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1. 发明授权

US06777789B1 Mounting for a package containing a chip 失效
标题翻译：安装一个包含芯片的包装
公开(公告)号：US06777789B1
公开(公告)日：2004-08-17
申请号：US10340256
申请日：2003-01-10
申请人： Thomas P. Glenn , Steven Webster , Roy D. Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy D. Hollaway
IPC分类号： H01L23495
CPC分类号： H05K1/182 , H01L23/5389 , H01L24/45 , H01L24/48 , H01L2224/32145 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/73265 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, such as a leadframe or a laminate sheet, and input/output terminals. A chip is on a first side of the base and is electrically connected (directly or indirectly) to the input/output terminals. A cap, which may be a molded encapsulant, is provided on the first side of the base over the chip. The package is mounted on the substrate so that the cap is in the aperture, and a peripheral portion of the first side of the base is over the mounting surface so as to support the package in the aperture and allow the input/output terminals of the package to be juxtaposed with to the circuit patterns of the mounting surface. Because the cap is within the aperture, a height of the package above the mounting surface is minimized.
摘要翻译：公开了一种用于包含半导体芯片的封装的安装件，以及制造这种安装的方法。安装件包括具有其上具有导电迹线的安装表面的基板和延伸穿过基板的孔。该包装包括底座，例如引线框或层压板，以及输入/输出端子。芯片位于基座的第一侧，并与输入/输出端子电连接（直接或间接）。在芯片上的基座的第一侧上提供可以是模制密封剂的盖。封装被安装在基板上，使得帽位于孔中，并且基座的第一侧的周边部分在安装表面上方，以便将封装支撑在孔中，并且允许端子的输入/输出端子包装与安装表面的电路图案并列。因为盖在孔内，所以在安装表面上方的包装的高度被最小化。

2. 发明授权

US06686580B1 Image sensor package with reflector 有权
标题翻译：带反射镜的图像传感器封装
公开(公告)号：US06686580B1
公开(公告)日：2004-02-03
申请号：US09906992
申请日：2001-07-16
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2700
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L31/02325 , H01L2224/05553 , H01L2224/32225 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/15311 , H01L2924/3025 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： An image sensor package includes a substrate and an image sensor coupled to the substrate. The image sensor includes an upper surface having an active area. A reflector lid is coupled to the substrate. The reflector lid has a first panel having a planar surface. The planar surface is at least partially reflective and is angled relative to the upper surface of the image sensor to reflect electromagnetic radiation to the active area of image sensor.
摘要翻译：图像传感器封装包括衬底和耦合到衬底的图像传感器。图像传感器包括具有有效区域的上表面。反射器盖连接到基板。反射器盖具有具有平坦表面的第一面板。平坦表面至少部分地是反射性的并且相对于图像传感器的上表面成角度，以将电磁辐射反射到图像传感器的有效区域。

3. 发明授权

US06627864B1 Thin image sensor package 有权
标题翻译：薄图像传感器封装
公开(公告)号：US06627864B1
公开(公告)日：2003-09-30
申请号：US09447202
申请日：1999-11-22
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2700
CPC分类号： H01L24/97 , H01L27/14618 , H01L2224/97 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2224/81
摘要： A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.
摘要翻译：薄图像传感器封装包括具有响应于辐射的有效区域的图像传感器。图像传感器安装在对辐射透明的基板上。图像传感器被安装成使得图像传感器的有效区域面向基板。重要的是，衬底具有双重功能。特别地，衬底是覆盖图像传感器的有效区域的窗口。此外，基板是制造图像传感器封装的平台。因此，图像传感器封装薄，重量轻且制造成本低廉。

4. 发明授权

US06586824B1 Reduced thickness packaged electronic device 有权
标题翻译：减薄厚度电子装置
公开(公告)号：US06586824B1
公开(公告)日：2003-07-01
申请号：US09916716
申请日：2001-07-26
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2302
CPC分类号： H01L27/14618 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/97 , H01L27/14625 , H01L27/14683 , H01L31/0203 , H01L31/02327 , H01L31/18 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/85001 , H01L2224/85399 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2224/85 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied. In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.
摘要翻译：通过首先通过基板形成孔来封装诸如传感器管芯的电子装置。孔足够大以将整个电子设备定位在孔内。然后将带施加到基板的第二表面以覆盖孔的第二侧，从而在孔的底部形成带表面。然后将电子设备定位在孔内，使得电子设备与孔的底部接触并粘附到带表面。在电子设备和基板之间形成电子连接，并且施加一层密封剂。在一个实施例中，电子设备是传感器管芯，并且在施加密封剂之前，光学元件位于传感器管芯的有源区域之上。然后，密封剂围绕并将光学元件保持在传感器管芯的有源区域上的适当位置。

