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1. 发明授权

US06178580B2 Processing apparatus 有权
标题翻译：处理装置
公开(公告)号：US06178580B2
公开(公告)日：2001-01-30
申请号：US09299628
申请日：1999-04-27
申请人： Akira Ishihara , Kazuyoshi Namba , Akira Yonemizu , Takanori Miyazaki
发明人： Akira Ishihara , Kazuyoshi Namba , Akira Yonemizu , Takanori Miyazaki
IPC分类号： A46B1304
CPC分类号： H01L21/67046
摘要： A drive unit 42 for driving a brush 8 is provided on a tip of a rotatable arm 26. The drive unit 42 includes a motor 61 for driving the processing member 24 having a brush 58 for rotation and an adjustment mechanism 45 for adjusting a force to urge the processing member 24 against a wafer W. With no intermediary of a flexible transmitting means, such as a belt, the processing member 24 is securely joined to the motor 61 through a shaft 55 and driven by the motor 61 directly. The adjustment mechanism 45 is constituted by an electromagnetic actuator which includes a stationary element 46 and a movable element 48 capable of elevating along the stationary element 46. The motor 61 is coupled to the armature 48. The adjustment mechanism 45 controls the position of the processing member 24 with respect to the upward and downward direction as well as the force to urge the processing member 24 against a wafer W.
摘要翻译：用于驱动刷子8的驱动单元42设置在可旋转臂26的尖端上。驱动单元42包括用于驱动具有用于旋转的刷子58的处理构件24的马达61和用于调节力的调节机构45 将加工构件24推向晶片W.在没有诸如带之类的柔性传输装置的介质的情况下，处理构件24通过轴55牢固地接合到马达61，并由马达61直接驱动。调节机构45由电磁致动器构成，电磁致动器包括固定元件46和能够沿着固定元件46升高的可移动元件48.马达61联接到电枢48.调节机构45控制处理的位置构件24相对于向上和向下方向以及将处理构件24推向晶片W的力。

2. 发明授权

US06491760B2 Scrub washing method 失效
标题翻译：擦洗方法
公开(公告)号：US06491760B2
公开(公告)日：2002-12-10
申请号：US09892090
申请日：2001-06-26
申请人： Akira Ishihara , Akira Yonemizu , Takanori Miyazaki
发明人： Akira Ishihara , Akira Yonemizu , Takanori Miyazaki
IPC分类号： B08B102
CPC分类号： H01L21/67051 , B08B1/04 , G05G1/08 , H01L21/67046 , Y10S134/902
摘要： A scrub washing apparatus comprises a spin chuck for holding a substrate to be processed substantially horizontally, a nozzle for supplying a washing liquid to the substrate mounted on the spin chuck, an arm vertically and horizontally movably supported, an output shaft provided at the arm, a sponge brush connected directly or indirectly to the output shaft, for scrubbing the substrate on the spin chuck in contact therewith, a press mechanism moving the sponge brush downward together with the output shaft, for pressing the sponge brush against the substrate on the spin chuck, and a rotation drive mechanism provided above the press mechanism at a position where the rotation drive mechanism is capable of being engaged with the output shaft, for directly rotating the sponge brush by engaging with the output shaft.
摘要翻译：擦洗洗涤装置包括：旋转卡盘，用于保持大致水平的待处理基板;喷嘴，用于将洗涤液供给到安装在旋转卡盘上的基板;水平移动支撑的支臂;设置在该臂上的输出轴; 直接或间接连接到输出轴的海绵刷，用于擦拭与其接触的旋转卡盘上的基底;压力机构，与输出轴一起向下移动海绵刷，用于将海绵刷压在旋转卡盘上的基底上以及旋转驱动机构，其设置在所述按压机构的上方的旋转驱动机构能够与所述输出轴接合的位置，以通过与所述输出轴接合来直接旋转所述海绵刷。

