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1. 发明申请

US20100226068A1 ELECTRIC DOUBLE LAYER CAPACITOR AND METHOD FOR MANUFACTURING SAME 失效
标题翻译：电双层电容器及其制造方法
公开(公告)号：US20100226068A1
公开(公告)日：2010-09-09
申请号：US12161744
申请日：2006-03-12
申请人： Toshiyuki Kitagawa , Toshitaka Hibi , Kouji Tsuyuki , Sayori Hirose , Toshiharu Hirata , Keiko Hashimoto
发明人： Toshiyuki Kitagawa , Toshitaka Hibi , Kouji Tsuyuki , Sayori Hirose , Toshiharu Hirata , Keiko Hashimoto
IPC分类号： H01G9/155
CPC分类号： H01G9/06 , H01G9/016 , H01G9/08 , H01G9/155 , H01G11/74 , H01G11/80 , H01G11/82 , Y02E60/13
摘要： An electric double-layer capacitor includes a cylindrical case having a bottom, a side surface, and an opening, a capacitor element accommodated in the case, the capacitor element, a driving electrolyte accommodated in the case, and a terminal plate provided at the opening of the case. The capacitor element includes a first electrode and a second electrode extending in a direction opposite to the first electrode. The second electrode is joined to the bottom of the case. The first and second electrodes are tilted away from the center axis of the capacitor element. In this electric double-layer capacitor, electrodes of the capacitor element are connected to the case and sealing plate reliably.
摘要翻译：电双层电容器包括具有底部，侧面和开口的圆筒形壳体，容纳在壳体中的电容器元件，电容器元件，容纳在壳体中的驱动电解质，以及设置在开口处的端子板的情况。电容器元件包括沿与第一电极相反的方向延伸的第一电极和第二电极。第二电极连接到壳体的底部。第一和第二电极远离电容器元件的中心轴线倾斜。在这种双电层电容器中，电容器元件的电极可靠地连接到壳体和密封板。

2. 发明授权

US08537526B2 Cylindrical capacitor employing electrolyte solution 有权
标题翻译：使用电解液的圆柱形电容器
公开(公告)号：US08537526B2
公开(公告)日：2013-09-17
申请号：US12537866
申请日：2009-08-07
申请人： Toshiaki Shimizu , Toshitaka Hibi , Toshiharu Hirata , Motohiro Sakata , Hideo Yokoe
发明人： Toshiaki Shimizu , Toshitaka Hibi , Toshiharu Hirata , Motohiro Sakata , Hideo Yokoe
IPC分类号： H01G9/00 , H01G9/10 , H05K5/06
CPC分类号： H01G9/10 , H01G11/80 , Y02E60/13
摘要： A capacitor includes a capacitor element, a bottomed, cylindrical, metallic case, a metallic terminal plate, and a sealing rubber. A flange is provided along the outer circumference of the terminal plate. The flange is brought into contact with the bottom face of the sealing rubber for positioning. The case is wrung from the outside thereof so as to compress the sealing rubber. The sealing rubber has at least one of a ring-shaped top projection wall projecting between the metallic case and the terminal plate on the top face thereof, and a ring-shaped bottom projection wall projecting between the metallic case and the flange on the bottom face thereof.
摘要翻译：电容器包括电容器元件，有底圆柱形金属外壳，金属端子板和密封橡胶。沿端子板的外周设有凸缘。凸缘与密封橡胶的底面接触以进行定位。从外部将外壳拧紧以压缩密封橡胶。密封橡胶具有在金属壳体与顶板之间的端子板之间突出的环状顶部突出壁中的至少一个，并且在底面上突出于金属壳体与凸缘之间的环形底部突出壁其中。

