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1. 发明申请

US20050029515A1 Organic/inorganic oxide mixed film, passive device contained electronic substrate using the film, and method of manufacturing organic/inorganic oxide mixed film 审中-公开
标题翻译：有机/无机氧化物混合膜，使用该膜的无源器件包含电子基板，以及制造有机/无机氧化物混合膜的方法
公开(公告)号：US20050029515A1
公开(公告)日：2005-02-10
申请号：US10912108
申请日：2004-08-06
申请人： Akira Nagai , Toshiyuki Ohno , Fusao Hojo , Shinji Yamada , Mikio Konno , Yomokazu Tanase , Daisuke Naga
发明人： Akira Nagai , Toshiyuki Ohno , Fusao Hojo , Shinji Yamada , Mikio Konno , Yomokazu Tanase , Daisuke Naga
IPC分类号： C01G23/00 , C01G23/053 , C08K7/18 , C08L101/00 , H01B3/00 , H01G4/20 , H01G4/33 , H01L35/24 , H05K1/16 , H05K3/46
CPC分类号： H05K1/162 , H01G4/206 , H05K3/4611 , H05K2201/0209 , H05K2201/0257 , H05K2201/0355 , H05K2201/09309
摘要： An organic/inorganic oxide mixture has high capacitance density so as to realize a capacitor material that can be self-contained in a substrate. The mixture film made of inorganic oxide particle has a mean particle size of less than 90 nm dispersed in organic polymer, of which relative dielectric constant is more than 10 and thickness is less than 900 nm.
摘要翻译：有机/无机氧化物混合物具有高的电容密度，以便实现可以独立于衬底中的电容器材料。由无机氧化物颗粒制成的混合物膜具有分散在有机聚合物中的小于90nm的平均粒度，其相对介电常数大于10，厚度小于900nm。

2. 发明授权

US07112627B2 Low dielectric loss tangent films and wiring films 失效
标题翻译：低介电损耗角正切膜和布线膜
公开(公告)号：US07112627B2
公开(公告)日：2006-09-26
申请号：US10385720
申请日：2003-03-12
申请人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Akira Nagai , Masatoshi Sugimasa
发明人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Akira Nagai , Masatoshi Sugimasa
IPC分类号： C08L9/00
CPC分类号： H05K1/032 , Y10T428/31721 , Y10T428/31855 , Y10T428/31909 , Y10T442/2861 , Y10T442/3854 , Y10T442/3862 , Y10T442/3886 , Y10T442/3902 , Y10T442/3911 , Y10T442/678
摘要： A curing low dielectric loss tangent film using a low dielectric loss tangent composition containing a polyfunctional styrene compound having excellent dielectric characteristics, and a wiring film using the same as an insulating layer are provided. The low dielectric loss tangent film contains a high molecular weight material and a crosslinking ingredient with a weight average molecular weight of 1000 or less having a plurality of styrene groups shown by the following general formula: (where R represents a hydrocarbon skeleton, R1, which may be identical or different with each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R2, R3 and R4, which may be identical or different with each other, each represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, m represents an integer of 1 to 4, and n represents an integer of 2 or greater).
摘要翻译：提供了使用包含具有优异介电特性的多官能苯乙烯化合物的低介电损耗角正切组合物的固化低介电损耗角正切薄膜和使用其的绝缘层的布线膜。低介电损耗角正切膜含有高分子量材料和重均分子量为1000以下的具有多个苯乙烯基团的交联成分，所述苯乙烯基团由以下通式表示：（其中R表示烃骨架，R ^{1可以相同或不同，表示氢原子或1-20个碳原子的烃基，R 2，R 3 O，和R 4彼此可以相同或不同，各自表示氢原子或1〜6个碳原子的烷基，m表示1〜4的整数，n表示 2以上的整数）。}

3. 发明授权

US06855952B2 Semiconductor device and semiconductor package 失效
标题翻译：半导体器件及半导体封装
公开(公告)号：US06855952B2
公开(公告)日：2005-02-15
申请号：US10400647
申请日：2003-03-28
申请人： Akira Nagai , Satoru Amou , Shinji Yamada , Takao Ishikawa , Hiroshi Nakano
发明人： Akira Nagai , Satoru Amou , Shinji Yamada , Takao Ishikawa , Hiroshi Nakano
IPC分类号： C08K5/01 , C08L101/00 , H01L21/312 , H01L23/31 , H01L23/36 , H01L23/532 , B32B27/00 , H01L35/24
CPC分类号： H01L23/3114 , H01L23/5329 , H01L2924/0002 , H01L2924/12044 , Y10T428/12528 , Y10T428/24917 , Y10T428/249958 , Y10T428/249988 , Y10T428/249991 , Y10T428/249993 , Y10T428/31855 , Y10T428/31931 , H01L2924/00
摘要： A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material: where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.
摘要翻译：使用含有作为交联成分的具有多个苯乙烯基并由化学式[1]表示的化合物的树脂作为绝缘材料的半导体器件：其中R为可具有取代基或烃基的烃结构 R 1为氢，甲基或乙基，m为1〜4的整数，n为2以上的整数。由此，具有优异的透射特性和较少的半导体器件和半导体封装提供功耗。