3. 发明授权

US06292972B1 Scrub washing apparatus and scrub washing method 失效
标题翻译：洗涤洗涤装置和擦洗方法
公开(公告)号：US06292972B1
公开(公告)日：2001-09-25
申请号：US09281531
申请日：1999-03-30
申请人： Akira Ishihara , Akira Yonemizu , Takanori Miyazaki
发明人： Akira Ishihara , Akira Yonemizu , Takanori Miyazaki
IPC分类号： A46B1304
CPC分类号： H01L21/67051 , B08B1/04 , G05G1/08 , H01L21/67046 , Y10S134/902
摘要： A scrub washing apparatus comprises a spin chuck for holding a substrate to be processed substantially horizontally, a nozzle for supplying a washing liquid to the substrate mounted on the spin chuck, an arm vertically and horizontally movably supported, an output shaft provided at the arm, a sponge brush connected directly or indirectly to the output shaft, for scrubbing the substrate on the spin chuck in contact therewith, a press mechanism moving the sponge brush downward together with the output shaft, for pressing the sponge brush against the substrate on the spin chuck, and a rotation drive mechanism provided above the press mechanism at a position where the rotation drive mechanism is capable of being engaged with the output shaft, for directly rotating the sponge brush by engaging with the output shaft.
摘要翻译：擦洗洗涤装置包括：旋转卡盘，用于保持大致水平的待处理基板;喷嘴，用于将洗涤液供给到安装在旋转卡盘上的基板;水平移动支撑的支臂;设置在该臂上的输出轴; 直接或间接连接到输出轴的海绵刷，用于擦拭与其接触的旋转卡盘上的基底;压力机构，与输出轴一起向下移动海绵刷，用于将海绵刷压在旋转卡盘上的基底上以及旋转驱动机构，其设置在所述按压机构的上方的旋转驱动机构能够与所述输出轴接合的位置，以通过与所述输出轴接合来直接旋转所述海绵刷。

4. 发明授权

US06652662B1 Substrate surface processing apparatus and method 失效
标题翻译：基板表面处理装置及方法
公开(公告)号：US06652662B1
公开(公告)日：2003-11-25
申请号：US09283920
申请日：1999-04-01
申请人： Akira Ishihara , Akira Yonemizu , Takanori Miyazaki
发明人： Akira Ishihara , Akira Yonemizu , Takanori Miyazaki
IPC分类号： B08B302
CPC分类号： H01L21/67253 , B08B1/00 , B08B1/04 , H01L21/67046 , Y10S134/902
摘要： A processing apparatus and a processing method are capable of properly and easily obtaining accurate data on the contact pressure applied by an end effector to a workpiece while a process is being carried out. A processing apparatus (7) processes a surface of a wafer (W) held by a spin chuck (22) (holding means) by bringing an end effector (40) into contact with the surface of the wafer (W). The end effector (40) can be retracted from the surface of the wafer (W) to a waiting position (25). A measuring and cleaning device (28) comprises, in combination, a measuring device (26) for measuring contact pressure to be applied to the wafer (W) by the end effector (40), and a cleaning device (27) for cleaning the end effector (40). The measuring device (26) has a table (60) for supporting the end effector (40), and a pressure sensor (62) for measuring a pressure applied to the table (60) to estimate a contact pressure actually applied by the end effector (40) to the wafer (W). The support surface of the table (60) and the surface of the wafer (W) held by the spin chuck (22) are on the same level.
摘要翻译：处理装置和处理方法能够正确且容易地获得关于在执行处理时由端部执行器施加到工件的接触压力的准确数据。处理装置（7）通过使端部执行器（40）与晶片（W）的表面接触来处理由旋转卡盘（22）（保持装置）保持的晶片（W）的表面。末端执行器（40）可以从晶片（W）的表面缩回到等待位置（25）。测量和清洁装置（28）组合包括用于测量由末端执行器（40）施加到晶片（W）的接触压力的测量装置（26）和用于清洁末端执行器（40）。测量装置（26）具有用于支撑端部执行器（40）的工作台（60）和用于测量施加到工作台（60）的压力的压力传感器（62），以估计由端部执行器（40）到晶片（W）。工作台（60）的支撑表面和由旋转卡盘（22）保持的晶片（W）的表面处于同一水平。

5. 发明申请

US20140014643A1 Heating Device 审中-公开
标题翻译：加热装置
公开(公告)号：US20140014643A1
公开(公告)日：2014-01-16
申请号：US14008287
申请日：2012-03-28
申请人： Hironori Akiba , Kazuhiko Kubota , Tsutomu Hatanaka , Yuichi Sakai , Akira Yonemizu , Kazuhiko Ooshima
发明人： Hironori Akiba , Kazuhiko Kubota , Tsutomu Hatanaka , Yuichi Sakai , Akira Yonemizu , Kazuhiko Ooshima
IPC分类号： H01L21/67
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/68728 , H01L21/68785
摘要： A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted.
摘要翻译：加热装置包括基板和面板，其设置在基板上方并且放置有晶片。面板包括铝基板，设置在铝基板上并加热晶片的薄膜加热器，以及设置在铝基板上且介于铝基板和晶片之间的间隙球。铝基板设置有第二安装孔，间隙球被压配入其中。间隙球仅由第二安装孔的内壁通过压配而保持。

