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1. 发明申请

US20130050370A1 RECORDING APPARATUS 有权
公开(公告)号：US20130050370A1
公开(公告)日：2013-02-28
申请号：US13569918
申请日：2012-08-08
申请人： Tsuneyuki SASAKI , Yoichi KOBAYASHI
发明人： Tsuneyuki SASAKI , Yoichi KOBAYASHI
IPC分类号： B41J2/01
CPC分类号： B41J11/0015 , B41J2/04515 , B41J2/04538 , B41J2/0454 , B41J2/04563 , B41J11/002
摘要： A recording apparatus includes a support member that supports a recording medium, a heating device that heats the recording medium on the support member, a recording head that ejects fluid onto the recording medium on the support member and that is positioned between the support member and the heating device, a blower that has a blowing port from which gas is blown, and a carriage that moves and has the recording head mounted thereon. The carriage has an enclosing structure inside which at least part of the gas blown from the blowing port is taken and inside which a gas layer in which the gas flows is formed between the recording head and the heating device.

2. 发明申请

US20130044171A1 RECORDING APPARATUS 审中-公开
标题翻译：录音设备
公开(公告)号：US20130044171A1
公开(公告)日：2013-02-21
申请号：US13563306
申请日：2012-07-31
申请人： Tsuneyuki SASAKI , Yoichi KOBAYASHI
发明人： Tsuneyuki SASAKI , Yoichi KOBAYASHI
IPC分类号： B41J2/01
CPC分类号： B41J11/002
摘要： A recording apparatus includes a recording portion that ejects liquid onto a recording medium which is transported in a transportation direction so as to perform recording processing, a first infrared heating portion that is arranged at a recording surface side of the recording medium, and irradiates the recording medium on which the recording processing has been performed by the recording portion with infrared rays having wavelengths which are easy to be absorbed by water contained in the liquid, and a second infrared heating portion that is arranged at the recording surface side of the recording medium at the downstream side with respect to the first infrared heating portion in the transportation direction, and irradiates the recording medium which has been heated by the first infrared heating portion with infrared rays having wavelengths which are easy to be absorbed by a solvent contained in the liquid.
摘要翻译：记录装置包括将液体喷射到记录介质上的记录部分，该记录介质沿传送方向传送以进行记录处理;第一红外加热部分，布置在记录介质的记录表面侧，并且将记录由记录部分进行的记录处理的介质具有波长容易被包含在液体中的水所吸收的波长的红外线;以及第二红外线加热部分，其布置在记录介质的记录表面侧在输送方向相对于第一红外线加热部分的下游侧，并且用具有容易被包含在液体中的溶剂吸收的波长的红外线照射被第一红外线加热部分加热的记录介质。

3. 发明申请

US20120224005A1 LIQUID EJECTION APPARATUS 有权
标题翻译：液体喷射装置
公开(公告)号：US20120224005A1
公开(公告)日：2012-09-06
申请号：US13409481
申请日：2012-03-01
申请人： Takashi KOASE , Yoichi KOBAYASHI , Tsuneyuki SASAKI , Masako FUKUDA
发明人： Takashi KOASE , Yoichi KOBAYASHI , Tsuneyuki SASAKI , Masako FUKUDA
IPC分类号： B41J2/01
CPC分类号： B41J11/002
摘要： There is provided a liquid ejection apparatus in which convection generated by a convection generation unit does not give an influence on an irradiation unit, ink can be heated and dried sufficiently, and bleeding can be suppressed from occurring. The liquid ejection apparatus includes a head unit which has a nozzle for ejecting liquid onto a recording medium, a carriage which makes the head unit relatively scan the recording medium, an infrared ray irradiation unit which is provided at a vertically upper side of the carriage in a scanning direction of the carriage and irradiates the recording medium with infrared rays, a convection generation unit which is provided at a vertically upper side of the carriage in the scanning direction of the carriage and generates convection on the recording medium, and a separation wall which is provided between the infrared ray irradiation unit and the convection generation unit.
摘要翻译：提供了一种液体喷射装置，其中由对流产生单元产生的对流对照射单元不产生影响，可以充分地加热和干燥油墨，并且可以抑制出血。液体喷射装置包括：头单元，其具有用于将液体喷射到记录介质上的喷嘴;使头单元相对地扫描记录介质的滑架;设置在滑架的垂直上侧的红外线照射单元滑架的扫描方向并且用红外线照射记录介质;对流产生单元，其设置在托架的垂直上方沿托架的扫描方向并在记录介质上产生对流;以及分隔壁，设置在红外线照射单元和对流发生单元之间。

