会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method and apparatus providing focal plane array active thermal control elements
    • 提供焦平面阵列有源热控元件的方法和装置
    • US06649913B1
    • 2003-11-18
    • US10084687
    • 2002-02-26
    • Adam M. KennedyMichael RayRichard H. WylesJessica K. WylesWilliam A. Radford
    • Adam M. KennedyMichael RayRichard H. WylesJessica K. WylesWilliam A. Radford
    • G01J500
    • G01J5/061G01J5/20H04N5/33
    • A focal plane array (FPA) of infrared (IR) radiation detectors (20), such as an array of microbolometers, includes an active area (20A) containing a plurality of IR radiation detectors, a readout integrated circuit (ROIC) (12) that is mechanically and electrically coupled to the active area and, disposed on the ROIC, a plurality of heater elements (30A) that are located and operated so as to provide a substantially uniform thermal distribution across at least the active area. The FPA further includes a plurality of temperature sensors (30B), individual ones of which are spatially associated with one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element. In one embodiment pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a top or a bottom surface of the ROIC, while in another embodiment pairs of the heater elements and associated temperature sensors, or only the heater elements, are distributed in accordance with a predetermined thermal profile of the FPA. The plurality of heater elements may each be composed of a silicon resistance, and the plurality of temperature sensors may each be each composed of a silicon temperature sensor.
    • 红外线(IR)辐射探测器(20)的焦平面阵列(FPA),例如微电流计阵列,包括一个包含多个红外辐射探测器的有源区域(20A),一个读出集成电路(ROIC) 机械地和电耦合到有源区域,并且设置在ROIC上,多个加热器元件(30A)被定位和操作以便在至少有效区域上提供基本均匀的热分布。 FPA还包括多个温度传感器(30B),其中单独的温度传感器在空间上与一个加热器元件相关联,用于感测相关联的加热器元件附近的温度,以提供相关加热器元件的闭环操作。 在一个实施例中,成对的加热器元件和相关联的温度传感器以基本上均匀的方式分布在ROIC的至少顶部或底部表面上,而在另一个实施例中,加热器元件和相关联的温度传感器对,或仅加热器 元件,根据FPA的预定热剖面分布。 多个加热器元件可以各自由硅电阻组成,并且多个温度传感器可以各自由硅温度传感器组成。
    • 2. 发明授权
    • Integrated IR, visible and NIR sensor and methods of fabricating same
    • 集成IR,可见光和近红外传感器及其制造方法
    • US5808350A
    • 1998-09-15
    • US778934
    • 1997-01-03
    • Michael D. JackMichael RayRichard H. Wyles
    • Michael D. JackMichael RayRichard H. Wyles
    • G01J5/10G01J5/34H01L27/146H01L37/02H01L31/0256H01L27/148H01L31/0232
    • H01L37/02G01J5/10G01J5/34H01L27/14652
    • An imaging device (10) has a plurality of unit cells that contribute to forming an image of a scene. The imaging device includes a layer of semiconductor material (16), for example silicon, that has low noise photogate charge-mode readout circuitry (20, 21, 26, 28) (e.g., CCD or CMOS readout circuitry and structures) that is disposed upon a first surface (18) of the layer. A second, opposing surface of the layer is a radiation admitting surface of the layer. The layer has a bandgap selected for absorbing electromagnetic radiation having wavelengths shorter than about one micrometer and for generating charge carriers from the absorbed radiation. The generated charge carriers are collected by the photogate charge-mode readout circuitry. A thermal sensing element (22) is disposed above and is thermally isolated from the first surface of the layer. The thermal sensing element may be, by example, one of a bolometer element, a pyroelectric element, or a thermopile element. A layer (12) of narrower bandgap semiconductor material can also be employed with this invention, wherein the layer of narrower bandgap semiconductor material (such as InGaAs or HgCdTe) is atomically bonded to the second surface along a heterojunction interface that is continuous or apertured across the second surface. The bonded layer is used to absorb NIR and visible light.
