专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08882259B2 Recording apparatus 有权
标题翻译：记录装置
公开(公告)号：US08882259B2
公开(公告)日：2014-11-11
申请号：US13569918
申请日：2012-08-08
申请人： Tsuneyuki Sasaki , Yoichi Kobayashi
发明人： Tsuneyuki Sasaki , Yoichi Kobayashi
IPC分类号： B41J11/00
CPC分类号： B41J11/0015 , B41J2/04515 , B41J2/04538 , B41J2/0454 , B41J2/04563 , B41J11/002
摘要： A recording apparatus includes a support member that supports a recording medium, a heating device that heats the recording medium on the support member, a recording head that ejects fluid onto the recording medium on the support member and that is positioned between the support member and the heating device, a blower that has a blowing port from which gas is blown, and a carriage that moves and has the recording head mounted thereon. The carriage has an enclosing structure inside which at least part of the gas blown from the blowing port is taken and inside which a gas layer in which the gas flows is formed between the recording head and the heating device.
摘要翻译：记录装置包括支撑记录介质的支撑构件，加热支撑构件上的记录介质的加热装置，将流体喷射到支撑构件上的记录介质上并且位于支撑构件和支撑构件之间的记录头加热装置，具有吹出气体的吹出口的鼓风机和安装在其上的记录头移动的滑架。滑架具有封闭结构，在该封闭结构中，从吹出口吹入的气体的至少一部分被取出，其中在记录头和加热装置之间形成有气体流动的气体层。

2. 发明授权

US08554356B2 Processing end point detection method, polishing method, and polishing apparatus 有权
标题翻译：处理终点检测方法，抛光方法和抛光装置
公开(公告)号：US08554356B2
公开(公告)日：2013-10-08
申请号：US12311560
申请日：2007-10-05
申请人： Noburu Shimizu , Shinro Ohta , Koji Maruyama , Yoichi Kobayashi , Ryuichiro Mitani , Shunsuke Nakai , Atsushi Shigeta
发明人： Noburu Shimizu , Shinro Ohta , Koji Maruyama , Yoichi Kobayashi , Ryuichiro Mitani , Shunsuke Nakai , Atsushi Shigeta
IPC分类号： G06F19/00 , G01B11/00 , B24B49/00 , B24B51/00 , G05B19/406 , G05B19/4065 , G01B11/06 , B24B49/16 , B24B49/12
CPC分类号： B24B49/04 , B24B37/013 , B24B49/12 , B24B49/16 , B24D7/12 , G01B11/0675 , G01N21/55 , G01N21/9501 , G05B19/406 , G05B19/4065 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.
摘要翻译：处理终点检测方法通过计算诸如基板的工件（抛光对象）的表面的特性值来检测处理终点的定时（例如，抛光停止，改变抛光条件）。该方法包括：基于频谱波形，使用基准工件或模拟计算，产生指示处理终点处的反射强度与波长之间的关系的光谱波形，选择局部最大值的波长和局部最小值的局部最小值反射强度，从所选择的波长的反射强度计算相对于要处理的表面的特征值，将作为处理终点的处理终点处的特征值的特征时间变化设定为特征值并且通过在工件的加工期间检测特征点来检测工件的加工终点。

3. 发明授权

US08398456B2 Polishing method, polishing apparatus and method of monitoring a substrate 有权
标题翻译：抛光方法，抛光装置和监测基板的方法
公开(公告)号：US08398456B2
公开(公告)日：2013-03-19
申请号：US12767095
申请日：2010-04-26
申请人： Yoichi Kobayashi , Yasumasa Hiroo
发明人： Yoichi Kobayashi , Yasumasa Hiroo
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B49/00
摘要： A method of polishing a substrate includes rotating a polishing table having a polishing surface, holding the substrate by a top ring, bringing the substrate into contact with the polishing surface while swinging and rotating the top ring to polish the substrate, and monitoring a surface condition of the substrate by a monitoring sensor. A rotational speed of the polishing table and conditions of swing motion of the top ring are determined such that a position of the monitoring sensor, a position of a center of rotation of the top ring, and a direction of the swing motion of the top ring at a point of time when a predetermined period of time has elapsed after polishing of the substrate is started approximately coincide with their previous values at a point of time before the predetermined period of time has elapsed.
摘要翻译：抛光衬底的方法包括旋转具有抛光表面的抛光台，通过顶环保持衬底，使得衬底与抛光表面接触，同时摆动并旋转顶环以抛光衬底，并且监测表面条件通过监测传感器。确定抛光台的旋转速度和顶环的摆动运动的条件，使得监测传感器的位置，顶环的旋转中心的位置和顶环的摆动运动的方向在基板的研磨开始经过规定时间后的时间点，与经过了规定时间之前的时间点的先前值大致一致。

