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1. 发明申请

US20090191790A1 SUBSTRATE POLISHING APPARATUS 有权
标题翻译：基板抛光装置
公开(公告)号：US20090191790A1
公开(公告)日：2009-07-30
申请号：US12372076
申请日：2009-02-17
申请人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

2. 发明申请

US20050239372A1 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US20050239372A1
公开(公告)日：2005-10-27
申请号：US11169797
申请日：2005-06-30
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： G01B11/06 , B24B37/013 , B24B37/20 , B24B49/12 , B24D7/12 , H01L21/304 , B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

3. 发明授权

US07510460B2 Substrate polishing apparatus 有权
公开(公告)号：US07510460B2
公开(公告)日：2009-03-31
申请号：US11806445
申请日：2007-05-31
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

4. 发明授权

US06758723B2 Substrate polishing apparatus 有权
公开(公告)号：US06758723B2
公开(公告)日：2004-07-06
申请号：US10329424
申请日：2002-12-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B100
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

5. 发明授权

US07585204B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07585204B2
公开(公告)日：2009-09-08
申请号：US12372076
申请日：2009-02-17
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

6. 发明申请

US20070254565A1 Substrate polishing apparatus 有权
公开(公告)号：US20070254565A1
公开(公告)日：2007-11-01
申请号：US11806445
申请日：2007-05-31
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B7/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

7. 发明授权

US07241202B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07241202B2
公开(公告)日：2007-07-10
申请号：US11169797
申请日：2005-06-30
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

8. 发明授权

US06942543B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US06942543B2
公开(公告)日：2005-09-13
申请号：US10854250
申请日：2004-05-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： G01B11/06 , B24B37/013 , B24B37/20 , B24B49/12 , B24D7/12 , H01L21/304 , B24B1/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于研磨基板的研磨面的基板研磨装置包括膜研磨装置，该装置用于监测研磨时的基板的研磨面上的薄膜的膜厚的状态。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

9. 发明申请

US20090132705A1 SERVER, TERMINAL APPARATUS, DEVICE REGISTERING SYSTEM, REGISTERING METHOD, REGISTERING PROGRAM AND RECORDING MEDIUM 有权
标题翻译：服务器，终端设备，设备注册系统，注册方法，注册程序和记录介质
公开(公告)号：US20090132705A1
公开(公告)日：2009-05-21
申请号：US10584850
申请日：2005-01-06
申请人： Natsume Matsuzaki , Naoshi Usuki , Hiroyuki Iitsuka , Hiroki Yamauchi
发明人： Natsume Matsuzaki , Naoshi Usuki , Hiroyuki Iitsuka , Hiroki Yamauchi
IPC分类号： G06F15/173
CPC分类号： H04L43/0852 , G06F21/10 , H04L43/16
摘要： A device registration system including a server which holds content and a terminal apparatus which uses content, whereby the terminal apparatus is registered in the server if a communication time between the terminal apparatus and the server is less than or equal to a reference value. A measuring unit of the server measures the communication time, being a time period from transmitting measuring information to the terminal apparatus until receiving response information from the terminal apparatus, and repeats the transmission, the reception, and the measurement until the measured communication time is less than or equal to the reference value. An elapsed-time measuring unit measures an elapsed time from when the measuring unit first begins measuring the communication time, and a transmission unit transmits, to the terminal apparatus, status notification information showing a processing status which depends on the elapsed time. A response unit of the terminal apparatus receives measuring information from the server and transmits response information to the server when the measuring information is received, and a display unit displays a message based on status notification information received from the server.
摘要翻译：一种包括保存内容的服务器和使用内容的终端设备的设备注册系统，如果终端设备和服务器之间的通信时间小于或等于参考值，则终端设备在服务器中注册。服务器的测量单元测量通信时间，作为从发送测量信息到终端设备的时间段，直到从终端设备接收到响应信息，并且重复发送，接收和测量，直到所测量的通信时间少大于或等于参考值。经过时间测量单元测量从测量单元第一次开始测量通信时间开始的经过时间，并且发送单元向终端设备发送表示取决于经过时间的处理状态的状态通知信息。终端装置的响应单元从服务器接收测量信息，并且当接收到测量信息时将响应信息发送到服务器，并且显示单元基于从服务器接收的状态通知信息显示消息。

10. 发明申请

US20080196109A1 Device Registration System and Device Registration Apparatus 有权
标题翻译：设备注册系统和设备注册设备
公开(公告)号：US20080196109A1
公开(公告)日：2008-08-14
申请号：US11631798
申请日：2005-07-14
申请人： Natsume Matsuzaki , Masaya Miyazaki , Yuichi Futa , Toshihisa Nakano , Hiroki Yamauchi , Soichiro Fujioka , Yuko Tsusaka
发明人： Natsume Matsuzaki , Masaya Miyazaki , Yuichi Futa , Toshihisa Nakano , Hiroki Yamauchi , Soichiro Fujioka , Yuko Tsusaka
IPC分类号： G06F21/00
CPC分类号： G06F21/10
摘要： When a PC 20 transmits a content request to a device registration apparatus 10 in which a permitted number of devices have already been registered, an expiration time management unit 105 judges whether any registration information registered in a registration list management unit 102 has an exceeded registration expiration time. If registration information with an exceeded registration expiration time is registered in the registration list management unit 102, the registration list management unit 102 deletes this registration information, and newly registers registration information of the PC 20.
摘要翻译：当PC20向已注册了许可数量的设备的设备登记设备10发送内容请求时，期满时间管理单元105判断登记在注册表管理单元102中的任何注册信息是否具有超过的注册期满时间。如果在注册表管理单元102中登记了具有超过注册的期满时间的注册信息，则注册列表管理单元102删除该注册信息，并且新登记PC 20的注册信息。

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