3. 发明申请

US20120014768A1 VACUUM PROCESSING APPARATUS 审中-公开
标题翻译：真空加工设备
公开(公告)号：US20120014768A1
公开(公告)日：2012-01-19
申请号：US13181011
申请日：2011-07-12
申请人： Tetsuya MIYASHITA , Masamichi Hara , Yasushi Mizusawa , Toshiharu Hirata
发明人： Tetsuya MIYASHITA , Masamichi Hara , Yasushi Mizusawa , Toshiharu Hirata
IPC分类号： H01L21/677
CPC分类号： H01L21/67173 , H01L21/67736
摘要： In a vacuum processing apparatus, a process station includes processing regions arranged in a row at intervals to perform vacuum processing on substrates, the substrates being sequentially transferred between the processing regions from upstream to downstream; a first transport unit for transferring the substrates in a first preliminary vacuum chamber to the processing region at an upstream end; a second transport unit arranged between the adjacent processing regions; and a third transport unit for transferring the substrates from the processing region at a downstream end to a second preliminary vacuum chamber. The control unit outputs a control signal such that in the transfer operations in which the substrates are respectively transferred to the subsequent downstream processing regions from the first preliminary vacuum chamber to the processing region at the downstream end, time periods of at least two transfer operations partially or totally overlap with each other.
摘要翻译：在真空处理装置中，处理站包括间隔地配置成一行的处理区域，对基板进行真空处理，基板从上游到下游依次转印在处理区域之间; 用于将第一预备真空室中的基板转移到上游端的处理区域的第一输送单元; 布置在相邻处理区域之间的第二传送单元; 以及用于将基板从下游端的处理区域转移到第二预备真空室的第三输送单元。控制单元输出控制信号，使得在将基板分别从第一预备真空室向下游端的处理区转移到后续的下游处理区域的转印操作中，至少两个转印操作的时间段部分地或完全重叠。

4. 发明申请

US20080050538A1 Thin Film Forming Method and Thin Film Forming Apparatus 有权
标题翻译：薄膜成型方法和薄膜成型装置
公开(公告)号：US20080050538A1
公开(公告)日：2008-02-28
申请号：US11573272
申请日：2005-07-19
申请人： Toshiharu Hirata
发明人： Toshiharu Hirata
IPC分类号： C23C16/455 , H01L21/28 , H01L21/285 , H01L21/31 , H01L21/316
CPC分类号： C23C16/45527 , C23C16/4412 , C23C16/45542 , C23C16/45557 , H01L21/28562 , H01L21/3141
摘要： A thin film formation method is used for forming a thin film by providing a conductance valve on an exhaust path connecting a depressurizable processing chamber and a vacuum pump, arranging a processing object substrate inside the processing chamber, performing once or plural times a cycle including a first step of supplying a first reactive gas and a second step of supplying a second reactive gas into the processing chamber during a film formation processing period to cause a chemical reaction between the first reactive gas and the second reactive gas, and using the chemical reaction to form the thin film on the substrate. The thin film formation method includes a first process of supplying into the processing chamber a predetermined gas by a specified flow while exhausting the inside of the processing chamber, and determining a reference value that is equal to a valve opening level of the conductance valve causing pressure inside the processing chamber to substantially match a specified value, the first process being performed during a preparation period before the film formation processing period starts; and a second process of maintaining the valve opening level of the conductance valve at the reference value at least during the first step and the second step of the cycle performed during the film formation processing period.
摘要翻译：通过在连接可降压处理室和真空泵的排气路径上设置导电阀，在处理室内配置处理对象基板，进行一次或多次循环，使用薄膜形成方法来形成薄膜，该循环包括提供第一反应气体的第一步骤和在成膜处理周期期间将第二反应气体供应到处理室中以引起第一反应气体和第二反应气体之间的化学反应的第二步骤，并且使用化学反应在基板上形成薄膜。薄膜形成方法包括在排出处理室内部时以特定流量向处理室供给预定气体的第一过程，并且确定等于导通阀的开阀水平的基准值，引起压力在处理室内部以基本上匹配指定值，第一处理在成膜处理周期开始之前的准备期间执行; 以及至少在成膜处理期间执行的循环的第一步骤和第二步骤期间将导通阀的阀开度水平维持在基准值的第二过程。

5. 发明授权

US07972649B2 Thin film forming method and thin film forming apparatus 有权
标题翻译：薄膜形成方法和薄膜形成装置
公开(公告)号：US07972649B2
公开(公告)日：2011-07-05
申请号：US11573272
申请日：2005-07-19
申请人： Toshiharu Hirata
发明人： Toshiharu Hirata
IPC分类号： C23C16/52
CPC分类号： C23C16/45527 , C23C16/4412 , C23C16/45542 , C23C16/45557 , H01L21/28562 , H01L21/3141
摘要： A thin film formation method is used for forming a thin film by providing a conductance valve on an exhaust path connecting a depressurizable processing chamber and a vacuum pump, arranging a processing object substrate inside the processing chamber, performing once or plural times a cycle including a first step of supplying a first reactive gas and a second step of supplying a second reactive gas into the processing chamber during a film formation processing period to cause a chemical reaction between the first reactive gas and the second reactive gas, and using the chemical reaction to form the thin film on the substrate. The thin film formation method includes a first process of supplying into the processing chamber a predetermined gas by a specified flow while exhausting the inside of the processing chamber, and determining a reference value that is equal to a valve opening level of the conductance valve causing pressure inside the processing chamber to substantially match a specified value, the first process being performed during a preparation period before the film formation processing period starts; and a second process of maintaining the valve opening level of the conductance valve at the reference value at least during the first step and the second step of the cycle performed during the film formation processing period.
摘要翻译：通过在连接可降压处理室和真空泵的排气路径上设置导电阀，在处理室内配置处理对象基板，进行一次或多次循环，使用薄膜形成方法来形成薄膜，该循环包括提供第一反应气体的第一步骤和在成膜处理周期期间将第二反应气体供应到处理室中以引起第一反应气体和第二反应气体之间的化学反应的第二步骤，并且使用化学反应在基板上形成薄膜。薄膜形成方法包括在排出处理室内部时以特定流量向处理室供给预定气体的第一过程，并且确定等于导通阀的开阀水平的基准值，引起压力在处理室内部以基本上匹配指定值，第一处理在成膜处理周期开始之前的准备期间执行; 以及至少在成膜处理期间执行的循环的第一步骤和第二步骤期间将导通阀的阀开度水平维持在基准值的第二过程。