5. 发明授权

US06580153B1 Structure for protecting a micromachine with a cavity in a UV tape 有权
标题翻译：用于在UV胶带中用腔保护微机械的结构
公开(公告)号：US06580153B1
公开(公告)日：2003-06-17
申请号：US09811183
申请日：2001-03-14
申请人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
发明人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
IPC分类号： H01L21304
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L2221/68327 , H01L2221/6834 , H01L2223/54453 , H01L2224/48463 , H01L2924/3025
摘要： A protective layer includes a polymerized region, which forms a cavity in an interior surface of the protective layer. The protective layer is mounted to a micromachine chip such that an active area of the micromachine chip is located within the cavity of the protective layer. The protective layer protects the active area during front-side or back-side singulation of the micromachine chip from a micromachine substrate.
摘要翻译：保护层包括在保护层的内表面中形成空腔的聚合区域。保护层安装到微机械芯片，使得微机械芯片的有效区域位于保护层的空腔内。保护层在微机械基片的前侧或后侧分割期间保护有源区域。

6. 发明授权

US06528875B1 Vacuum sealed package for semiconductor chip 有权
标题翻译：用于半导体芯片的真空密封封装
公开(公告)号：US06528875B1
公开(公告)日：2003-03-04
申请号：US09839305
申请日：2001-04-20
申请人： Thomas P. Glenn , Roy D. Hollaway , Steven Webster
发明人： Thomas P. Glenn , Roy D. Hollaway , Steven Webster
IPC分类号： H01L2312
CPC分类号： B81B7/007 , B81B2207/096 , H01L23/10 , H01L23/13 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/16152 , H01L2924/16195 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package includes a ceramic substrate and a lid that together define a cavity wherein the chip is mounted. The substrate includes a conductive (e.g., metal) interconnect pattern that extends, at least in part, vertically through the substrate. I/O terminals are provided on an external surface of the substrate. A vent hole, at least partially lined with a metal coating, extends through the substrate into the cavity. A metal plug seals the vent hole. The vent hole is sealed by placing the package in a vacuum chamber, evacuating the chamber, and heating the chamber so as to cause a metal preform on the substrate to flow into the vent hole and form the plug.
摘要翻译：公开了一种用于诸如微机电（MEM）芯片的半导体芯片的真空密封封装以及制造这种封装的方法。在示例性实施例中，封装包括陶瓷基板和盖，其一起限定其中安装芯片的空腔。衬底包括至少部分地垂直延伸穿过衬底的导电（例如，金属）互连图案。 I / O端子设置在基板的外表面上。至少部分衬有金属涂层的排气孔延伸穿过衬底进入空腔。金属插头密封通气孔。通过将包装物放置在真空室中，排空室并加热室以使基板上的金属预成型件流入通气孔并形成插塞来密封通气孔。

7. 发明授权

US06396043B1 Thin image sensor package fabrication method 有权
标题翻译：薄膜传感器封装制造方法
公开(公告)号：US06396043B1
公开(公告)日：2002-05-28
申请号：US09448538
申请日：1999-11-22
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L2700
CPC分类号： H01L24/97 , H01L27/14601 , H01L2224/97 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2224/81
摘要： A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.
摘要翻译：薄图像传感器封装包括具有响应于辐射的有效区域的图像传感器。图像传感器安装在对辐射透明的基板上。图像传感器被安装成使得图像传感器的有效区域面向基板。重要的是，衬底具有双重功能。特别地，衬底是覆盖图像传感器的有效区域的窗口。此外，基板是制造图像传感器封装的平台。因此，图像传感器封装薄，重量轻且制造成本低廉。