4. 发明授权

US06638352B2 Thermal stable low elastic modulus material and device using the same 失效
标题翻译：热稳定性低弹性模量材料及其使用方法
公开(公告)号：US06638352B2
公开(公告)日：2003-10-28
申请号：US10097664
申请日：2002-03-15
申请人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
发明人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
IPC分类号： C08L8300
CPC分类号： H01L24/10 , C08L79/08 , C08L83/10 , H01L23/293 , H01L23/3114 , H01L23/3171 , H01L23/49894 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/351 , H05K1/0271 , Y10T428/31663 , C08L83/00 , H01L2224/13099 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.
摘要翻译：本发明提供一种热稳定性低的弹性模量材料，它具有高的热稳定性，在-50℃至300℃的温度范围内的动态特性如热膨胀系数和弹性模量的变化很小，具有在室温下为2-0.01GPa的弹性模量，并且电绝缘的可靠性高，而不管温度波动如何，并且提供了使用其的半导体器件。本发明还提供一种通过热量获得的热稳定性低弹性模量树脂组合物固化含有聚酰亚胺，聚酰胺 - 酰亚胺或聚酰胺树脂或树脂前体的混合物，其固化产物在-50℃下测量的2-0.01GPa的弹性模量和具有官能团的有机硅化合物的低聚物引起与NH和/或COOH基团的加成反应。

5. 发明授权

US07193009B2 Electronic device using low dielectric loss tangent insulators for high frequency signals 失效
标题翻译：使用低介质损耗角正切绝缘子的电子器件用于高频信号
公开(公告)号：US07193009B2
公开(公告)日：2007-03-20
申请号：US10434118
申请日：2003-05-09
申请人： Satoru Amou , Akira Nagai , Shinji Yamada , Takao Ishikawa , Akio Takahashi
发明人： Satoru Amou , Akira Nagai , Shinji Yamada , Takao Ishikawa , Akio Takahashi
IPC分类号： C08L9/00
CPC分类号： H01L23/49894 , C08K3/01 , H01B3/441 , H01L23/66 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01012 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H03B5/18 , H05K1/024 , H05K3/4676 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2224/0401
摘要： An electronic device for high frequency signals having a small dielectric loss and a high efficiency is provided, in which a low dielectric loss tangent resin composition is used, for coping with high frequency signals, as an insulating layer. The electronic device is fabricated using an insulating layer containing a crosslinked structure of a crosslinking ingredient represented by the following general formula (I): (where R represents a hydrocarbon skeleton, R1, which may be identical or different from each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R2, R3 and R4, which may be identical or different from each other, each represents a hydrogen atom or a hydrocarbon group of 1 to 6 carbon atoms, m is an integer of 1 to 4 and n is an integer of 2 or greater).
摘要翻译：提供一种低介电损耗角正切树脂组合物作为绝缘层用于应对高频信号的具有小介电损耗和高效率的高频信号的电子装置。电子器件使用含有交联成分的交联结构的绝缘层制造，所述交联结构由以下通式（I）表示：（其中R表示烃骨架，R 1可以相同或相同）彼此不同，表示氢原子或1-20个碳原子的烃基，R 2，R 3和R 4，各自表示氢原子或碳原子数为1〜6的烃基，m为1〜4的整数，n为2以上的整数）。

6. 发明授权

US06638631B2 Thermal stable low elastic modulus material and device using the same 失效
公开(公告)号：US06638631B2
公开(公告)日：2003-10-28
申请号：US10188961
申请日：2002-07-05
申请人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
发明人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
IPC分类号： B32B904
CPC分类号： H01L24/10 , C08L79/08 , C08L83/10 , H01L23/293 , H01L23/3114 , H01L23/3171 , H01L23/49894 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/351 , H05K1/0271 , Y10T428/31663 , C08L83/00 , H01L2224/13099 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.

