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    • 1. 发明授权
    • System for sensing and forming objects such as leads of electronic
components
    • 用于感测和形成诸如电子部件的引线的物体的系统
    • US4705081A
    • 1987-11-10
    • US832481
    • 1986-02-21
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • B23P21/00H05K3/30H05K13/02H05K13/04H05K13/08
    • H05K13/023H05K13/0421H05K13/043H05K13/08Y10T29/49139Y10T29/53183
    • An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
    • 公开了一种自动引线感测和精细成形系统,用于制备电子元件的引线,使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置,以确定是否需要弯曲引线。 然后,这些引线被弯曲,并且在该过程期间感测和记录引线上的力及其位移。 然后记录的数据用于随后的弯曲,在必要时,用于将引线弯曲到目标位置,使得所有引线同时并入孔中。 为了简化图像处理,引线尖端由来自基本上各向同性方向的光照射,该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置,使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
    • 2. 发明授权
    • System for sensing and forming objects such as leads of electronic
components
    • 用于感测和形成诸如电子部件的引线的物体的系统
    • US4813255A
    • 1989-03-21
    • US89719
    • 1987-08-26
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • H05K13/02H05K13/04H05K13/08B21D7/12
    • H05K13/0421H05K13/023H05K13/043H05K13/08Y10S72/702
    • An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
    • 公开了一种用于制备电子元件引线的自动引线感测和精细成形系统,使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置,以确定是否需要弯曲引线。 然后,这些引线被弯曲,并且在该过程期间感测和记录引线上的力及其位移。 然后记录的数据用于随后的弯曲,在必要时,用于将引线弯曲到目标位置,使得所有引线同时并入孔中。 为了简化图像处理,引线尖端由来自基本上各向同性方向的光照射,该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置,使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
    • 3. 发明授权
    • System for sensing and forming objects such as leads of electronic
components
    • 用于感测和形成诸如电子部件的引线的物体的系统
    • US4821157A
    • 1989-04-11
    • US89651
    • 1987-08-26
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • John BirkHeinz BreuWilliam GongCharles C. MorehouseSidney Liebes, Jr.
    • H05K13/02H05K13/04H05K13/08F21V11/00
    • H05K13/043H05K13/023H05K13/0421H05K13/08
    • An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded in then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.
    • 公开了一种用于制备电子元件引线的自动引线感测和精细成形系统,使得它们准备好被机器人插入印刷电路板上的孔中。 检测并比较引线尖端和孔的位置的位置,以确定是否需要弯曲引线。 然后,这些引线被弯曲,并且在该过程期间感测和记录引线上的力及其位移。 所记录的数据随后用于随后的弯曲,必要时用于将引线弯曲到目标位置,使得所有引线同时并入孔中。 为了简化图像处理,引线尖端由来自基本上各向同性方向的光照射,该位置基本上与引线尖端的区域共面。 远心透镜系统用于光学感测引线尖端的位置,使得引线之间的距离的测量不受引线尖端和感测装置之间的间隔的变化的影响。
    • 4. 发明授权
    • Mechanical simultaneous registration of multi-pin surface-mount
components to sites on substrates
    • 机械同时将多针表面贴装组件对准到基板上的位置
    • US5034802A
    • 1991-07-23
    • US448495
    • 1989-12-11
    • Sidney Liebes, Jr.John Birk
    • Sidney Liebes, Jr.John Birk
    • H05K1/00H05K3/30H05K13/04
    • H05K13/046H05K13/0417H05K3/303H05K1/0284H05K2201/09036H05K2201/09045H05K2201/10537H05K2201/10568H05K2201/10689H05K2201/10924H05K2203/0173H05K2203/167H05K2203/168Y02P70/613Y10S269/903Y10T29/4913Y10T29/49133
    • A method and structure are provided for aligning SMDs to a substrate. The body of an SMD and that portion of a substrate encircled by the electrical interconnect pads each have a mating physical structure such that the SMD may be quickly placed in the general vicinity of its proper location and the mating physical features cause a precise alignment. In one embodiment, the physical features are nonsymmetrical, thereby preventing accidental placement of the SMD in an undesired rotation. In another embodiment, the physical features vary among device types, thereby ensuring that an improper device is not placed in a particular location on the substrate. In another embodiment, a component carrier is provided which includes depressions for the placement of the SMDs. A vacuum is applied to the carrier which holds each of the SMDs in place. The carrier is then placed in a desired physical relationship with the substrate such that each of the devices held in the carrier is properly aligned with the substrate. In another embodiment, a standard substrate is used without the requirement of physical mating features. Those physical mating features are provided by the use of a grid structure which is placed with proper registration on the substrate such that the physical pattern of the grid ensures proper placement of components with respect to the pads on the substrate.
    • 提供了一种用于将SMD与衬底对准的方法和结构。 SMD的主体和由电互连焊盘包围的基板的那部分各自具有匹配的物理结构,使得SMD可以快速地放置在其适当位置的附近,并且配合的物理特征导致精确的对准。 在一个实施例中,物理特征是非对称的,从而防止SMD在意外旋转中的意外放置。 在另一个实施例中,物理特征在设备类型之间变化,从而确保不正确的设备不被放置在基板上的特定位置。 在另一个实施例中,提供了一种分量载体,其包括用于放置SMD的凹陷。 将真空施加到将每个SMD保持在适当位置的载体上。 然后将载体与衬底放置成所需的物理关系,使得保持在载体中的每个装置与衬底正确对准。 在另一个实施例中,使用标准衬底而不需要物理匹配特征。 这些物理配合特征通过使用栅格结构来提供,栅格结构被放置在基板上的适当对准,使得栅格的物理图案确保了相对于衬底上的焊盘的部件的适当放置。