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1. 发明申请

US20080149381A1 METHOD FOR MANUFACTURING COMPONENT INCORPORATING MODULE AND COMPONENT INCORPORATING MODULE 有权
标题翻译：制造组件组件和组件组合模块的方法
公开(公告)号：US20080149381A1
公开(公告)日：2008-06-26
申请号：US12041730
申请日：2008-03-04
申请人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
发明人： Makoto KAWAGISHI , Tsutomu IEKI , Tadashi KANI , Satoru NODA
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/187 , H01L21/568 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/16238 , H01L2224/24195 , H01L2924/15192 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/20 , H05K3/4644 , H05K2201/0715 , H05K2201/096 , H01L2924/00012
摘要： In a method for manufacturing a component incorporating module, lands for mounting components are independently formed on a transfer plate in an isolated manner, and circuit components are connected to the lands for mounting components. An insulation resin layer is formed so as to cover the circuit components on the transfer plate, and is hardened. The circuit components and the lands for mounting components are embedded in the upper resin layer. Thereafter, the transfer plate is removed from the resin layer, and wiring patterns which are used to connect between lands or connect lands to other portions are formed on a back surface of the resin layer on which the lands for mounting components are exposed.
摘要翻译：在用于制造组件组合模块的方法中，用于安装部件的焊盘独立地形成在转印板上，并且电路部件连接到用于安装部件的焊盘。形成绝缘树脂层，以覆盖转印板上的电路元件，并被硬化。电路部件和用于安装部件的焊盘嵌入在上树脂层中。此后，从树脂层除去转印板，并且在用于安装部件的焊盘露出的树脂层的背面上形成用于将焊盘或连接焊盘连接到其它部分的布线图案。

2. 发明授权

US07885081B2 Component incorporating module 有权
标题翻译：组件结合模块
公开(公告)号：US07885081B2
公开(公告)日：2011-02-08
申请号：US12041730
申请日：2008-03-04
申请人： Makoto Kawagishi , Tsutomu Ieki , Tadashi Kani , Satoru Noda
发明人： Makoto Kawagishi , Tsutomu Ieki , Tadashi Kani , Satoru Noda
IPC分类号： H05K1/18
CPC分类号： H05K1/187 , H01L21/568 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/16238 , H01L2224/24195 , H01L2924/15192 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/20 , H05K3/4644 , H05K2201/0715 , H05K2201/096 , H01L2924/00012
摘要： A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components connected to the lands to mount components. The circuit components are embedded in the resin layer. The plurality of lands have thicknesses that are greater than those of the wiring patterns adjacent to the corresponding lands.
摘要翻译：一种组件结合模块包括绝缘树脂层，多个焊盘，其布置成安装成与沿着树脂层的第一主表面布置的多个焊盘连接的部件和布线图案，以及连接到焊盘的电路部件，以安装组件。电路元件嵌入在树脂层中。多个焊盘的厚度大于与相应焊盘相邻的布线图案的厚度。

3. 发明授权

US07488903B2 Method for manufacturing circuit modules and circuit module 有权
标题翻译：电路模块和电路模块的制造方法
公开(公告)号：US07488903B2
公开(公告)日：2009-02-10
申请号：US12107163
申请日：2008-04-22
申请人： Makoto Kawagishi , Tsutomu Ieki
发明人： Makoto Kawagishi , Tsutomu Ieki
IPC分类号： H05K9/00
CPC分类号： H05K1/0218 , H01L21/561 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/552 , H01L24/97 , H01L25/0657 , H01L25/162 , H01L25/165 , H01L2225/06541 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H05K3/0052 , H05K3/284 , H05K3/403 , H05K3/429 , Y10T29/49146
摘要： A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.
摘要翻译：准备由集合基板限定的模块基板，并且将电路部件安装在模块基板上。绝缘树脂层形成在模块基板的大致整个上表面上，使得电路部件设置在绝缘树脂层中，并且在绝缘树脂层的顶表面上形成顶表面屏蔽层。在模块基板和绝缘树脂层中，在对应于小基板的边界部分的位置处形成第一通孔，以在模块基板和绝缘树脂层的厚度方向上延伸。第一电极膜形成在第一通孔的内表面上，以连接到第一屏蔽层，并且第一通孔填充有填充材料。接下来，在与小基板的边界线的剩余部分相对应的位置处，在厚度方向上延伸形成第二通孔，并且在第二通孔的内表面上形成第二电极膜，以便连接到顶表面屏蔽层和第一电极膜。沿着小基板的边界线切割填充第一通孔的填充材料，从而将集合基板划分成小的基板以获得电路模块。