4. 发明申请

US20100273396A1 POLISHING METHOD, POLISHING APPARATUS AND METHOD OF MONITORING A SUBSTRATE 有权
标题翻译：抛光方法，抛光装置和监测基板的方法
公开(公告)号：US20100273396A1
公开(公告)日：2010-10-28
申请号：US12767095
申请日：2010-04-26
申请人： Yoichi KOBAYASHI , Yasumasa Hiroo
发明人： Yoichi KOBAYASHI , Yasumasa Hiroo
IPC分类号： B24B49/00
CPC分类号： B24B37/042 , B24B49/00
摘要： A method of polishing a substrate is described. The method includes rotating a polishing table having a polishing surface, holding a substrate by a top ring, bringing the substrate into contact with the polishing surface while swinging and rotating the top ring to polish the substrate, and monitoring a surface condition of the substrate by a monitoring sensor. A rotational speed of the polishing table and conditions of swing motion of the top ring are determined such that a position of the monitoring sensor, a position of a center of rotation of the top ring, and a direction of the swing motion of the top ring at a point of time when a predetermined period of time has elapsed after polishing of the substrate is started approximately coincide with their previous values at a point of time before the predetermined period of time has elapsed.
摘要翻译：描述了抛光衬底的方法。该方法包括旋转具有抛光表面的抛光台，通过顶环保持基板，使基板与抛光表面接触，同时摆动并旋转顶环以抛光基板，并且通过以下方式监视基板的表面状态监控传感器。确定抛光台的旋转速度和顶环的摆动运动的条件，使得监测传感器的位置，顶环的旋转中心的位置和顶环的摆动运动的方向在基板的研磨开始经过规定时间后的时间点，与经过了规定时间之前的时间点的先前值大致一致。

5. 发明申请

US20100330878A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20100330878A1
公开(公告)日：2010-12-30
申请号：US12881522
申请日：2010-09-14
申请人： Yoichi KOBAYASHI , Yasumasa Hiroo , Tsuyoshi Ohashi
发明人： Yoichi KOBAYASHI , Yasumasa Hiroo , Tsuyoshi Ohashi
IPC分类号： B24B49/00
CPC分类号： B24B37/005 , B24B49/10
摘要： A polishing apparatus has a polishing table having a polishing surface and a top ring for pressing a substrate against the polishing surface while independently controlling pressing forces applied to a plurality of areas on the substrate. The polishing apparatus has a sensor for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit for performing a predetermined arithmetic process on a signal from the sensor to generate a monitor signal, and a controller for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring so that the monitor signal of the measurement point converges on the reference signal.
摘要翻译：抛光装置具有抛光台，其具有抛光表面和用于将衬底压靠在抛光表面上的顶环，同时独立地控制施加到衬底上的多个区域的按压力。抛光装置具有用于监测基板上的多个测量点的基板状况的传感器，用于对来自传感器的信号执行预定的运算处理以产生监视信号的监视单元，以及用于将监视信号测量点与参考信号，并控制顶环的按压力，使测量点的监视信号收敛于参考信号。

6. 发明申请

US20100075576A1 POLISHING STATE MONITORING APPARATUS AND POLISHING APPARATUS AND METHOD 有权
标题翻译：抛光状态监测装置和抛光装置及方法
公开(公告)号：US20100075576A1
公开(公告)日：2010-03-25
申请号：US12627333
申请日：2009-11-30
申请人： Yoichi KOBAYASHI , Shunsuke NAKAI , Hitoshi TSUJI , Yasuo TSUKUDA , Junki ISHIMOTO , Kazunari SHINYA
发明人： Yoichi KOBAYASHI , Shunsuke NAKAI , Hitoshi TSUJI , Yasuo TSUKUDA , Junki ISHIMOTO , Kazunari SHINYA
IPC分类号： B24B49/04 , B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译：抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值光谱数据生成器生成的光谱数据。