    • 成像装置(10)具有有助于形成场景图像的多个单位单元。 该成像装置包括半导体材料层(16),例如硅,其具有低噪声光栅充电模式读出电路(20,21,26,28)(例如,CCD或CMOS读出电路和结构),其被布置 在该层的第一表面(18)上。 层的第二相对表面是该层的辐射入射表面。 该层具有选择用于吸收波长短于约一微米的电磁辐射的带隙,并用于从吸收的辐射产生电荷载流子。 产生的电荷载流子由光栅充电模式读出电路收集。 热敏元件(22)设置在层的第一表面的上方并与之隔离。 热敏元件可以是例如测辐射热计元件,热电元件或热电堆元件之一。 窄带隙半导体材料的层(12)也可以用于本发明,其中较窄带隙半导体材料(例如InGaAs或HgCdTe)的层沿着连续或有孔跨越的异质结界面原子键合到第二表面 第二个表面。 接合层用于吸收近红外和可见光。
    • 4. 发明授权
    • IRFPA ROIC with dual TDM reset integrators and sub-frame averaging functions per unit cell
    • 具有双TDM复位积分器的IRFPA ROIC和每个单元的子帧平均功能
    • US06885002B1
    • 2005-04-26
    • US09945518
    • 2001-08-31
    • James A. FinchRoger W. GrahamStephen H. BlackJerry A. WilsonRichard H. Wyles
    • James A. FinchRoger W. GrahamStephen H. BlackJerry A. WilsonRichard H. Wyles
    • H01L20060101H01L25/00H01L27/146H01L31/00H04N5/33
    • H04N5/3594H01L27/14652H01L2924/0002H04N5/33H04N5/332H04N2209/047H01L2924/00
    • A unit cell (10) of a readout integrated circuit is constructed and operated so as to temporally align an image obtained in a first spectral band with a an image obtained in a second spectral band. A method operates, during a frame period, to sub-frame average a first signal detected in the first spectral band by a multi-spectral detector (12), to sub-frame average a first signal detected in the second spectral band by the multi-spectral detector, and to sub-frame average a second signal detected in the first spectral band by the multi-spectral detector. The method then reads out the sub-frame averaged signals for each spectral band. The sub-frame averaged may be read out simultaneously from the unit cell. When sub-frame averaging the first and second signals in the first spectral band the method performs a plurality of consecutive sub-integrations and stores the result of each sub-integration on a first sub-frame averaging capacitance, and when sub-frame averaging the first signal of the second spectral band the method performs a single integration of the second signal, and stores the result of the integration on a second sub-frame averaging capacitance. The first spectral band may correspond to long wavelength infrared radiation (LWIR), and the second spectral band may correspond to medium wavelength infrared radiation (MWIR).
    • 读出集成电路的单位单元(10)被构造和操作,以使得在第一频谱带中获得的图像与在第二频谱带中获得的图像在时间上对准。 一种方法在帧周期期间,通过多光谱检测器(12)对在第一光谱带中检测到的第一信号进行子帧平均化,以将第二光谱带中检测到的第一信号平均化为多 光谱检测器,并且通过多光谱检测器对在第一光谱带中检测到的第二信号进行子帧平均化。 该方法然后读出每个频谱带的子帧平均信号。 可以从单位单元同时读出平均的子帧。 当子帧对第一频谱带中的第一和第二信号进行平均时,该方法执行多个连续子积分,并将每个子积分的结果存储在第一子帧平均电容上,并且当子帧对 第二频谱带的第一信号,该方法执行第二信号的单次积分,并将积分的结果存储在第二子帧平均电容上。 第一光谱带可以对应于长波长红外辐射(LWIR),第二光谱带可以对应于中波长红外辐射(MWIR)。
    • 5. 发明授权
    • Multipurpose readout integrated circuit with in cell adaptive
non-uniformity correction and enhanced dynamic range
    • 多通道读出集成电路,具有单元自适应非均匀性校正和增强的动态范围
    • US6040568A
    • 2000-03-21
    • US073408
    • 1998-05-06
    • John T. CaulfieldRichard H. WylesJohn D. SchlesselmannKevin L. Pettijohn
    • John T. CaulfieldRichard H. WylesJohn D. SchlesselmannKevin L. Pettijohn
    • H04N5/33H04N5/365H04N5/378H01L25/00
    • H04N5/365H04N5/33H01L2924/0002