6. 发明授权

US06096233A Method for wet etching of thin film 失效
标题翻译：湿法蚀刻薄膜的方法
公开(公告)号：US06096233A
公开(公告)日：2000-08-01
申请号：US935837
申请日：1997-09-23
申请人： Hiroki Taniyama , Miyako Yamasaka , Hiroyuki Kudou , Akira Yonemizu
发明人： Hiroki Taniyama , Miyako Yamasaka , Hiroyuki Kudou , Akira Yonemizu
IPC分类号： H01L21/00 , H01L21/66 , H01L21/302
CPC分类号： H01L21/6708 , H01L22/26
摘要： The present invention provides a wet etching method applied to a thin, including the steps of (a) setting in advance an etching rate of said thin film in view of a kind of the thin film to be etched, components of said etchant solution, and temperature, (b) loading the substrate on a spin chuck such that the surface having the thin film formed thereon faces upward and, (c) detecting a thickness of the thin film in at least a peripheral portion and a central portion of the substrate. The method also includes the steps (d) calculating moving speeds of a nozzle at predetermined passing points of said nozzle on the basis of the etching rate set in step (a) and a film thickness detected in the step (c), (e) rotating the substrate by driving the spin chuck, and (f) controlling the moving speed of the nozzle, while allowing the nozzle to supply the etchant solution to the thin film formed on the surface of the substrate which is being rotated, to conform with the moving speeds calculated in step (d) at the predetermined passing points of the nozzle so as to move the nozzle in a radial direction of the substrate.
摘要翻译：本发明提供了一种应用于薄的湿式蚀刻方法，包括以下步骤：（a）考虑到要蚀刻的薄膜的种类，所述蚀刻剂溶液的成分和所述蚀刻剂溶液的成分，预先设定所述薄膜的蚀刻速率温度，（b）将基板装载在旋转卡盘上，使得其上形成有薄膜的表面朝上，（c）在基板的至少周边部分和中心部分检测薄膜的厚度。该方法还包括步骤（d）基于步骤（a）中设定的蚀刻速率和在步骤（c）中检测到的膜厚度计算喷嘴在预定通过点处的移动速度，（e）通过驱动旋转卡盘旋转基板，和（f）控制喷嘴的移动速度，同时允许喷嘴将蚀刻剂溶液供应到正在旋转的基板的表面上形成的薄膜，以符合在步骤（d）中计算出的在喷嘴的预定通过点处的移动速度，以沿着基板的径向方向移动喷嘴。

7. 发明授权

US5882426A Method of cleaning a substrate by scrubbing 失效
标题翻译：通过洗涤清洁基材的方法
公开(公告)号：US5882426A
公开(公告)日：1999-03-16
申请号：US798342
申请日：1997-02-10
申请人： Akira Yonemizu , Nobukazu Ishizaka , Tomoko Hamada
发明人： Akira Yonemizu , Nobukazu Ishizaka , Tomoko Hamada
IPC分类号： B08B1/04 , B08B7/04 , B08B11/02 , H01L21/00 , H01L21/304
CPC分类号： H01L21/67098 , B08B1/007 , B08B1/04 , B08B11/02 , H01L21/67028
摘要： The present invention provides a cleaning method in which an object to be cleaned is held such that a surface of the object to be cleaned faces a cleaning body and the object to be cleaned and the cleaning body are moved relative to each other in a state where the cleaning body is in contact with the surface to the object to be cleaned, thereby cleaning the surface of the object to be cleaned, wherein a contact pressure of the cleaning body to the surface of the object to be cleaned is set at most 20 gf/cm.sup.2, when the surface is cleaned.
摘要翻译：本发明提供了一种清洁方法，其中待清洁物体被保持成使得待清洁物体的表面面向清洁体，并且待清洁物体和清洁体相对于彼此移动，清洁体与要清洁的物体的表面接触，从而清洁被清洁物体的表面，其中清洁体与被清洁物体的表面的接触压力设定为最多20gf / cm2，当表面被清洁。

8. 发明申请

US20140014644A1 Heating Device 审中-公开
标题翻译：加热装置
公开(公告)号：US20140014644A1
公开(公告)日：2014-01-16
申请号：US14008373
申请日：2012-03-28
申请人： Hironori Akiba , Kazuhiko Kubota , Tsutomu Hatanaka , Yuichi Sakai , Akira Yonemizu , Kazuhiko Ooshima
发明人： Hironori Akiba , Kazuhiko Kubota , Tsutomu Hatanaka , Yuichi Sakai , Akira Yonemizu , Kazuhiko Ooshima
IPC分类号： H01L21/02
CPC分类号： H01L21/02002 , H01L21/67103 , H01L21/68728 , H01L21/68785 , H05B3/143
摘要： A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward.
摘要翻译：加热装置包括位于基板上方的面板形状的基板，晶片被放置在基板上，并且设置有用于加热晶片的薄膜加热器，垂直设置在基板和面板和支撑面板，以及将面板拉向底板的张紧构件。柱和张紧构件定位成支撑或拉动对应于晶片的放置区域的面板的至少一部分。每个张力构件包括具有被面板锁定的上端和穿过基板的下端的轴，以及定位在基板上的螺旋弹簧，并且将轴的下端偏压到下方。

