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1. 发明授权

US06885002B1 IRFPA ROIC with dual TDM reset integrators and sub-frame averaging functions per unit cell 有权
标题翻译：具有双TDM复位积分器的IRFPA ROIC和每个单元的子帧平均功能
公开(公告)号：US06885002B1
公开(公告)日：2005-04-26
申请号：US09945518
申请日：2001-08-31
申请人： James A. Finch , Roger W. Graham , Stephen H. Black , Jerry A. Wilson , Richard H. Wyles
发明人： James A. Finch , Roger W. Graham , Stephen H. Black , Jerry A. Wilson , Richard H. Wyles
IPC分类号： H01L20060101 , H01L25/00 , H01L27/146 , H01L31/00 , H04N5/33
CPC分类号： H04N5/3594 , H01L27/14652 , H01L2924/0002 , H04N5/33 , H04N5/332 , H04N2209/047 , H01L2924/00
摘要： A unit cell (10) of a readout integrated circuit is constructed and operated so as to temporally align an image obtained in a first spectral band with a an image obtained in a second spectral band. A method operates, during a frame period, to sub-frame average a first signal detected in the first spectral band by a multi-spectral detector (12), to sub-frame average a first signal detected in the second spectral band by the multi-spectral detector, and to sub-frame average a second signal detected in the first spectral band by the multi-spectral detector. The method then reads out the sub-frame averaged signals for each spectral band. The sub-frame averaged may be read out simultaneously from the unit cell. When sub-frame averaging the first and second signals in the first spectral band the method performs a plurality of consecutive sub-integrations and stores the result of each sub-integration on a first sub-frame averaging capacitance, and when sub-frame averaging the first signal of the second spectral band the method performs a single integration of the second signal, and stores the result of the integration on a second sub-frame averaging capacitance. The first spectral band may correspond to long wavelength infrared radiation (LWIR), and the second spectral band may correspond to medium wavelength infrared radiation (MWIR).
摘要翻译：读出集成电路的单位单元（10）被构造和操作，以使得在第一频谱带中获得的图像与在第二频谱带中获得的图像在时间上对准。一种方法在帧周期期间，通过多光谱检测器（12）对在第一光谱带中检测到的第一信号进行子帧平均化，以将第二光谱带中检测到的第一信号平均化为多光谱检测器，并且通过多光谱检测器对在第一光谱带中检测到的第二信号进行子帧平均化。该方法然后读出每个频谱带的子帧平均信号。可以从单位单元同时读出平均的子帧。当子帧对第一频谱带中的第一和第二信号进行平均时，该方法执行多个连续子积分，并将每个子积分的结果存储在第一子帧平均电容上，并且当子帧对第二频谱带的第一信号，该方法执行第二信号的单次积分，并将积分的结果存储在第二子帧平均电容上。第一光谱带可以对应于长波长红外辐射（LWIR），第二光谱带可以对应于中波长红外辐射（MWIR）。

2. 发明授权

US09022584B2 Protecting an optical surface 有权
标题翻译：保护光学表面
公开(公告)号：US09022584B2
公开(公告)日：2015-05-05
申请号：US13300947
申请日：2011-11-21
申请人： Stephen H. Black , Thomas A. Kocian , Buu Q. Diep
发明人： Stephen H. Black , Thomas A. Kocian , Buu Q. Diep
IPC分类号： G02B27/00 , G02B1/11 , G02B1/10
CPC分类号： G02B1/11 , G02B1/105 , G02B1/14 , Y10T156/10
摘要： According to one embodiment, a method includes receiving a light beam at an anti-reflective layer of optically transmissive material. The anti-reflective layer has an outer surface disposed within a recess of a protective layer of optically transmissive material, such that the outer surface is protected by the recess and the protective layer from being contacted. The outer surface is further disposed along an optical path of an optical device disposed inwardly from the outer surface. The anti-reflective layer has an average cross-sectional thickness that is less than an average cross-sectional thickness of the protective layer. The method further includes modulating the light beam using the anti-reflective layer.
摘要翻译：根据一个实施例，一种方法包括在光学透射材料的抗反射层处接收光束。抗反射层具有设置在光学透射材料的保护层的凹部内的外表面，使得外表面被凹部保护并且保护层不被接触。外表面还沿着从外表面向内设置的光学装置的光路进一步设置。抗反射层的平均截面厚度小于保护层的平均截面厚度。该方法还包括使用抗反射层调制光束。