    • An IR-FPA (10) having a plurality of radiation detectors (2a) and a multipurpose ROIC (2) is disclosed. The radiation detectors (2a) are organized as a two dimensional array. The multipurpose ROIC (2) includes a plurality of readout circuit unit cells, individual ones of which are coupled to individual radiation detectors (2a) for receiving electrical signals therefrom. Each of the readout circuit unit cells operates in one of a first mode to provide a corrected m frame averaged output signal (Vout.sub.THPF) or, a second mode to provide a subframed averaged output signal (Vout.sub.2). In the first operating mode, a high pass filtering circuit subtracts a low frequency charge pedestal from the electrical signal to form the corrected m frame averaged output (Vout.sub.THPF). Also disclosed is a method for operating an array of radiation detectors (2a) which includes the steps of: within a sampling period that defines a frame comprised of subframe periods, generating an electrical signal in individual ones of the radiation detectors, the electrical signals being generated in response to incident radiation; in a first operating mode, forming a high pass filtered output signal (Vout.sub.THPF) from electrical signals generated during at least one frame period; in a second operating mode, forming a subframe averaged output signal (Vout.sub.2) from electrical signals generated during a frame period; and reading out, in the first operating mode, the high pass filtered output signal (Vout.sub.THPF) or, in the second operating mode, the subframe averaged output signal (Vout.sub.2).
    • 公开了具有多个辐射检测器(2a)和多用途ROIC(2)的IR-FPA(10)。 辐射检测器(2a)被组织为二维阵列。 多用途ROIC(2)包括多个读出电路单位单元,其中各个耦合到各个辐射检测器(2a),用于从其接收电信号。 每个读出电路单元以第一模式中的一个工作,以提供校正的m帧平均输出信号(VoutTHPF),或者提供次级平均输出信号(Vout2)的第二模式。 在第一操作模式中,高通滤波电路从电信号中减去低频电荷基座,以形成校正后的m帧平均输出(VoutTHPF)。 还公开了一种用于操作辐射检测器(2a)阵列的方法,其包括以下步骤:在定义由子帧周期组成的帧的采样周期内,在各个辐射检测器中产生电信号,电信号为 响应入射辐射而产生的; 在第一操作模式中,从在至少一个帧周期期间产生的电信号形成高通滤波输出信号(VoutTHPF); 在第二操作模式中,从在帧周期期间产生的电信号形成子帧平均输出信号(Vout2); 并且在第一操作模式中读出高通滤波输出信号(VoutTHPF),或者在第二操作模式下读出子帧平均输出信号(Vout2)。
    • 6. 发明授权
    • 3-transistor source follower-per-detector unit cell for 2-dimensional
focal plane arrays
    • 用于二维焦平面阵列的3晶体管源跟随器 - 每检测器单元
    • US5083016A
    • 1992-01-21
    • US500819
    • 1990-03-27
    • Richard H. WylesDavid Madajian
    • Richard H. WylesDavid Madajian
    • H04N5/33H04N5/365H04N5/374H04N5/378
    • H04N3/1512H04N5/33
    • A Source-Follower-per-Detector (SFD) unit cell [12'], a two dimensional array [30] of same and a method of operating the two dimensional array. Each unit cell is constructed with but three transistors [14, 16, 22] and is coupled to an associated radiation detector [10] for receiving an output signal therefrom. A method includes a first step of (a) reading out a first row (N) of unit cells by asserting a first row enable signal for causing each of the unit cells of the row (N) to impress an electrical signal onto an associated output signal line. The electrical signal has a magnitude that is a function of the associated detector output signal. The method includes an additional step of (b) simultaneously resetting another row of unit cells each of which has a reset input coupled to and responsive to the assertion of the first row enable signal line.
