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    • 2. 发明申请
    • VACUUM PROCESSING APPARATUS
    • 真空加工设备
    • US20120014768A1
    • 2012-01-19
    • US13181011
    • 2011-07-12
    • Tetsuya MIYASHITAMasamichi HaraYasushi MizusawaToshiharu Hirata
    • Tetsuya MIYASHITAMasamichi HaraYasushi MizusawaToshiharu Hirata
    • H01L21/677
    • H01L21/67173H01L21/67736
    • In a vacuum processing apparatus, a process station includes processing regions arranged in a row at intervals to perform vacuum processing on substrates, the substrates being sequentially transferred between the processing regions from upstream to downstream; a first transport unit for transferring the substrates in a first preliminary vacuum chamber to the processing region at an upstream end; a second transport unit arranged between the adjacent processing regions; and a third transport unit for transferring the substrates from the processing region at a downstream end to a second preliminary vacuum chamber. The control unit outputs a control signal such that in the transfer operations in which the substrates are respectively transferred to the subsequent downstream processing regions from the first preliminary vacuum chamber to the processing region at the downstream end, time periods of at least two transfer operations partially or totally overlap with each other.
    • 在真空处理装置中,处理站包括间隔地配置成一行的处理区域,对基板进行真空处理,基板从上游到下游依次转印在处理区域之间; 用于将第一预备真空室中的基板转移到上游端的处理区域的第一输送单元; 布置在相邻处理区域之间的第二传送单元; 以及用于将基板从下游端的处理区域转移到第二预备真空室的第三输送单元。 控制单元输出控制信号,使得在将基板分别从第一预备真空室向下游端的处理区转移到后续的下游处理区域的转印操作中,至少两个转印操作的时间段部分地 或完全重叠。
    • 5. 发明申请
    • VACUUM PROCESSING SYSTEM
    • 真空加工系统
    • US20100236478A1
    • 2010-09-23
    • US12676000
    • 2008-08-22
    • Tetsuya MiyashitaNoritomo Tada
    • Tetsuya MiyashitaNoritomo Tada
    • C23C16/00
    • C23C16/54C23C16/4401H01L21/67742
    • A vacuum processing system includes CVD processing chambers to perform a CVD process on a wafer W under a vacuum, and a transfer chamber having loading/unloading holes to load/unload the wafer W and being connected to the CVD processing chambers via gate valves G capable of opening/closing the loading/unloading holes. The transfer chamber includes a transfer mechanism to load/unload the wafer W to/from the CVD processing chambers via the loading/unloading holes and the inside of the transfer chamber is maintained in a vacuum state. The vacuum processing system also includes purge-gas discharge members provided near the loading/unloading holes. In a state where the transfer chamber and any one of the processing chambers are communicated with each other by opening of the gate valve G, the purge-gas discharge member discharges a purge gas to the communicated CVD processing chamber via the loading/unloading hole.
    • 真空处理系统包括在真空下对晶片W执行CVD处理的CVD处理室,以及具有用于加载/卸载晶片W并具有经过闸阀G的能力连接到CVD处理室的装载/卸载孔的传送室 打开/关闭装卸孔。 传送室包括一个传送机构,用于经由装载/卸载孔将晶片W装载/从CVD处理室中卸载,转印室的内部保持在真空状态。 真空处理系统还包括设置在装载/卸载孔附近的吹扫气体排出构件。 在传送室和任何一个处理室通过打开闸阀G而彼此连通的状态下,净化气体排放构件经由装载/卸载孔将排出气体排出到连通的CVD处理室。