3. 发明授权

US08980676B2 Fabrication of window cavity cap structures in wafer level packaging 有权
标题翻译：在晶圆级封装中制作窗孔盖结构
公开(公告)号：US08980676B2
公开(公告)日：2015-03-17
申请号：US13532180
申请日：2012-06-25
申请人： Buu Diep , Stephen H. Black
发明人： Buu Diep , Stephen H. Black
IPC分类号： H01L21/00 , G01J5/02 , G01J5/04 , G01J5/20 , H01L31/0203 , H01L31/09
CPC分类号： G01J5/0235 , G01J5/024 , G01J5/045 , G01J5/20 , G01J2005/202 , H01L31/0203 , H01L31/09 , H01L2924/0002 , H01L2924/0001
摘要： A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a second substrate, at the front side of the first substrate; removing a back side of the first substrate so as to expose the plurality of cavities, thereby defining the WCW structure comprising the second substrate and a plurality of vertical supports comprised of material of the first substrate.
摘要翻译：一种形成半导体器件的盖帽晶片（WCW）结构的方法包括将多个空腔加工成第一基板的正面; 在第一基板的前侧将第一基板接合到第二基板; 去除第一基板的背面以暴露多个空腔，从而限定包括第二基板的WCW结构和由第一基板的材料构成的多个垂直支撑件。

4. 发明授权

US08809784B2 Incident radiation detector packaging 有权
标题翻译：入射辐射探测器包装
公开(公告)号：US08809784B2
公开(公告)日：2014-08-19
申请号：US13275635
申请日：2011-10-18
申请人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
发明人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Buu Diep
IPC分类号： G01J5/00 , G01J5/04 , H01L27/146 , H01L23/10 , B81B7/00
CPC分类号： H01L27/14618 , B81B7/0077 , G01J5/045 , H01L23/10 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L27/14683 , H01L2224/04026 , H01L2224/05073 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05187 , H01L2224/05563 , H01L2224/05582 , H01L2224/05644 , H01L2224/05669 , H01L2224/29011 , H01L2224/29013 , H01L2224/291 , H01L2224/29144 , H01L2224/32225 , H01L2224/83815 , H01L2224/94 , H01L2924/0002 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/04941 , H01L2924/05341 , H01L2924/014 , H01L2224/83 , H01L2924/0105
摘要： In accordance with particular embodiments, a method for packaging an incident radiation detector includes depositing an opaque solder resistant material on a first surface of a transparent lid substrate configured to cover at least one detector. The method also includes forming at least one cavity in the lid substrate. The method further includes forming a first portion of at least one hermetic seal ring on the opaque solder resistant material. The first portion of each hermetic seal ring surrounds a perimeter of a corresponding cavity in the lid substrate. The method also includes aligning the first portion of the at least one hermetic seal ring with a second portion of the at least one hermetic seal ring. The method additionally includes bonding the first portion of the at least one hermetic seal ring with the second portion of the at least one hermetic seal ring with solder.
摘要翻译：根据具体实施例，一种用于封装入射辐射检测器的方法包括在透明盖基板的第一表面上沉积不透明的阻焊材料，该第一表面被构造成覆盖至少一个检测器。该方法还包括在盖基板中形成至少一个空腔。该方法还包括在不透明的耐焊材料上形成至少一个密封环的第一部分。每个气密密封环的第一部分围绕盖衬底中的相应空腔的周边。该方法还包括将至少一个密封环的第一部分与至少一个密封环的第二部分对准。该方法还包括用焊料将至少一个气密密封环的第一部分与至少一个密封环的第二部分接合。

5. 发明申请

US20130344638A1 Fabrication of Window Cavity Cap Structures in Wafer Level Packaging 有权
标题翻译：晶圆级封装中窗孔盖结构的制作
公开(公告)号：US20130344638A1
公开(公告)日：2013-12-26
申请号：US13532180
申请日：2012-06-25
申请人： Buu Diep , Stephen H. Black
发明人： Buu Diep , Stephen H. Black
IPC分类号： B32B38/10 , H01L31/18
CPC分类号： G01J5/0235 , G01J5/024 , G01J5/045 , G01J5/20 , G01J2005/202 , H01L31/0203 , H01L31/09 , H01L2924/0002 , H01L2924/0001
摘要： A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a second substrate, at the front side of the first substrate; removing a back side of the first substrate so as to expose the plurality of cavities, thereby defining the WCW structure comprising the second substrate and a plurality of vertical supports comprised of material of the first substrate.
摘要翻译：一种形成半导体器件的盖帽晶片（WCW）结构的方法包括将多个空腔加工成第一基板的正面; 在第一基板的前侧将第一基板接合到第二基板; 去除第一基板的背面以暴露多个空腔，从而限定包括第二基板的WCW结构和由第一基板的材料构成的多个垂直支撑件。