    • 每个探测器源单元(SFD)单元[12'],二维阵列[30]以及二维阵列的操作方法。 每个单位单元被构造为具有三个晶体管[14,16,22],并且耦合到相关联的辐射检测器[10],用于从其接收输出信号。 一种方法包括以下步骤:(a)通过断言第一行使能信号来读出第一行(N),使得行(N)的每个单位单元将电信号压印到相关输出上 信号线。 电信号具有作为相关联的检测器输出信号的函数的幅度。 该方法包括以下附加步骤:(b)同时复位另一行单元,每个单元具有耦合到第一行使能信号线的断言并响应于第一行使能信号线的断言的复位输入。
    • 8. 发明授权
    • High charge capacity focal plane array readout cell
    • 高电荷容量焦平面阵列读出单元
    • US5128534A
    • 1992-07-07
    • US554238
    • 1990-07-17
    • Richard H. WylesAlbert E. Cosand
    • Richard H. WylesAlbert E. Cosand
    • H04N5/217H04N5/33H04N5/355H04N5/357H04N5/374H04N5/378
    • H04N5/357H04N5/355H04N5/33
    • A high charge capacity readout cell in a hybrid focal plane detector array on a complementary metal oxide semiconductor integrated circuit chip. An input transistor that provides a buffer for the detectors of the array, couples to a source of bias voltage, which controls the operation of the transistor. An integrating capacitor uses a variable source of terminating voltage to increase the amount of charge it integrates. A read signal causes an output transistor to read the charge from the capacitor to a readout line and to initialize the capacitor. The termination voltage of the integrating capacitor is changed during the time that the detector current is integrated, thus increasing the change in total voltage across the capacitor. This allows a greater amount of charge to be integrated with the capacitor which improves the signal-to-noise ratio of the focal plane array.
    • 在补充金属氧化物半导体集成电路芯片上的混合焦平面检测器阵列中的高电荷容量读出单元。 提供用于阵列的检测器的缓冲器的输入晶体管耦合到控制晶体管的操作的偏置电压源。 积分电容器使用可变的终端电压源来增加其积分的电荷量。 读取信号使输出晶体管从电容器读取电荷到读出线并初始化电容器。 积分电容器的终止电压在检测器电流积分的时间内改变,从而增加电容器两端的总电压变化。 这允许更大量的电荷与电容器集成,这提高了焦平面阵列的信噪比。
    • 10. 发明授权
    • Analog load driver
    • 模拟负载驱动
    • US06587001B1
    • 2003-07-01
    • US10255415
    • 2002-09-25
    • Richard H. WylesJohn L. Vampola
    • Richard H. WylesJohn L. Vampola
    • H03F304
    • H03F3/3037H03F2200/375H03F2200/471
    • An electronic circuit device for driving a load comprises a load terminal, a control terminal and a power terminal for connection to a source of electric power. The load terminal may be in an emitter or a source circuit of the circuit device, and connects to a power supply return terminal by means of three electric elements connected in parallel, namely, the capacitance of a load, a bias current supply, and a current bypass. A voltage sensor is connected between the control terminal and the load terminal for sensing a voltage drop developed between the control terminal and the load terminal. The voltage sensor it is operative to activate the bypass to conduct current in parallel with current flow of the current source in the situation wherein the voltage drop exceeds a threshold. Thereby, the circuit device drives the load in one direction, and the current source and the bypass drive the load in the opposite correction.
    • 用于驱动负载的电子电路装置包括负载端子,控制端子和用于连接到电力源的电源端子。 负载端子可以位于电路装置的发射极或源电路中,并且通过并联连接的三个电气元件,即负载的电容,偏置电流源和 电流旁路。 电压传感器连接在控制端子和负载端子之间,用于感测在控制端子和负载端子之间产生的电压降。 在电压降超过阈值的情况下,电压传感器用于激活旁路以与电流源的电流并行地导通电流。 因此,电路装置在一个方向上驱动负载,并且电流源和旁路在相反的校正中驱动负载。