC分类号： H01L2348
CPC分类号： G11C5/06 , G11C5/12 , H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H01L2924/00
摘要： A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.
摘要翻译：描述了彼此堆叠的至少两个TSOP存储器芯片外壳的配置。每个TSOP存储器芯片外壳具有至少一个存储器芯片，其中多个引脚设置在TSOP存储器芯片壳体的内部。从相应的TSOP存储器芯片壳体引出的引脚和经由重新布线配置的引脚连接到引导出相同TSOP存储器芯片外壳叠层的分别直接相邻的TSOP存储器芯片外壳的引脚。为了能够通过自动安装方法以成本有效且简单的方式生产这种壳体叠层，重新布线配置以分别布置在单个TSOP存储器芯片壳体之间或侧面的引线框架的形式实现。

6. 发明授权

US5831835A Press grid for electrically connecting circuit components 失效
标题翻译：按格栅电连接电路元件
公开(公告)号：US5831835A
公开(公告)日：1998-11-03
申请号：US808785
申请日：1997-02-28
申请人： Josef Dirmeyer , Christian Plankl , Marten Swart , Alfred Gottlieb
发明人： Josef Dirmeyer , Christian Plankl , Marten Swart , Alfred Gottlieb
IPC分类号： H05K7/06 , H05K1/00 , H05K1/18 , H05K3/20 , H05K7/02 , H05K9/00
CPC分类号： H05K7/02 , H05K3/202 , H05K1/0284 , H05K1/187 , H05K2201/0382 , H05K2201/09118 , H05K2201/09736 , H05K2201/10371 , H05K2201/2072 , H05K2203/1545
摘要： A device with an electric circuit configuration includes electrical components and a pressed grid stamped from a metal strip for electrically conductively connecting the electrical components to one another. The pressed grid has bent-over large-area peripheral regions and a plug part with connection pins stamped out of the metal strip.
摘要翻译：具有电路配置的装置包括电气部件和从金属带冲压的用于将电气部件彼此导电连接的压制网格。压制的格栅具有弯曲的大面积周边区域和具有从金属条冲压出的连接销的插头部分。

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