4. 发明申请

US20130044171A1 RECORDING APPARATUS 审中-公开
标题翻译：录音设备
公开(公告)号：US20130044171A1
公开(公告)日：2013-02-21
申请号：US13563306
申请日：2012-07-31
申请人： Tsuneyuki SASAKI , Yoichi KOBAYASHI
发明人： Tsuneyuki SASAKI , Yoichi KOBAYASHI
IPC分类号： B41J2/01
CPC分类号： B41J11/002
摘要： A recording apparatus includes a recording portion that ejects liquid onto a recording medium which is transported in a transportation direction so as to perform recording processing, a first infrared heating portion that is arranged at a recording surface side of the recording medium, and irradiates the recording medium on which the recording processing has been performed by the recording portion with infrared rays having wavelengths which are easy to be absorbed by water contained in the liquid, and a second infrared heating portion that is arranged at the recording surface side of the recording medium at the downstream side with respect to the first infrared heating portion in the transportation direction, and irradiates the recording medium which has been heated by the first infrared heating portion with infrared rays having wavelengths which are easy to be absorbed by a solvent contained in the liquid.
摘要翻译：记录装置包括将液体喷射到记录介质上的记录部分，该记录介质沿传送方向传送以进行记录处理;第一红外加热部分，布置在记录介质的记录表面侧，并且将记录由记录部分进行的记录处理的介质具有波长容易被包含在液体中的水所吸收的波长的红外线;以及第二红外线加热部分，其布置在记录介质的记录表面侧在输送方向相对于第一红外线加热部分的下游侧，并且用具有容易被包含在液体中的溶剂吸收的波长的红外线照射被第一红外线加热部分加热的记录介质。

5. 发明申请

US20120224005A1 LIQUID EJECTION APPARATUS 有权
标题翻译：液体喷射装置
公开(公告)号：US20120224005A1
公开(公告)日：2012-09-06
申请号：US13409481
申请日：2012-03-01
申请人： Takashi KOASE , Yoichi KOBAYASHI , Tsuneyuki SASAKI , Masako FUKUDA
发明人： Takashi KOASE , Yoichi KOBAYASHI , Tsuneyuki SASAKI , Masako FUKUDA
IPC分类号： B41J2/01
CPC分类号： B41J11/002
摘要： There is provided a liquid ejection apparatus in which convection generated by a convection generation unit does not give an influence on an irradiation unit, ink can be heated and dried sufficiently, and bleeding can be suppressed from occurring. The liquid ejection apparatus includes a head unit which has a nozzle for ejecting liquid onto a recording medium, a carriage which makes the head unit relatively scan the recording medium, an infrared ray irradiation unit which is provided at a vertically upper side of the carriage in a scanning direction of the carriage and irradiates the recording medium with infrared rays, a convection generation unit which is provided at a vertically upper side of the carriage in the scanning direction of the carriage and generates convection on the recording medium, and a separation wall which is provided between the infrared ray irradiation unit and the convection generation unit.
摘要翻译：提供了一种液体喷射装置，其中由对流产生单元产生的对流对照射单元不产生影响，可以充分地加热和干燥油墨，并且可以抑制出血。液体喷射装置包括：头单元，其具有用于将液体喷射到记录介质上的喷嘴;使头单元相对地扫描记录介质的滑架;设置在滑架的垂直上侧的红外线照射单元滑架的扫描方向并且用红外线照射记录介质;对流产生单元，其设置在托架的垂直上方沿托架的扫描方向并在记录介质上产生对流;以及分隔壁，设置在红外线照射单元和对流发生单元之间。

