专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08349653B2 Use of device assembly for a generalization of three-dimensional metal interconnect technologies 有权
标题翻译：使用器件组件来推广三维金属互连技术
公开(公告)号：US08349653B2
公开(公告)日：2013-01-08
申请号：US12792565
申请日：2010-06-02
申请人： Pirooz Parvarandeh
发明人： Pirooz Parvarandeh
IPC分类号： H01L21/00
CPC分类号： H01L24/95 , H01L21/673 , H01L23/13 , H01L24/19 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68313 , H01L2224/24137 , H01L2224/32225 , H01L2224/80006 , H01L2224/83005 , H01L2224/83192 , H01L2224/95136 , H01L2224/95143 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10158 , H01L2924/10253 , H01L2924/10329 , H01L2924/1033 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15156 , H01L2924/15165 , H01L2924/15311 , H01L2224/82
摘要： An assembly process properly positions and align a plurality of first die within a carrier substrate. The first die are positioned within cavities formed in the carrier substrate. The carrier substrate is then aligned with a second substrate having a plurality of second die fabricated therein. The first die and the second die are fabricated using different technologies. Aligning the carrier substrate and the second substrate aligns the first die with the second die. One or more first die can be aligned with each second die. Once aligned, a wafer bonding process is performed to bond the first die to the second die. In some cases, the carrier substrate is removed, leaving behind the first die bonded to the second die of the second substrate. In other cases, the carrier substrate is left in place as a cap. The second substrate is then cut to form die stacks.
摘要翻译：组装过程在载体衬底内适当地定位和对准多个第一管芯。第一模具定位在形成在载体基板中的空腔内。然后将载体衬底与其中制造的多个第二模具的第二衬底对准。第一个模具和第二个模具使用不同的技术制造。使载体基板和第二基板对齐，使第一模具与第二模具对准。一个或多个第一管芯可以与每个第二管芯对准。一旦对准，执行晶片接合工艺以将第一管芯连接到第二管芯。在一些情况下，去除载体衬底，留下第一裸片与第二衬底的第二裸片结合。在其他情况下，载体基板作为盖留在原位。然后将第二衬底切割以形成模具堆叠。

2. 发明授权

US09294063B1 Digital input circuit and method for high voltage sensors 有权
标题翻译：高压传感器数字输入电路及方法
公开(公告)号：US09294063B1
公开(公告)日：2016-03-22
申请号：US13472360
申请日：2012-05-15
申请人： Anthony S. Partow , Pirooz Parvarandeh
发明人： Anthony S. Partow , Pirooz Parvarandeh
IPC分类号： H03G11/00
CPC分类号： H03K19/017509 , H03G11/00 , H03G11/004 , H03G99/00 , H03K3/356
摘要： A digital input circuit includes a series connection of a current limiter and a switch having a switch control input coupled between a signal input and ground, and a logic level shifter coupled to the signal input and having a switch control output coupled to the switch control input and a signal output, where a maximum amplitude at the signal input is greater than a maximum amplitude at the signal output. A digital input method includes coupling an input signal to ground with a current limiter by closing an electronic switch, providing an output signal responsive to the input signal, where a maximum amplitude of the input signal is greater than a maximum amplitude of the output signal, by latching the output signal while the input signal is above a threshold voltage and opening the electronic switch after the output signal is latched.
摘要翻译：数字输入电路包括电流限制器和具有耦合在信号输入和接地之间的开关控制输入的开关的串联连接和耦合到信号输入的逻辑电平移位器，并且具有耦合到开关控制输入的开关控制输出以及信号输出，其中信号输入处的最大幅度大于信号输出处的最大振幅。数字输入方法包括通过关闭电子开关将输入信号与电流限制器相耦合，提供响应于输入信号的输出信号，其中输入信号的最大幅度大于输出信号的最大幅度，通过在输入信号高于阈值电压时锁存输出信号，并且在输出信号被锁存之后打开电子开关。

3. 发明授权

US08686560B2 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress 有权
标题翻译：具有凸块组件的晶片级芯片级封装器件被配置为减轻由于应力引起的故障
公开(公告)号：US08686560B2
公开(公告)日：2014-04-01
申请号：US12755929
申请日：2010-04-07
申请人： Pirooz Parvarandeh , Reynante Alvarado , Chiung C. Lo , Arkadii V. Samoilov
发明人： Pirooz Parvarandeh , Reynante Alvarado , Chiung C. Lo , Arkadii V. Samoilov
IPC分类号： H01L23/488
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2224/0345 , H01L2224/0346 , H01L2224/03828 , H01L2224/0401 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/0603 , H01L2224/0613 , H01L2224/11001 , H01L2224/11312 , H01L2224/1132 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17517 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/1432 , H01L2924/1436 , H01L2924/3512 , H01L2224/05552
摘要： Wafer-level chip-scale package semiconductor devices are described that have bump assemblies configured to mitigate solder bump failures due to stresses, particularly stresses caused by CTE mismatch during thermal cycling tests, dynamic deformation during drop tests or cyclic bending tests, and so on. In an implementation, the wafer-level chip-scale package devices include an integrated circuit chip having two or more arrays of bump assemblies for mounting the device to a printed circuit board. At least one of the arrays includes bump assemblies that are configured to withstand higher levels of stress than the bump assemblies of the remaining arrays.
摘要翻译：描述了具有凸块组件的晶片级芯片级封装半导体器件，所述凸块组件被配置为减轻由于应力导致的焊料凸块故障，特别是在热循环测试期间由CTE失配引起的应力，跌落测试期间的动态变形或循环弯曲测试等。在一个实现中，晶片级芯片级封装器件包括具有两个或更多个凸块组件阵列的集成电路芯片，用于将器件安装到印刷电路板上。所述阵列中的至少一个包括凸块组件，其被配置为承受比剩余阵列的凸块组件更高的应力水平。

