会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Wire forming method for semiconductor device
    • 半导体器件的成线方法
    • US5604156A
    • 1997-02-18
    • US560913
    • 1995-11-20
    • U-in ChungJae-duk KimChang-ki Hong
    • U-in ChungJae-duk KimChang-ki Hong
    • H01L21/28H01L21/304H01L21/306H01L21/3205H01L21/768H01L23/532H01L21/44
    • H01L21/76831H01L21/76807H01L21/76843H01L21/76877H01L23/53238H01L23/53257H01L23/5329H01L2924/0002
    • A wire forming method for a semiconductor device includes the steps of depositing an insulation material on a semiconductor substrate and patterning the insulation material to form a first insulation layer, forming a lower capping layer on the first insulation layer, etching the lower capping layer and the first insulation layer to form a first contact hole that exposes a first part of the semiconductor substrate, forming a wire layer over the capping layer and the first part of the semiconductor substrate, performing a chemical and mechanical polishing (CMP) process with respect to the wire layer and the lower capping layer to expose the first insulation layer, forming a second insulation layer over the wire layer and the first insulation layer, and etching the first and second insulation layers to form a second contact hole that exposes a second part of the semiconductor substrate. The wire forming method can prevent the lifting of the wire layer, the splitting of the lower insulation layer, and the formation of a protrusion n the second contact hole.
    • 一种用于半导体器件的线形成方法包括以下步骤:在半导体衬底上沉积绝缘材料并图案化绝缘材料以形成第一绝缘层,在第一绝缘层上形成下覆盖层,蚀刻下封盖层和 第一绝缘层以形成暴露半导体衬底的第一部分的第一接触孔,在覆盖层和半导体衬底的第一部分上方形成引线层,对相对于第二绝缘层进行化学和机械抛光(CMP)处理 线层和下覆盖层以暴露第一绝缘层,在导线层和第一绝缘层上形成第二绝缘层,并蚀刻第一和第二绝缘层以形成第二接触孔,其暴露第二绝缘层的第二部分 半导体衬底。 线形成方法可以防止线层的提升,下绝缘层的分离,以及在第二接触孔处形成突起。
    • 7. 发明授权
    • Method for fabricating a capacitor in a semiconductor memory device
    • 在半导体存储器件中制造电容器的方法
    • US06391714B2
    • 2002-05-21
    • US09738296
    • 2000-12-18
    • Chul-Ho ShinU In Chung
    • Chul-Ho ShinU In Chung
    • H01L218242
    • H01L28/84H01L21/3143H01L27/10814H01L27/10855Y10T29/41
    • A method for making a capacitor of a semiconductor memory device capable of providing increased capacitance without degraded resolution, as well as without the removal of any interlayer insulation layers upon formation of a lower electrode for the capacitor, wherein after formation of an access transistor on a semiconductor substrate, a first interlayer insulation layer for planarization of a surface of the semiconductor substrate and a second interlayer insulation layer for formation of the capacitor lower electrode are formed. After formation of an opening for exposing a part of an impurity diffusion region of the access transistor by etching a part of the first and second interlayer insulating layers, a spacer is formed within the opening. Further, after deposition of a conductive layer for the capacitor lower electrode onto a surface of the substrate, a planarization process is carried out until a part of the upper surface of the spacer is exposed. Finally, after removal of the exposed spacer, the dielectric layer and a conductive layer for the upper electrode of the capacitor are formed in sequence. The method does not require any additional insulation layer evaporation process, since the interlayer insulation layer for formation of the reverse storage electrode could be used for formation of a gate contact of a logic region, without removal. Consequently, simplification of fabrication process for a capacitor is achieved.
    • 一种用于制造半导体存储器件的电容器的方法,其能够提供增加的电容而不降低分辨率,以及在形成用于电容器的下电极时不去除任何层间绝缘层,其中在形成存取晶体管 半导体衬底,用于使半导体衬底的表面平坦化的第一层间绝缘层和用于形成电容器下电极的第二层间绝缘层。 在形成用于通过蚀刻第一和第二层间绝缘层的一部分来暴露存取晶体管的一部分杂质扩散区的开口,在开口内形成间隔物。 此外,在将电容器下电极的导电层沉积到基板的表面上之后,进行平坦化处理直到间隔件的上表面的一部分露出。 最后,在去除暴露的间隔物之后,依次形成电介质层和用于电容器的上电极的导电层。 该方法不需要任何额外的绝缘层蒸发工艺,因为用于形成反向存储电极的层间绝缘层可用于形成逻辑区域的栅极接触而不去除。 因此,实现了电容器制造工艺的简化。