6. 发明申请

US20110216328A1 POLISHING MONITORING METHOD, POLISHING METHOD, AND POLISHING MONITORING APPARATUS 有权
标题翻译：抛光监测方法，抛光方法和抛光监测装置
公开(公告)号：US20110216328A1
公开(公告)日：2011-09-08
申请号：US13034903
申请日：2011-02-25
申请人： Yoichi KOBAYASHI
发明人： Yoichi KOBAYASHI
IPC分类号： G01B11/06
CPC分类号： G01N21/9501 , B24B37/013 , B24B49/12 , G01B11/06 , H01L21/304
摘要： A method capable of accurately monitoring progress of polishing and capable of detecting an accurate polishing end point is provided. The method includes: directing light to the substrate during polishing of the substrate; receiving reflected light from the substrate; measuring intensity of the reflected light at each wavelength; producing spectrum indicating relationship between intensity and wavelength from measured values of the intensity; calculating an amount of change in the spectrum per predetermined time; integrating the amount of change in the spectrum with respect to polishing time to obtain an amount of cumulative change in the spectrum; and monitoring the progress of polishing of the substrate based on the amount of cumulative change in the spectrum.
摘要翻译：提供了一种能够精确地监测抛光进程并能够检测精确抛光终点的方法。该方法包括：在衬底抛光期间将光引导到衬底; 接收来自基板的反射光; 测量每个波长的反射光的强度; 从强度测量值产生强度与波长关系的光谱; 计算每个预定时间的频谱变化量; 将光谱中的变化量相对于抛光时间进行积分以获得光谱的累积变化量; 以及基于光谱的累积变化量来监测基板的研磨进度。

7. 发明授权

US07585204B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07585204B2
公开(公告)日：2009-09-08
申请号：US12372076
申请日：2009-02-17
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

8. 发明授权

US07547242B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07547242B2
公开(公告)日：2009-06-16
申请号：US10558257
申请日：2004-05-19
申请人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
发明人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
IPC分类号： B24B49/00 , B24B29/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.
摘要翻译：基板研磨装置将基板抛光成平面镜面。基板研磨装置具有：被加压基板的研磨台，发光和受光装置，用于将来自研磨台的测量光发射到基板，并接收来自基板的反射光，以测量基板上的膜用于将测量光和反射光通过的测量流体供应到设置在抛光台的发光和光接收位置处的流体室的流体供给通道和用于控制的流体供应控制装置将测量流体供应到流体室。

9. 发明申请

US20090130956A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20090130956A1
公开(公告)日：2009-05-21
申请号：US12292453
申请日：2008-11-19
申请人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
发明人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
IPC分类号： B24B49/12 , B24B7/00
CPC分类号： B24B37/005 , B24B49/12 , B24B49/16 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holding a workpiece having a surface conductive film, and pressing the conductive film against the polishing surface to polish the conductive film; an optical sensor for monitoring the polishing state of the conductive film by emitting light toward the conductive film of the workpiece held by the top ring, receiving reflected light from the conductive film, and measuring a change in the reflectance of the reflected light; and a control section for controlling a pressure at which the workpiece is pressed on the polishing surface.
摘要翻译：抛光装置可以抛光和除去额外的导电膜，同时防止腐蚀的发生而不降低生产量。抛光装置包括：具有抛光表面的抛光台; 用于保持具有表面导电膜的工件的顶环，并将导电膜压靠在抛光表面上以抛光导电膜; 光传感器，用于通过向由顶环保持的工件的导电膜发射光，接收来自导电膜的反射光并测量反射光的反射率的变化来监测导电膜的抛光状态; 以及控制部，用于控制在抛光面上压入工件的压力。

10. 发明申请

US20090011680A1 Polishing state monitoring apparatus and polishing apparatus and method 有权
标题翻译：抛光状态监测装置及抛光装置及方法
公开(公告)号：US20090011680A1
公开(公告)日：2009-01-08
申请号：US12230317
申请日：2008-08-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译：抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值光谱数据生成器生成的光谱数据。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式