4. 发明申请

US20110300668A1 USE OF DEVICE ASSEMBLY FOR A GENERALIZATION OF THREE-DIMENSIONAL METAL INTERCONNECT TECHNOLOGIES 有权
标题翻译：用于三维金属互连技术通用的器件组件的使用
公开(公告)号：US20110300668A1
公开(公告)日：2011-12-08
申请号：US12792565
申请日：2010-06-02
申请人： Pirooz Parvarandeh
发明人： Pirooz Parvarandeh
IPC分类号： H01L21/70 , H01L21/60
CPC分类号： H01L24/95 , H01L21/673 , H01L23/13 , H01L24/19 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68313 , H01L2224/24137 , H01L2224/32225 , H01L2224/80006 , H01L2224/83005 , H01L2224/83192 , H01L2224/95136 , H01L2224/95143 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10158 , H01L2924/10253 , H01L2924/10329 , H01L2924/1033 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15156 , H01L2924/15165 , H01L2924/15311 , H01L2224/82
摘要： An assembly process properly positions and align a plurality of first die within a carrier substrate. The first die are positioned within cavities formed in the carrier substrate. The carrier substrate is then aligned with a second substrate having a plurality of second die fabricated therein. The first die and the second die are fabricated using different technologies. Aligning the carrier substrate and the second substrate aligns the first die with the second die. One or more first die can be aligned with each second die. Once aligned, a wafer bonding process is performed to bond the first die to the second die. In some cases, the carrier substrate is removed, leaving behind the first die bonded to the second die of the second substrate. In other cases, the carrier substrate is left in place as a cap. The second substrate is then cut to form die stacks.
摘要翻译：组装过程在载体衬底内适当地定位和对准多个第一管芯。第一模具定位在形成在载体基板中的空腔内。然后将载体衬底与其中制造的多个第二模具的第二衬底对准。第一个模具和第二个模具使用不同的技术制造。使载体基板和第二基板对齐，使第一模具与第二模具对准。一个或多个第一管芯可以与每个第二管芯对准。一旦对准，执行晶片接合工艺以将第一管芯连接到第二管芯。在一些情况下，去除载体衬底，留下第一裸片与第二衬底的第二裸片结合。在其他情况下，载体基板作为盖留在原位。然后将第二衬底切割以形成模具堆叠。

5. 发明授权

US09229581B2 Method for detecting gestures using a multi-segment photodiode and one or fewer illumination sources 有权
标题翻译：使用多段光电二极管和一个或多个照明源检测手势的方法
公开(公告)号：US09229581B2
公开(公告)日：2016-01-05
申请号：US13352299
申请日：2012-01-17
申请人： David Skurnik , Nevzat Akin Kestelli , Ilya K. Veygman , Anand Chamakura , Christopher Francis Edwards , Nicole Kerness , Pirooz Parvarandeh , Sunny Kweisun Hsu
发明人： David Skurnik , Nevzat Akin Kestelli , Ilya K. Veygman , Anand Chamakura , Christopher Francis Edwards , Nicole Kerness , Pirooz Parvarandeh , Sunny Kweisun Hsu
IPC分类号： G06F3/042 , G06F3/041 , G06F3/01
CPC分类号： G06F3/0421 , G06F3/017 , G06F3/0416
摘要： A gesture sensing device includes a multiple segmented photo sensor and a control circuit for processing sensed voltages output from the sensor. The control circuit processes the sensed voltage signals to determine target motion relative to the segmented photo sensor. The control circuit includes an algorithm configured to calculate one of more differential analog signals using the sensed voltage signals output from the segmented photo sensors. A vector is determined according to the calculated differential analog signals, the vector is used to determine a direction and/or velocity of the target motion.
摘要翻译：手势感测装置包括多分段光传感器和用于处理从传感器输出的感测电压的控制电路。控制电路处理所感测的电压信号以确定相对于分段的光传感器的目标运动。控制电路包括被配置为使用从分段光传感器输出的检测到的电压信号来计算更多差分模拟信号中的一个的算法。根据计算的差分模拟信号确定矢量，该向量用于确定目标运动的方向和/或速度。

