专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050253671A1 Filter 有权
标题翻译：过滤
公开(公告)号：US20050253671A1
公开(公告)日：2005-11-17
申请号：US10959432
申请日：2004-10-07
申请人： Tomoko Hamada , Hiroshi Nakano
发明人： Tomoko Hamada , Hiroshi Nakano
IPC分类号： H01P1/203 , H01P1/205
CPC分类号： H01P1/20381
摘要： A filter includes first and second line patterns each having a length substantially equal to ½ of the wavelength of a pass-band frequency, and a resonator that is interposed between the first and second line patterns and is coupled therewith so that the first and second line patterns have open stubs in which connection points between input/output terminals and the first and second line patterns appear to be short-circuited when viewed from ends of the first and second line patterns.
摘要翻译：滤波器包括第一和第二线图案，每个线图案具有基本上等于通带频率的波长的1/2的长度，以及介于第一和第二线图案之间并与之耦合的谐振器，使得第一和第二线图案具有打开的短截线，其中当从第一和第二线图案的端部观察时，输入/输出端子之间的连接点和第一和第二线条图案看起来短路。

2. 发明授权

US5401316A Method and apparatus for hydrophobic treatment 失效
标题翻译：用于疏水处理的方法和装置
公开(公告)号：US5401316A
公开(公告)日：1995-03-28
申请号：US136373
申请日：1993-10-15
申请人： Masatoshi Shiraishi , Tomoko Hamada
发明人： Masatoshi Shiraishi , Tomoko Hamada
IPC分类号： G03F7/16 , C23C16/44 , C23C16/52 , G03F7/11 , H01L21/00 , H01L21/027 , H01L21/30 , B05C11/00 , C23C16/00
CPC分类号： H01L21/67103 , C23C16/4412 , C23C16/52 , Y10S438/974
摘要： Adhesion apparatus for applying a hydrophobic treatment to a semiconductor wafer comprises a tank housing a treating agent of liquid HMDS and a process chamber into which a mixed gas consisting of a vaporized HMDS coming from the tank and a carrier gas is supplied for applying a hydrophobic treatment to a wafer surface. A supporting table on which the wafer is disposed during the hydrophobic treatment is provided within the process chamber. A heater and a cooling water passageway are housed in the supporting table for controlling the wafer temperature. A concentration measuring section for measuring the HMDS concentration in the waste gas is connected to the discharge pipe of the process chamber. The concentration measuring section is connected to a CPU serving to derive a temperature control signal from the measured value of the HMDS concentration. The temperature control signal is transmitted to a temperature control section. Upon receipt of the temperature control signal, the temperature control section permits controlling the current supply to the heater or the cooling water supply to the cooling water passageway so as to change the temperature of the supporting table.
摘要翻译：用于向半导体晶片施加疏水处理的粘合装置包括：容纳液体HMDS处理剂的容器和处理室，其中供应来自罐的蒸发的HMDS和载气组成的混合气体用于施加疏水处理到晶片表面。在处理室内设置有在疏水处理期间设置晶片的支撑台。加热器和冷却水通道容纳在支撑台中用于控制晶片温度。用于测量废气中的HMDS浓度的浓度测量部分连接到处理室的排出管。浓度测量部分连接到用于从HMDS浓度的测量值导出温度控制信号的CPU。温度控制信号被传送到温度控制部。在接收到温度控制信号时，温度控制部分允许控制对加热器的电流供应或冷却水通道的冷却水供应，以便改变支撑台的温度。

3. 发明授权

US5685039A Cleaning apparatus 失效
标题翻译：清洁装置
公开(公告)号：US5685039A
公开(公告)日：1997-11-11
申请号：US644811
申请日：1996-05-10
申请人： Tomoko Hamada , Mitiaki Matsushita , Kiyohisa Tateyama , Akira Yonemizu
发明人： Tomoko Hamada , Mitiaki Matsushita , Kiyohisa Tateyama , Akira Yonemizu
IPC分类号： A46B13/04
CPC分类号： H01L21/67046 , A46B13/04
摘要： A cleaning apparatus includes a spin chuck for holding and rotating a wafer, a brush for rubbing the surface of the wafer, and an arm for supporting the brush. A support is coupled to the arm through a linear guide. The arm and the support moves together in a horizontal direction and can relatively displace in a vertical direction. A compression spring is arranged between the arm and the support and deformed in accordance with a relative displacement of the arm and the support in the vertical direction. When the brush contacts the wafer held by the spin chuck, a biasing force of the brush against the wafer is generated in correspondence with deformation of the compression spring. The biasing force of the brush is set by adjusting the downward moving amount of the support in the vertical direction.
摘要翻译：清洁装置包括用于保持和旋转晶片的旋转卡盘，用于摩擦晶片表面的刷子和用于支撑刷子的臂。支撑件通过线性引导件与臂连接。臂和支撑件在水平方向上一起移动并且可以在垂直方向上相对移位。压缩弹簧布置在臂和支撑件之间，并且根据臂和支撑件在垂直方向上的相对位移而变形。当电刷接触由旋转卡盘保持的晶片时，与压缩弹簧的变形相对应地产生刷对着晶片的偏置力。通过调节支撑件在垂直方向上的向下移动量来设定刷子的偏置力。