6. 发明申请

US20120281113A1 USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIP 审中-公开
标题翻译：在包装中使用多芯片系统（MCSiP）在成像应用中成本低成本，小尺寸相机在芯片上
公开(公告)号：US20120281113A1
公开(公告)日：2012-11-08
申请号：US13164432
申请日：2011-06-20
申请人： Adam M. Kennedy , Stephen H. Black , Stefan Theodor Anton Baur
发明人： Adam M. Kennedy , Stephen H. Black , Stefan Theodor Anton Baur
IPC分类号： H04N5/225 , H04N5/222 , H04N5/76 , H01L31/18
CPC分类号： H04N5/2257 , H01L27/14618 , H01L2224/48091 , H01L2224/48465 , H04N5/33 , H04N5/335 , H01L2924/00014 , H01L2924/00
摘要： According to some embodiments, a camera includes a multi-chip system in a package (MCSiP). The MCSiP comprising a set of electronics, an encapsulate, and a plurality of interconnects. The set of electronics includes a plurality of bare integrated circuit dies and other passive or active electronic components. Each die is operable to provide a functional component of a computing system operable to receive a signal describing electromagnetic radiation detected by an imaging sensor and facilitate generating an image according to the signal. The encapsulate comprises an adhesive molding compound deposited outwardly from the set of electronics in order to hold the set of electronics in position. The interconnects communicatively couple each die to other dies, the other electronic components, or components external to the MCSiP.
摘要翻译：根据一些实施例，相机包括封装（MCSiP）中的多芯片系统。 MCSiP包括一组电子器件，封装和多个互连。该组电子器件包括多个裸露集成电路管芯和其它无源或有源电子部件。每个管芯可操作以提供计算系统的功能部件，其可操作以接收描述由成像传感器检测到的电磁辐射的信号，并且便于根据该信号生成图像。包封物包括从该组电子装置向外沉积的粘合剂模塑料，以便将该组电子器件保持就位。互连通信地将每个管芯耦合到其它管芯，其它电子部件或MCSiP外部的部件。

7. 发明授权

US08044355B2 System and method for viewing an area using an optical system positioned inside of a dewar 有权
标题翻译：使用位于杜瓦瓶内部的光学系统观察区域的系统和方法
公开(公告)号：US08044355B2
公开(公告)日：2011-10-25
申请号：US11777020
申请日：2007-07-12
申请人： Robert C. Gibbons , Stephen H. Black , Richard N. Mullins
发明人： Robert C. Gibbons , Stephen H. Black , Richard N. Mullins
IPC分类号： G01J5/02 , G01J5/04
CPC分类号： G01J5/061 , G01J5/08 , G01J5/0806 , G01J5/0843 , G02B7/028 , G02B23/2492
摘要： According to one embodiment of the present invention, a system for viewing an area includes a dewar and an optical system positioned within the dewar. The dewar permits operation of the flux detector at cryogenic temperatures, in some embodiments. The optical system includes an infrared radiation system capable of focusing one or more light beams. The inclusion of the optical system within the cryogenic space of the dewar allows reduction of the overall system length and weight, if desired.
摘要翻译：根据本发明的一个实施例，用于观看区域的系统包括位于杜瓦瓶内的杜瓦瓶和光学系统。在一些实施方案中，杜瓦瓶允许通量检测器在低温温度下操作。光学系统包括能够聚焦一个或多个光束的红外辐射系统。如果需要，将光学系统包含在杜瓦瓶的低温空间内允许减小整个系统的长度和重量。

