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1. 发明申请

US20120190310A1 TRANSCEIVER AND RADIO FREQUENCY IDENTIFICATION TAG READER 有权
标题翻译：收发器和无线电频率识别标签读取器
公开(公告)号：US20120190310A1
公开(公告)日：2012-07-26
申请号：US13437978
申请日：2012-04-03
申请人： Tsutomu IEKI , Ken SAKAI , Noboru KATO , Koji SHIROKI
发明人： Tsutomu IEKI , Ken SAKAI , Noboru KATO , Koji SHIROKI
IPC分类号： H04B1/38
CPC分类号： G06K7/0008 , G06K7/10316 , H01Q1/2283 , H01Q25/001
摘要： In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.
摘要翻译：在收发器中，在矩形板状基板的顶表面上，设置有传输辐射元件和接收辐射元件。透射辐射元件从基板的中心沿水平或横向方向延伸。接收辐射元件从基板的中心在垂直或纵向方向上延伸。包含在匹配馈送元件中的电感器单独地电磁耦合到作为接收辐射元件的内端部的发送辐射元件和接收侧馈电点的内端部的发送侧馈电点。发送信号以水平方向或横向偏振的波发送，并且接收具有垂直或纵向偏振方向的信号。

2. 发明申请

US20070170582A1 COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：包含组件的模块及其制造方法
公开(公告)号：US20070170582A1
公开(公告)日：2007-07-26
申请号：US11696919
申请日：2007-04-05
申请人： Masato NOMURA , Tsutomu IEKI
发明人： Masato NOMURA , Tsutomu IEKI
IPC分类号： H01L23/34
CPC分类号： H05K1/141 , H01L23/552 , H01L2224/16225 , H01L2924/19105 , H05K1/0218 , H05K1/144 , H05K1/181 , H05K1/183 , H05K3/20 , H05K3/284 , H05K3/3442 , H05K2201/045 , Y02P70/611
摘要： A component-containing module includes a module substrate having first wiring lines provided on the top surface of the module substrate, a first circuit component mounted on the first wiring lines of the module substrate, a submodule substrate having an area smaller than the area of the module substrate and mounted on the first wiring lines of the module substrate at a position at which the first circuit component is not mounted, a second circuit component mounted on second wiring lines provided on the top surface of the submodule substrate, and an insulating resin layer provided on the entire top surface of the module substrate so as to encompass the first circuit component, the second circuit component, and the submodule substrate.
摘要翻译：含有元件的模块包括：模块基板，其具有设置在模块基板的上表面上的第一布线;安装在模块基板的第一布线上的第一电路部件;具有小于模块基板，并且在未安装第一电路部件的位置处安装在模块基板的第一布线上，安装在设置在子模块基板的顶表面上的第二布线上的第二电路部件和绝缘树脂层设置在模块基板的整个顶表面上，以便包围第一电路部件，第二电路部件和子模块基板。

3. 发明申请

US20100027225A1 COMPONENT-EMBEDDED MODULE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：组件嵌入式模块及其制造方法
公开(公告)号：US20100027225A1
公开(公告)日：2010-02-04
申请号：US12579617
申请日：2009-10-15
申请人： Kazuyuki YUDA , Tsutomu IEKI
发明人： Kazuyuki YUDA , Tsutomu IEKI
IPC分类号： H05K1/14 , B32B38/10 , H05K3/30
CPC分类号： H05K1/141 , H01L23/552 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15192 , H01L2924/15313 , H01L2924/19105 , H05K1/0218 , H05K1/183 , H05K1/187 , H05K3/007 , H05K3/20 , H05K3/284 , H05K3/303 , H05K3/46 , H05K3/4694 , H05K3/4697 , H05K2201/0715 , H05K2201/0979 , H05K2201/09972 , H05K2203/016 , H05K2203/167 , Y10T29/4913 , H01L2224/0401
摘要： A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.
摘要翻译：组件嵌入式模块包括在其上表面上具有布线电极的模块基板，安装在布线电极上的第一电路部件，设置在不设有布线电极的区域上的子模块以及设置在其上的绝缘树脂层基本上整个模块基板的上表面，使得绝缘树脂层覆盖第一电路部件和子模块的至少一部分。包括集成电路元件的第二电路部件安装在子模块上或嵌入其中。通孔导体通过模块基板从其下表面提供，并且直接耦合到子模块的下表面上的端子电极。通过使用具有比模块基板的布线精度更高的布线的基板，获得了可靠的部件嵌入式模块。

4. 发明申请

US20080149381A1 METHOD FOR MANUFACTURING COMPONENT INCORPORATING MODULE AND COMPONENT INCORPORATING MODULE 有权
标题翻译：制造组件组件和组件组合模块的方法
公开(公告)号：US20080149381A1
公开(公告)日：2008-06-26
申请号：US12041730
申请日：2008-03-04
申请人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
发明人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/187 , H01L21/568 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/16238 , H01L2224/24195 , H01L2924/15192 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/20 , H05K3/4644 , H05K2201/0715 , H05K2201/096 , H01L2924/00012
摘要： In a method for manufacturing a component incorporating module, lands for mounting components are independently formed on a transfer plate in an isolated manner, and circuit components are connected to the lands for mounting components. An insulation resin layer is formed so as to cover the circuit components on the transfer plate, and is hardened. The circuit components and the lands for mounting components are embedded in the upper resin layer. Thereafter, the transfer plate is removed from the resin layer, and wiring patterns which are used to connect between lands or connect lands to other portions are formed on a back surface of the resin layer on which the lands for mounting components are exposed.
摘要翻译：在用于制造组件组合模块的方法中，用于安装部件的焊盘独立地形成在转印板上，并且电路部件连接到用于安装部件的焊盘。形成绝缘树脂层，以覆盖转印板上的电路元件，并被硬化。电路部件和用于安装部件的焊盘嵌入在上树脂层中。此后，从树脂层除去转印板，并且在用于安装部件的焊盘露出的树脂层的背面上形成用于将焊盘或连接焊盘连接到其它部分的布线图案。

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