4. 发明申请

US20080210462A1 METHOD FOR MANUFACTURING CIRCUIT MODULES AND CIRCUIT MODULE 有权
标题翻译：制造电路模块和电路模块的方法
公开(公告)号：US20080210462A1
公开(公告)日：2008-09-04
申请号：US12107163
申请日：2008-04-22
申请人： Makoto Kawagishi , Tsutomu Ieki
发明人： Makoto Kawagishi , Tsutomu Ieki
IPC分类号： H05K9/00 , H05K3/30
CPC分类号： H05K1/0218 , H01L21/561 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/552 , H01L24/97 , H01L25/0657 , H01L25/162 , H01L25/165 , H01L2225/06541 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H05K3/0052 , H05K3/284 , H05K3/403 , H05K3/429 , Y10T29/49146
摘要： A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.
摘要翻译：准备由集合基板限定的模块基板，并且将电路部件安装在模块基板上。绝缘树脂层形成在模块基板的大致整个上表面上，使得电路部件设置在绝缘树脂层中，并且在绝缘树脂层的顶表面上形成顶表面屏蔽层。在模块基板和绝缘树脂层中，在对应于小基板的边界部分的位置处形成第一通孔，以在模块基板和绝缘树脂层的厚度方向上延伸。第一电极膜形成在第一通孔的内表面上，以连接到第一屏蔽层，并且第一通孔填充有填充材料。接下来，在与小基板的边界线的剩余部分对应的位置处，在厚度方向上延伸形成第二通孔，并且在第二通孔的内表面上形成第二电极膜，以便连接到顶表面屏蔽层和第一电极膜。沿着小基板的边界线切割填充第一通孔的填充材料，从而将集合基板划分成小的基板以获得电路模块。

5. 发明授权

US07042297B2 High-frequency oscillator 有权
标题翻译：高频振荡器
公开(公告)号：US07042297B2
公开(公告)日：2006-05-09
申请号：US10853676
申请日：2004-05-26
申请人： Makoto Kawagishi , Hidemori Akagi , Tomoe Izumi , Masanari Tago
发明人： Makoto Kawagishi , Hidemori Akagi , Tomoe Izumi , Masanari Tago
IPC分类号： H03B5/12
CPC分类号： H03B5/1203 , H03B5/1231 , H03B2200/0048 , H03B2201/0266
摘要： A frequency-selective high-frequency oscillator includes a first switching circuit that controls the operation of a first amplifying circuit, and a second switching circuit that controls the operation of the first switching circuit and a second amplifying circuit. Switching control signals are input to the second switching circuit. When the switching control signal is “Low”, the second switching circuit turns ON and the second amplifying circuit only operates, thereby outputting a high frequency signal with a resonant frequency according to a second resonant circuit. On the other hand, when the switching control signal is “High”, the second switching circuit turns OFF and the first switching circuit turns ON, which causes the first amplifying circuit only to operate. Thus, a high frequency signal with a resonant frequency acceding to a first resonant circuit is output.
摘要翻译：频率选择性高频振荡器包括控制第一放大电路的操作的第一开关电路和控制第一开关电路的操作的第二开关电路和第二放大电路。开关控制信号被输入到第二开关电路。当开关控制信号为“低”时，第二开关电路导通，第二放大电路仅工作，从而根据第二谐振电路输出具有谐振频率的高频信号。另一方面，当开关控制信号为“高”时，第二开关电路断开，第一开关电路导通，这使第一放大电路仅工作。因此，输出具有与第一谐振电路相连的谐振频率的高频信号。

6. 发明申请

US20050017814A1 High-frequency oscillator 有权
标题翻译：高频振荡器
公开(公告)号：US20050017814A1
公开(公告)日：2005-01-27
申请号：US10853676
申请日：2004-05-26
申请人： Makoto Kawagishi , Hidemori Akagi , Tomoe Izumi , Masanari Tago
发明人： Makoto Kawagishi , Hidemori Akagi , Tomoe Izumi , Masanari Tago
IPC分类号： H03B5/02 , H03B5/12 , H03B5/00
CPC分类号： H03B5/1203 , H03B5/1231 , H03B2200/0048 , H03B2201/0266
摘要： A frequency-selective high-frequency oscillator includes a first switching circuit that controls the operation of a first amplifying circuit, and a second switching circuit that controls the operation of the first switching circuit and a second amplifying circuit. Switching control signals are input to the second switching circuit. When the switching control signal is “Low”, the second switching circuit turns ON and the second amplifying circuit only operates, thereby outputting a high frequency signal with a resonant frequency according to a second resonant circuit. On the other hand, when the switching control signal is “High”, the second switching circuit turns OFF and the first switching circuit turns ON, which causes the first amplifying circuit only to operate. Thus, a high frequency signal with a resonant frequency acceding to a first resonant circuit is output.
摘要翻译：频率选择性高频振荡器包括控制第一放大电路的操作的第一开关电路和控制第一开关电路的操作的第二开关电路和第二放大电路。开关控制信号被输入到第二开关电路。当开关控制信号为“低”时，第二开关电路导通，第二放大电路仅工作，从而根据第二谐振电路输出具有谐振频率的高频信号。另一方面，当开关控制信号为“高”时，第二开关电路断开，第一开关电路导通，这使第一放大电路仅工作。因此，输出具有与第一谐振电路相连的谐振频率的高频信号。

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