7. 发明申请

US20110216328A1 POLISHING MONITORING METHOD, POLISHING METHOD, AND POLISHING MONITORING APPARATUS 有权
标题翻译：抛光监测方法，抛光方法和抛光监测装置
公开(公告)号：US20110216328A1
公开(公告)日：2011-09-08
申请号：US13034903
申请日：2011-02-25
申请人： Yoichi KOBAYASHI
发明人： Yoichi KOBAYASHI
IPC分类号： G01B11/06
CPC分类号： G01N21/9501 , B24B37/013 , B24B49/12 , G01B11/06 , H01L21/304
摘要： A method capable of accurately monitoring progress of polishing and capable of detecting an accurate polishing end point is provided. The method includes: directing light to the substrate during polishing of the substrate; receiving reflected light from the substrate; measuring intensity of the reflected light at each wavelength; producing spectrum indicating relationship between intensity and wavelength from measured values of the intensity; calculating an amount of change in the spectrum per predetermined time; integrating the amount of change in the spectrum with respect to polishing time to obtain an amount of cumulative change in the spectrum; and monitoring the progress of polishing of the substrate based on the amount of cumulative change in the spectrum.
摘要翻译：提供了一种能够精确地监测抛光进程并能够检测精确抛光终点的方法。该方法包括：在衬底抛光期间将光引导到衬底; 接收来自基板的反射光; 测量每个波长的反射光的强度; 从强度测量值产生强度与波长关系的光谱; 计算每个预定时间的频谱变化量; 将光谱中的变化量相对于抛光时间进行积分以获得光谱的累积变化量; 以及基于光谱的累积变化量来监测基板的研磨进度。

8. 发明申请

US20110172800A1 SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF TRANSFERRING SUBSTRATES IN SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：调度器，基板处理装置以及在基板处理装置中传送基板的方法
公开(公告)号：US20110172800A1
公开(公告)日：2011-07-14
申请号：US13004208
申请日：2011-01-11
申请人： Ryuya KOIZUMI , Kunio OISHI , Yoichi KOBAYASHI
发明人： Ryuya KOIZUMI , Kunio OISHI , Yoichi KOBAYASHI
IPC分类号： G06F19/00
CPC分类号： G06Q10/06 , G05B19/41865 , G05B2219/45031 , H01L21/67253 , H01L21/67276 , Y02P90/20
摘要： A scheduler generates not only normal substrate transferring schedules for substrates newly supplied to a substrate processing apparatus, but also substrate transferring schedules for keeping a high production quantity in the event of a failure. The scheduler is used in a substrate processing apparatus including a plurality of substrate processing sections for processing substrates, a transfer device for transferring the substrates, and a controller for controlling the substrate processing units to process the substrates and controlling the transfer device to transfer the substrates. The scheduler is incorporated in the controller for calculating a substrate transferring schedule and has a function to successively calculate substrate transferring schedules for substrates which are newly supplied to the substrate processing apparatus, and, in the event of a fault occurring in the substrate processing apparatus, to recalculate the substrate transferring schedules with an initial state represented by a state including the fault.
摘要翻译：调度器不仅产生新提供给基板处理装置的基板的正常的基板转印时间表，而且生成在发生故障的情况下保持高生产量的基板转印时间表。调度器用于包括用于处理衬底的多个衬底处理部分，用于转移衬底的转移装置和用于控制衬底处理单元以处理衬底并控制转移装置以转移衬底的衬底处理装置。调度器被结合在控制器中用于计算衬底传送时间表，并且具有连续地计算新提供给衬底处理设备的衬底的衬底传送时间表的功能，并且在衬底处理设备中发生故障的情况下，重新计算由包括故障的状态表示的初始状态的基板传送调度。

9. 发明申请

US20090191790A1 SUBSTRATE POLISHING APPARATUS 有权
标题翻译：基板抛光装置
公开(公告)号：US20090191790A1
公开(公告)日：2009-07-30
申请号：US12372076
申请日：2009-02-17
申请人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

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