4. 发明授权

US5636401A Cleaning apparatus and cleaning method 失效
标题翻译：清洁装置和清洁方法
公开(公告)号：US5636401A
公开(公告)日：1997-06-10
申请号：US439570
申请日：1995-05-11
申请人： Akira Yonemizu , Nobukazu Ishizaka , Tomoko Hamada
发明人： Akira Yonemizu , Nobukazu Ishizaka , Tomoko Hamada
IPC分类号： B08B1/04 , B08B7/04 , B08B11/02 , H01L21/00 , H01L21/304 , A46B13/04
CPC分类号： H01L21/67098 , B08B1/007 , B08B1/04 , B08B11/02 , H01L21/67028
摘要： The present invention provides a cleaning apparatus having object holding means for holding an object to be cleaned such that a surface of the object to be cleaned faces a cleaning body and a cleaning mechanism for moving and rotating the cleaning body for cleaning the surface of the object to be cleaned, wherein the object to be cleaned and the cleaning body are moved relative to each other in a state where the cleaning body is in contact with the surface to the object to be cleaned at a specified contact pressure, thereby cleaning the surface of the object to be cleaned, the cleaning mechanism including a rotatable arm, cleaning body supporting means rotatably supporting a cleaning body, and elevating means, attached to the arm, for moving up and down the cleaning body supporting means.
摘要翻译：本发明提供一种清洁装置，其具有用于保持待清洁物体的物体保持装置，使得待清洁物体的表面面向清洁体，以及用于移动和旋转清洁体以清洁物体表面的清洁机构待清洁物体和清洁体在清洁体以指定的接触压力与待清洁物体的表面接触的状态下相对于彼此移动，从而清洁表面待清洁的物体，清洁机构包括可旋转臂，可旋转地支撑清洁体的清洁体支撑装置和附接到臂的用于上下移动清洁体支撑装置的升降装置。

5. 发明授权

US07276995B2 Filter 有权
标题翻译：过滤
公开(公告)号：US07276995B2
公开(公告)日：2007-10-02
申请号：US10959432
申请日：2004-10-07
申请人： Tomoko Hamada , Hiroshi Nakano
发明人： Tomoko Hamada , Hiroshi Nakano
IPC分类号： H01P1/203
CPC分类号： H01P1/20381
摘要： A filter includes first and second line patterns each having a length substantially equal to ½ of the wavelength of a pass-band frequency, and a resonator that is interposed between the first and second line patterns and is coupled therewith so that the first and second line patterns have open stubs in which connection points between input/output terminals and the first and second line patterns appear to be short-circuited when viewed from ends of the first and second line patterns.
摘要翻译：滤波器包括第一和第二线图案，每个线图案具有基本上等于通带频率的波长的1/2的长度，以及介于第一和第二线图案之间并与之耦合的谐振器，使得第一和第二线图案具有打开的短截线，其中当从第一和第二线图案的端部观察时，输入/输出端子之间的连接点和第一和第二线条图案看起来短路。

6. 发明授权

US5882426A Method of cleaning a substrate by scrubbing 失效
标题翻译：通过洗涤清洁基材的方法
公开(公告)号：US5882426A
公开(公告)日：1999-03-16
申请号：US798342
申请日：1997-02-10
申请人： Akira Yonemizu , Nobukazu Ishizaka , Tomoko Hamada
发明人： Akira Yonemizu , Nobukazu Ishizaka , Tomoko Hamada
IPC分类号： B08B1/04 , B08B7/04 , B08B11/02 , H01L21/00 , H01L21/304
CPC分类号： H01L21/67098 , B08B1/007 , B08B1/04 , B08B11/02 , H01L21/67028
摘要： The present invention provides a cleaning method in which an object to be cleaned is held such that a surface of the object to be cleaned faces a cleaning body and the object to be cleaned and the cleaning body are moved relative to each other in a state where the cleaning body is in contact with the surface to the object to be cleaned, thereby cleaning the surface of the object to be cleaned, wherein a contact pressure of the cleaning body to the surface of the object to be cleaned is set at most 20 gf/cm.sup.2, when the surface is cleaned.
摘要翻译：本发明提供了一种清洁方法，其中待清洁物体被保持成使得待清洁物体的表面面向清洁体，并且待清洁物体和清洁体相对于彼此移动，清洁体与要清洁的物体的表面接触，从而清洁被清洁物体的表面，其中清洁体与被清洁物体的表面的接触压力设定为最多20gf / cm2，当表面被清洁。

7. 发明授权

US5501870A Method and apparatus for hydrophobic treatment 失效
公开(公告)号：US5501870A
公开(公告)日：1996-03-26
申请号：US376393
申请日：1995-01-23
申请人： Masatoshi Shiraishi , Tomoko Hamada
发明人： Masatoshi Shiraishi , Tomoko Hamada
IPC分类号： G03F7/16 , C23C16/44 , C23C16/52 , G03F7/11 , H01L21/00 , H01L21/027 , H01L21/30 , B05D3/02 , C23C16/00
CPC分类号： H01L21/67103 , C23C16/4412 , C23C16/52 , Y10S438/974
摘要： Adhesion apparatus for applying a hydrophobic treatment to a semiconductor wafer comprises a tank housing a treating agent of liquid HMDS and a process chamber into which a mixed gas consisting of a vaporized HMDS coming from the tank and a carrier gas is supplied for applying a hydrophobic treatment to a wafer surface. A supporting table on which the wafer is disposed during the hydrophobic treatment is provided within the process chamber. A heater and a cooling water passageway are housed in the supporting table for controlling the wafer temperature. A concentration measuring section for measuring the HMDS concentration in the waste gas is connected to the discharge pipe of the process chamber. The concentration measuring section is connected to a CPU serving to derive a temperature control signal from the measured value of the HMDS concentration. The temperature control signal is transmitted to a temperature control section. Upon receipt of the temperature control signal, the temperature control section permits controlling the current supply to the heater or the cooling water supply to the cooling water passageway so as to change the temperature of the supporting table.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式