6. 发明申请

US20090296316A1 CAPACITOR 有权
标题翻译：电容器
公开(公告)号：US20090296316A1
公开(公告)日：2009-12-03
申请号：US12537866
申请日：2009-08-07
申请人： Toshiaki Shimizu , Toshitaka Hibi , Toshiharu Hirata , Motohiro Sakata , Hideo Yokoe
发明人： Toshiaki Shimizu , Toshitaka Hibi , Toshiharu Hirata , Motohiro Sakata , Hideo Yokoe
IPC分类号： H01G9/10 , H01G9/155
CPC分类号： H01G9/10 , H01G11/80 , Y02E60/13
摘要： A capacitor includes a capacitor element, a bottomed, cylindrical, metallic case, a metallic terminal plate, and a sealing rubber. A flange is provided along the outer circumference of the terminal plate. The flange is brought into contact with the bottom face of the sealing rubber for positioning. The case is wrung from the outside thereof so as to compress the sealing rubber. The sealing rubber has at least one of a ring-shaped top projection wall projecting between the metallic case and the terminal plate on the top face thereof, and a ring-shaped bottom projection wall projecting between the metallic case and the flange on the bottom face thereof.
摘要翻译：电容器包括电容器元件，有底圆柱形金属外壳，金属端子板和密封橡胶。沿端子板的外周设有凸缘。凸缘与密封橡胶的底面接触以进行定位。从外部将外壳拧紧以压缩密封橡胶。密封橡胶具有在金属壳体与顶板之间的端子板之间突出的环状顶部突出壁中的至少一个，并且在底面上突出于金属壳体与凸缘之间的环形底部突出壁其中。

7. 发明授权

US08310809B2 Electric double layer capacitor and method for manufacturing same 失效
标题翻译：双电层电容器及其制造方法
公开(公告)号：US08310809B2
公开(公告)日：2012-11-13
申请号：US12161744
申请日：2007-03-12
申请人： Toshiyuki Kitagawa , Toshitaka Hibi , Kouji Tsuyuki , Sayori Hirose , Toshiharu Hirata , Keiko Hashimoto
发明人： Toshiyuki Kitagawa , Toshitaka Hibi , Kouji Tsuyuki , Sayori Hirose , Toshiharu Hirata , Keiko Hashimoto
IPC分类号： H01G9/00
CPC分类号： H01G9/06 , H01G9/016 , H01G9/08 , H01G9/155 , H01G11/74 , H01G11/80 , H01G11/82 , Y02E60/13 , Y10T29/417
摘要： An electric double-layer capacitor includes a cylindrical case having a bottom, a side surface, and an opening, a capacitor element accommodated in the case, the capacitor element, a driving electrolyte accommodated in the case, and a terminal plate provided at the opening of the case. The capacitor element includes a first electrode and a second electrode extending in a direction opposite to the first electrode. The second electrode is joined to the bottom of the case. The first and second electrodes are tilted away from the center axis of the capacitor element. In this electric double-layer capacitor, electrodes of the capacitor element are connected to the case and sealing plate reliably.
摘要翻译：电双层电容器包括具有底部，侧面和开口的圆筒形壳体，容纳在壳体中的电容器元件，电容器元件，容纳在壳体中的驱动电解质，以及设置在开口处的端子板的情况。电容器元件包括沿与第一电极相反的方向延伸的第一电极和第二电极。第二电极连接到壳体的底部。第一和第二电极远离电容器元件的中心轴线倾斜。在这种双电层电容器中，电容器元件的电极可靠地连接到壳体和密封板。

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