8. 发明授权

US07059040B1 Optical module with lens integral holder fabrication method 有权
标题翻译：具有透镜一体式支架制造方法的光学模块
公开(公告)号：US07059040B1
公开(公告)日：2006-06-13
申请号：US09764196
申请日：2001-01-16
申请人： Steven Webster , Thomas P. Glenn , Roy Dale Hollaway
发明人： Steven Webster , Thomas P. Glenn , Roy Dale Hollaway
IPC分类号： H05K3/20
CPC分类号： H01L27/14618 , G02B7/02 , H01L24/73 , H01L24/97 , H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/19041 , H04N5/2253 , H04N5/2254 , H04N5/2257 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49787 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.
摘要翻译：一种形成光学模块的方法包括将图像传感器安装到基底的基底上，并将透镜外壳粘合到基底的侧壁上。透镜壳体的安装表面包括具有水平表面和垂直表面的锁定特征。基板的侧壁包括接合表面。为了将透镜壳体粘合到基板的侧壁，在透镜壳体的锁定特征的水平表面和侧壁的接合表面之间形成结合。此外，在透镜壳体的锁定特征的垂直表面和侧壁的内表面之间形成结合。

9. 发明授权

US06943429B1 Wafer having alignment marks extending from a first to a second surface of the wafer 失效
标题翻译：晶片具有从晶片的第一表面延伸到第二表面的对准标记
公开(公告)号：US06943429B1
公开(公告)日：2005-09-13
申请号：US09803084
申请日：2001-03-08
申请人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
发明人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
IPC分类号： B23K26/00 , H01L23/12 , H01L23/544 , H01L27/01 , H01L27/04
CPC分类号： H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A marked wafer includes a front-side surface and a back-side surface. A vertical scribe line and a horizontal scribe line are on the front-side surface of the wafer. A back-side alignment mark is located at an intersection of the vertical scribe line and the horizontal scribe line. The back-side alignment mark extends from the front-side surface to the back-side surface of the wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.
摘要翻译：标记的晶片包括前侧表面和后侧表面。垂直刻划线和水平划线位于晶片的正面上。背面对准标记位于垂直划线和水平划线的交点处。背面对准标记从晶片的前侧表面延伸到背面。背面对准标记用于对准从后侧表面对晶片进行单片化的锯。

10. 发明授权

US06672773B1 Optical fiber having tapered end and optical connector with reciprocal opening 有权
标题翻译：具有锥形端的光纤和具有往复开口的光学连接器
公开(公告)号：US06672773B1
公开(公告)日：2004-01-06
申请号：US09751536
申请日：2000-12-29
申请人： Thomas P. Glenn , Steven Webster
发明人： Thomas P. Glenn , Steven Webster
IPC分类号： G02B638
CPC分类号： G02B6/30
摘要： A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optical connector for the fiber includes a base having a receiving section and a waveguide formed therein. The receiving section is a flared channel having opposing orthogonal tapered sidewalls and a horizontal bottom surface perpendicular to the sidewalls. The waveguide is optically accessible at a narrow inner end of the channel. The angle of taper of the sidewalls of the channel matches the angle of taper of the sidewalls of the optical fiber. When the optical fiber is inserted into the open end of the channel and is moved toward the narrow inner end of the channel, the sidewalls of the fiber and channel come into contact with each other. In addition, a bottom surface of the fiber rests on the horizontal bottom surface of the channel. The tip of the fiber is positioned adjacent to the waveguide in precise alignment along the x, y, and z axes. The optical fiber is thereby positioned for optical communication through the waveguide with another optical fiber, a light source, or a light receiving element positioned at an opposite end of the waveguide.
摘要翻译：公开了一种将光纤连接到波导和其它光学元件的方法和装置。在一个实施例中，光纤被修改为具有朝向纤维的尖端逐渐变细的相对的正交锥形侧壁。用于光纤的光学连接器包括具有形成在其中的接收部分和波导的基座。接收部分是具有相对的正交锥形侧壁和垂直于侧壁的水平底表面的扩口通道。波导在通道的窄内端处是光学可访问的。通道的侧壁的锥度角与光纤的侧壁的锥度角相匹配。当光纤插入通道的开口端并朝向通道的窄内端移动时，光纤和通道的侧壁彼此接触。此外，纤维的底面位于通道的水平底面上。纤维的尖端沿着x，y和z轴精确对准地定位在波导附近。因此，光纤被定位成通过波导与另一个光纤，光源或位于波导的相对端的光接收元件进行光通信。

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