9. 发明申请

US20070125491A1 METHOD OF REMOVING PARTICLE ON SUBSTRATE, APPARATUS THEREFOR, AND COATING AND DEVELOPMENT APPARATUS 审中-公开
标题翻译：基板上去除颗粒的方法，其设备及涂层和开发设备
公开(公告)号：US20070125491A1
公开(公告)日：2007-06-07
申请号：US11559675
申请日：2006-11-14
申请人： Akira Yonemizu , Akihiro Fujimoto
发明人： Akira Yonemizu , Akihiro Fujimoto
IPC分类号： B32B37/12 , B08B7/00 , H01L21/00
CPC分类号： H01L21/67132 , H01L21/67011 , H01L21/67092 , H01L21/6715 , H01L21/68742
摘要： Particles attached to the back surface of a substrate are removed easily, reliably and quickly. An adhesive sheet is placed with an adhesive portion thereof up on a support base, and a substrate is placed thereon. Thereafter, the air pressure on the back surface side of the substrate is reduced lower than the air pressure on the front surface side to allow the adhesive sheet and the substrate to firmly adhere to each other. Then, the pressure difference is removed, and an elevating pin lifts the substrate from below the support base through a hole formed in each of the support base and the adhesive sheet to strip off the substrate from the adhesive sheet. Accordingly, the particles on the back surface of the substrate can be removed quickly, reliably and easily.
摘要翻译：附着在基板的背面的颗粒被容易，可靠且快速地去除。将粘合剂片放置在其上的粘合剂部分在支撑基底上，并且将基底放置在其上。此后，将基板的背面侧的空气压力降低到低于前表面侧的空气压力，以使粘合片和基板牢固地粘合。然后，除去压力差，升降销通过形成在支撑基座和粘合片各自中的孔从基座的下方提升基板，从基板剥离粘合片。因此，能够快速，可靠，容易地除去基板背面的颗粒。

10. 发明授权

US06173468B1 Apparatus for washing both surfaces of a substrate 有权
标题翻译：用于洗涤基底的两个表面的装置
公开(公告)号：US06173468B1
公开(公告)日：2001-01-16
申请号：US09333915
申请日：1999-06-16
申请人： Akira Yonemizu , Yuji Matsuyama
发明人： Akira Yonemizu , Yuji Matsuyama
IPC分类号： B08B104
CPC分类号： H01L21/67028 , B08B1/007 , B08B1/04 , B08B7/0057 , Y10S134/902
摘要： A method for washing both surfaces of a substrate, comprising (a) a first washing step for washing a front surface of a substrate, which is kept rotated, by bringing a scrubbing member into contact with said front surface of the substrate while supplying a washing liquid onto the front surface, (b) a second washing step for washing a back surface of the substrate, which is kept rotated, by bringing a scrubbing member into contact with said back surface of the substrate while supplying a washing liquid onto the back surface, (c) a heating step for drying under heat the wet surfaces of the substrate, (d) a recipe determining step for determining whether said heating step (c) is performed, at a period between said first washing step (a) and second washing step (b) and at a period after the second washing step (b), whether the heating step (c) is performed only once after the second washing step (b), or whether the heating step (c) is not performed, and (e) a conducting step for performing or not performing the heating step (C) in accordance with the recipe determined in said recipe determining step (d).
摘要翻译：一种用于洗涤基材的两个表面的方法，包括：（a）第一洗涤步骤，用于洗涤保持旋转的基材的前表面，通过使洗涤部件与所述基材的所述前表面接触，同时提供洗涤液体到前表面上，（b）第二洗涤步骤，用于洗涤保持旋转的衬底的背面，通过使洗涤构件与衬底的所述背面接触，同时将洗涤液体供应到背面（c）用于在加热下在基底的湿表面上干燥的加热步骤，（d）配方确定步骤，用于在所述第一洗涤步骤（a）和第二洗涤步骤（a）之间的时间段确定是否执行所述加热步骤（c）洗涤步骤（b），并且在第二洗涤步骤（b）之后的时间段，在第二洗涤步骤（b）之后是否仅进行一次加热步骤（c），或者是否不进行加热步骤（c）和（e）用于执行的导电步骤或者根据在所述配方确定步骤（d）中确定的配方不执行加热步骤（C）。

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