7. 发明申请

US20050020781A1 Resin composition containing rubber component, and film and electronic part using the same 审中-公开
标题翻译：含有橡胶组分的树脂组合物，以及使用其的薄膜和电子部件
公开(公告)号：US20050020781A1
公开(公告)日：2005-01-27
申请号：US10785978
申请日：2004-02-26
申请人： Masatoshi Sugimasa , Akira Nagai , Shinji Yamada , Satoru Amou
发明人： Masatoshi Sugimasa , Akira Nagai , Shinji Yamada , Satoru Amou
IPC分类号： B32B15/082 , B32B15/08 , C08F279/02 , C08F283/08 , C08F287/00 , C08L9/06 , C08L25/02 , C08L101/00 , H05K1/03 , C08F10/00
CPC分类号： C08F283/08 , C08F279/02 , C08F287/00 , H05K1/032 , H05K1/0353 , C08F212/34
摘要： There is provided a resin composition suitable for insulating materials for use in electronic parts for handling high frequency signals, low in dielectric constant and low in dielectric dissipation factor, capable of forming thin film by low temperature curing, excellent in the adhesiveness to conductive foil and excellent in flexibility; a cured product derived from the composition; and a film substrate and an electronic part using the composition. A resin composition, low in dielectric dissipation factor, comprising: a crosslinking component having a weight averaged molecular weight of 1,000 or less and a plurality of styrene groups represented by the following general formula: wherein R represents a hydrocarbon moiety; each R1, which may be the same or different, represents a hydrogen atom or a C1-20 hydrocarbon group; R2, R3 and R4, which may be the same or different, represent a hydrogen atom or a C1-6 alkyl group; and m is an integer of 1 to 4, and n is an integer of 2 or more; and a rubber component having a weight averaged molecular weight of 5,000 or more and styrene units; a cured product; and a film substrate and an electronic part using the composition.
摘要翻译：提供一种适用于电子部件用绝缘材料的树脂组合物，用于处理高频信号，介电常数低，介电损耗因数低，能够通过低温固化形成薄膜，对导电箔的粘合性优异，优良的灵活性; 衍生自组合物的固化产物; 以及使用该组合物的薄膜基板和电子部件。一种低介电损耗因子的树脂组合物，其包含：重均分子量为1,000以下的交联组分和由以下通式表示的多个苯乙烯基团：其中R表示烃部分; 每个R 1可以相同或不同，表示氢原子或C1-20烃基; R 2，R 3和R 4可以相同或不同，表示氢原子或C 1-6烷基; m为1〜4的整数，n为2以上的整数。和重均分子量为5000以上的橡胶成分和苯乙烯单元; 固化产品; 以及使用该组合物的薄膜基板和电子部件。

8. 发明授权

US08578592B2 Method of manufacturing laminated rotor core 有权
标题翻译：层叠转子铁心的制造方法
公开(公告)号：US08578592B2
公开(公告)日：2013-11-12
申请号：US13509190
申请日：2011-04-01
申请人： Akira Nagai , Mei Arazoe , Go Kato
发明人： Akira Nagai , Mei Arazoe , Go Kato
IPC分类号： H02K15/03 , H02K1/27
CPC分类号： H02K15/03 , H02K1/276
摘要： A method of manufacturing a laminated rotor core, includes a first process of placing segment dummy plates between an iron core and a die, each of each segment dummy plates covering one or more of plural magnet insertion portions and including a resin injection hole communicating to the one or more of the magnet insertion portions; a second process of injecting a resin from resin reservoir parts formed in any one of an upper die and a lower die holding the iron core through the resin injection hole of each segment dummy plate to the corresponding one or more of the magnet insertion portions; and a third process of detaching the segment dummy plates together with excess resin after the resin injected to the one or more of the magnet insertion portions is cured.
摘要翻译：一种叠层转子铁芯的制造方法，其特征在于，包括：在铁芯和模具之间配置分段虚拟板的第一工序，各个虚拟板各自覆盖多个磁体插入部的一个或多个，一个或多个磁体插入部分; 将形成在保持铁芯的上模和下模中的任一个中的树脂储存部分注入树脂的第二过程通过每个段虚拟板的树脂注入孔到相应的一个或多个磁体插入部分; 以及在注入到所述一个或多个所述磁体插入部分中的树脂被固化之后，将多个模板与多余的树脂一起分离的第三过程。

9. 发明授权

US08273457B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
公开(公告)号：US08273457B2
公开(公告)日：2012-09-25
申请号：US13166570
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

10. 发明授权

US08044524B2 Adhesive for connection of circuit member and semiconductor device using the same 失效
标题翻译：用于连接电路元件和使用其的半导体器件的粘合剂
公开(公告)号：US08044524B2
公开(公告)日：2011-10-25
申请号：US12500114
申请日：2009-07-09
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L29/40 , H01L23/29
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

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