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    • 1. 发明授权
    • System for sensing and forming objects such as leads of electronic
components
    • 用于感测和形成诸如电子部件的引线的物体的系统
    • US4821157A
    • 1989-04-11
    • US89651
    • 1987-08-26
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • H05K13/02H05K13/04H05K13/08F21V11/00
    • H05K13/043H05K13/023H05K13/0421H05K13/08
    • An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded in then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
    • 公开了一种用于制备电子元件引线的自动引线感测和精细成形系统,使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置,以确定是否需要弯曲引线。 然后,这些引线被弯曲,并且在该过程期间感测和记录引线上的力及其位移。 所记录的数据随后用于随后的弯曲,必要时用于将引线弯曲到目标位置,使得所有引线同时并入孔中。 为了简化图像处理,引线尖端由来自基本上各向同性方向的光照射,该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置,使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
    • 4. 发明授权
    • Planar optical waveguide with alignment structure
    • 具有对准结构的平面光波导
    • US06744953B2
    • 2004-06-01
    • US09949395
    • 2001-09-07
    • Brian Elliot LemoffWilliam GongRichatd P. TellaTirumala R. Ranganath
    • Brian Elliot LemoffWilliam GongRichatd P. TellaTirumala R. Ranganath
    • G02B626
    • G02B6/4224G02B6/13G02B6/136G02B6/30
    • Planar optical waveguide apparatus and methods for fabricating planar optical waveguide apparatus. The apparatus has a core layer and a cladding layer, the core layer having at least one optical waveguide, and an alignment structure spaced from and positioned with respect to the at least one optical waveguide to facilitate measuring a position of the at least one optical waveguide. The alignment structure has a first alignment structure, such as a reflecting member, to facilitate measuring a height of the at least one optical waveguide; and a second alignment structure, such as alignment marks, to facilitate measuring positions of the at least one optical waveguide in a plane of the at least one optical waveguide. The method includes forming both the optical waveguide and at least a portion of the alignment structure simultaneously in a single processing step to ensure that the optical waveguide and the alignment structure are in perfect registration.
    • 平面光波导装置及其制造平面光波导装置的方法。 所述装置具有芯层和包覆层,所述芯层具有至少一个光波导,以及与所述至少一个光波导隔开并相对于所述至少一个光波导定位的对准结构,以便于测量所述至少一个光波导的位置 。 对准结构具有诸如反射构件的第一对准结构,以便于测量至少一个光波导的高度; 以及诸如对准标记的第二对准结构,以便于在至少一个光波导的平面中测量至少一个光波导的位置。 该方法包括在单个处理步骤中同时形成光波导和对准结构的至少一部分,以确保光波导和对准结构完全配准。
    • 5. 发明授权
    • Reflowing of solder joints
    • 焊点回流
    • US06680457B2
    • 2004-01-20
    • US10047567
    • 2002-01-15
    • William GongRichard Tella
    • William GongRichard Tella
    • B23K2600
    • H05K3/3494B23K1/0056H05K1/0306H05K2203/107
    • A solder reflow system is disclosed that includes a substrate, a solder pad disposed upon the substrate, an optical component disposed upon the solder pad, and a laser positioned above the substrate with laser output focused sufficiently close to the solder pad to reflow the solder when the laser is powered. Also disclosed is a method for reflowing a solder joint, including: providing an optical component assembly including a substrate, a solder pad disposed upon the substrate, solder disposed upon the solder pad, and an optical component disposed upon the solder pad; providing a laser; positioning the laser above the substrate with laser output focused sufficiently close to the solder pad, instead of directly over the solder pad; and powering the laser, thereby transferring energy through the substrate into the solder pad, and reflowing the solder.
    • 公开了一种焊料回流系统,其包括衬底,设置在衬底上的焊盘,设置在焊盘上的光学部件和位于衬底上方的激光器,激光输出聚焦成足够靠近焊盘以回流焊料, 激光器供电。 还公开了一种用于回流焊接接头的方法,包括:提供包括基板,设置在基板上的焊盘,设置在焊盘上的焊料和设置在焊盘上的光学部件的光学部件组件; 提供激光; 将激光定位在基板上方,激光输出聚焦得足够靠近焊盘,而不是直接在焊盘上方; 并为激光器供电,从而将能量通过衬底转移到焊盘中并回流焊料。
    • 8. 发明授权
    • Optical measurement for measuring a small space through a transparent surface
    • 通过透明表面测量小空间的光学测量
    • US06806969B2
    • 2004-10-19
    • US10039599
    • 2001-10-19
    • George M. Clifford, Jr.William Gong
    • George M. Clifford, Jr.William Gong
    • G01B1128
    • G01B11/02G01B11/14
    • The invention provides a system and method for reliably and accurately measuring the gap between two materials when the depth of gap is less than the smallest distance that an optical thickness gauge (OTG) is able to measure. The invention is practiced by forming a suitable slot (or a groove, channel, hole or other suitable deformation) having a precisely known depth in at least one material. The sum of the distance of the gap and the depth of the slot is at least equal to the smallest distance that the OTG can measure. The slot is positioned over the materials and under the OTG probe head such that a cavity is formed. The depth of the cavity is measured. Since the distance of the slot is known, the depth of the gap is determined by subtracting the known depth of the slot from the measured depth of the cavity.
    • 本发明提供一种系统和方法,用于当间隙深度小于光学厚度计(OTG)能够测量的最小距离时,可靠且准确地测量两种材料之间的间隙。 通过在至少一种材料中形成具有精确已知深度的合适的槽(或槽,通道,孔或其它合适的变形)来实现本发明。 间隙的距离和槽的深度的总和至少等于OTG可以测量的最小距离。 槽位于材料之上并且位于OTG探针头下方,使得形成空腔。 测量腔的深度。 由于槽的距离是已知的,所以间隙的深度通过从所测量的腔的深度减去槽的已知深度来确定。
    • 9. 发明授权
    • System for sensing and forming objects such as leads of electronic
components
    • 用于感测和形成诸如电子部件的引线的物体的系统
    • US4813255A
    • 1989-03-21
    • US89719
    • 1987-08-26
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • H05K13/02H05K13/04H05K13/08B21D7/12
    • H05K13/0421H05K13/023H05K13/043H05K13/08Y10S72/702
    • An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
    • 公开了一种用于制备电子元件引线的自动引线感测和精细成形系统,使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置,以确定是否需要弯曲引线。 然后,这些引线被弯曲,并且在该过程期间感测和记录引线上的力及其位移。 然后记录的数据用于随后的弯曲,在必要时,用于将引线弯曲到目标位置,使得所有引线同时并入孔中。 为了简化图像处理,引线尖端由来自基本上各向同性方向的光照射,该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置,使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
    • 10. 发明授权
    • System for sensing and forming objects such as leads of electronic
components
    • 用于感测和形成诸如电子部件的引线的物体的系统
    • US4705081A
    • 1987-11-10
    • US832481
    • 1986-02-21
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • B23P21/00H05K3/30H05K13/02H05K13/04H05K13/08
    • H05K13/023H05K13/0421H05K13/043H05K13/08Y10T29/49139Y10T29/53183
    • An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
    • 公开了一种自动引线感测和精细成形系统,用于制备电子元件的引线,使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置,以确定是否需要弯曲引线。 然后,这些引线被弯曲,并且在该过程期间感测和记录引线上的力及其位移。 然后记录的数据用于随后的弯曲,在必要时,用于将引线弯曲到目标位置,使得所有引线同时并入孔中。 为了简化图像处理,引线尖端由来自基本上各向同性方向的光照射,该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置,使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。