8. 发明申请

US20110199578A1 Imaging System 有权
标题翻译：成像系统
公开(公告)号：US20110199578A1
公开(公告)日：2011-08-18
申请号：US13026854
申请日：2011-02-14
申请人： Stephen H. Black , Andrew D. Portnoy , Alan G. Silver
发明人： Stephen H. Black , Andrew D. Portnoy , Alan G. Silver
IPC分类号： A61B3/14 , A61B3/10
CPC分类号： A61B3/12 , H04N5/341 , H04N5/3454 , H04N5/3456 , H04N5/3696
摘要： According to certain embodiments, foveal array elements of a foveal region of a focal plane array are sampled at a faster sampling rate to yield foveal array data. Peripheral array elements of a peripheral region of the focal plane array are sampled at a slower sampling rate or sparser sampling density to yield peripheral array data. The foveal array data is processed to yield foveal image data for a foveal region of a display. The peripheral array data is processed to yield peripheral image data for a peripheral region of the display.
摘要翻译：根据某些实施例，焦平面阵列的中心凹区域的中心凹阵列元件以更快的采样率被采样以产生中心凹阵列数据。以较慢的采样率或较稀疏采样密度对焦平面阵列的外围区域的外围阵列元件进行采样，以产生外围阵列数据。处理中心凹阵列数据以产生显示器的中心凹区域的中心凹图像数据。外围阵列数据被处理以产生显示器的外围区域的外围图像数据。

9. 发明授权

US08653467B2 Multichip packaging for imaging system 有权
标题翻译：用于成像系统的多芯片包装
公开(公告)号：US08653467B2
公开(公告)日：2014-02-18
申请号：US13526919
申请日：2012-06-19
申请人： Stephen H. Black , Michael A. Gritz , Adam M. Kennedy
发明人： Stephen H. Black , Michael A. Gritz , Adam M. Kennedy
IPC分类号： G01T1/24
CPC分类号： G01S13/89 , G01S2007/028 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2223/6655 , H01L2223/6677 , H01L2224/04105 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01Q1/2283 , H01Q21/0006
摘要： A receiver chip for use in an imaging system includes a plurality of receiver dies, each of the receiver dies comprising one or more receiver circuits; a die interconnection layer located on top of the plurality of receiver dies; a quarter wave dielectric layer located on top of the die interconnection layer; and a plurality of antennae located on the quarter wave dielectric layer, each of the plurality of antennae corresponding to a respective receiver circuit, wherein the plurality of antennae are connected to the one or more receiver circuits through the quarter wave dielectric layer and the die interconnection layer by respective vias, such that a distance between a topmost layer of the die interconnection layer and the plurality of antennae is determined by a thickness of the quarter wave dielectric layer.
摘要翻译：用于成像系统的接收器芯片包括多个接收器管芯，每个接收器管芯包括一个或多个接收器电路; 位于所述多个接收器管芯的顶部上的管芯互连层; 位于芯片互连层顶部的四分之一波长介电层; 以及位于所述四分之一波长介电层上的多个天线，所述多个天线中的每一个对应于相应的接收器电路，其中所述多个天线通过所述四分之一波长介电层连接到所述一个或多个接收器电路，并且所述管芯互连使得芯片互连层的最上层与多个天线之间的距离由四分之一波长介电层的厚度确定。

10. 发明申请

US20130334425A1 Multichip Packaging for Imaging System 有权
标题翻译：成像系统的多芯片包装
公开(公告)号：US20130334425A1
公开(公告)日：2013-12-19
申请号：US13526919
申请日：2012-06-19
申请人： Stephen H. Black , Michael A. Gritz , Adam M. Kennedy
发明人： Stephen H. Black , Michael A. Gritz , Adam M. Kennedy
IPC分类号： H01L27/146
CPC分类号： G01S13/89 , G01S2007/028 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2223/6655 , H01L2223/6677 , H01L2224/04105 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01Q1/2283 , H01Q21/0006
摘要： A receiver chip for use in an imaging system includes a plurality of receiver dies, each of the receiver dies comprising one or more receiver circuits; a die interconnection layer located on top of the plurality of receiver dies; a quarter wave dielectric layer located on top of the die interconnection layer; and a plurality of antennae located on the quarter wave dielectric layer, each of the plurality of antennae corresponding to a respective receiver circuit, wherein the plurality of antennae are connected to the one or more receiver circuits through the quarter wave dielectric layer and the die interconnection layer by respective vias, such that a distance between a topmost layer of the die interconnection layer and the plurality of antennae is determined by a thickness of the quarter wave dielectric layer.
摘要翻译：用于成像系统的接收器芯片包括多个接收器管芯，每个接收器管芯包括一个或多个接收器电路; 位于所述多个接收器管芯的顶部上的管芯互连层; 位于芯片互连层顶部的四分之一波长介电层; 以及位于所述四分之一波长介电层上的多个天线，所述多个天线中的每一个对应于相应的接收器电路，其中所述多个天线通过所述四分之一波长介电层连接到所述一个或多个接收器电路，并且所述管芯互连使得芯片互连层的最上层与多个天线之间的距离由四分之一波长介电层的厚度确定。

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