6. 发明申请

US20120280107A1 OPTICAL GESTURE SENSOR USING A SINGLE ILLUMINATION SOURCE 有权
标题翻译：光学仪器传感器使用一个单一的照明源
公开(公告)号：US20120280107A1
公开(公告)日：2012-11-08
申请号：US13304603
申请日：2011-11-25
申请人： David Skurnik , Nevzat Akin Kestelli , Ilya K. Veygman , Anand Chamakura , Christopher Francis Edwards , Nicole Kerness , Pirooz Parvarandeh , Sunny Kweisun Hsu
发明人： David Skurnik , Nevzat Akin Kestelli , Ilya K. Veygman , Anand Chamakura , Christopher Francis Edwards , Nicole Kerness , Pirooz Parvarandeh , Sunny Kweisun Hsu
IPC分类号： G01C21/00
CPC分类号： G01J1/4228 , G06F3/0416 , G06F3/042 , G06F3/0421 , G06F3/0425
摘要： A gesture sensing device includes a single light source and a multiple segmented single photo sensor, or an array of photo sensors, collectively referred to herein as segmented photo sensors. A light modifying structure relays reflected light from the light source onto different segments of the segmented photo sensors. The light modifying structure can be an optical lens structure or a mechanical structure. The different segments of the photo sensor sense reflected light and output corresponding sensed voltage signals. A control circuit receives and processes the sensed voltage signals to determine target motion relative to the segmented photo sensor.
摘要翻译：手势感测装置包括单个光源和多分段单个光传感器，或者这里统称为分段光传感器的光传感器阵列。光修正结构将来自光源的反射光中继到分段光传感器的不同段上。光改性结构可以是光学透镜结构或机械结构。光传感器的不同部分感测反射光并输出相应的感测电压信号。控制电路接收并处理所感测的电压信号以确定相对于分段的光传感器的目标运动。

7. 发明授权

US5988819A Single output transistor output stage for interface applications 失效
标题翻译：用于接口应用的单输出晶体管输出级
公开(公告)号：US5988819A
公开(公告)日：1999-11-23
申请号：US24859
申请日：1998-02-17
申请人： Sui Ping Shieh , Pirooz Parvarandeh , David Bingham
发明人： Sui Ping Shieh , Pirooz Parvarandeh , David Bingham
IPC分类号： H03K19/003 , G05F1/10
CPC分类号： H03K19/00315
摘要： An interface output stage includes a pull-up circuit and a pull-down circuit connected to a positive power supply signal line having a first voltage, an output signal line having an output voltage and a negative power supply signal line having a second voltage. The pull-up circuit includes a single output transistor and a body snatcher circuit, both interconnected between the positive power supply signal line and the output signal line. The body snatcher circuit ties the bodies of the output transistor and the transistors forming the body snatcher circuit to either the first voltage or the output voltage. The pull-down circuit is designed generally similar to the pull-up circuit to tie bodies of its transistors to either the output voltage or the second voltage.
摘要翻译：接口输出级包括上拉电路和连接到具有第一电压的正电源信号线，具有输出电压的输出信号线和具有第二电压的负电源信号线的下拉电路。上拉电路包括在正电源信号线和输出信号线之间互连的单个输出晶体管和主体捕获电路。身体拾取器电路将输出晶体管的主体和形成主体捕获电路的晶体管连接到第一电压或输出电压。下拉电路的设计大体类似于将其晶体管的主体连接到输出电压或第二电压的上拉电路。

8. 发明授权

US11338294B2 Orthogonal polybiosensing and imaging systems 有权
公开(公告)号：US11338294B2
公开(公告)日：2022-05-24
申请号：US16664537
申请日：2019-10-25
申请人： Mandana Veiseh , Pirooz Parvarandeh , S. Bahram Bahrami , Oliver Peter King-Smith , Todd S. Rutherford , Aaron Peter Schellenberg , Timothy Scott Edward Hiller
发明人： Mandana Veiseh , Pirooz Parvarandeh , S. Bahram Bahrami , Oliver Peter King-Smith , Todd S. Rutherford , Aaron Peter Schellenberg , Timothy Scott Edward Hiller
IPC分类号： B01L3/00
摘要： Toward forming a single hybrid biosensing-imaging system that can operate inside an incubator, structures and methods are directed to placing modular and removable biosensors and biocompatible interfaces in 3D transparent test wells that contain biological samples. The technology enables continuous monitoring of multiple simultaneous parameters and functions of a living cell or cell clusters such as alterations of cellular ligands, physicochemical biomarkers, phenotypes, and/or extracellular compositions upon interactions with analytes or during progressions. Methods of capturing and analyzing direct orthogonal information from biological samples in 2D and 3D, which are conducive to generating new insights are presented.

9. 发明授权

US08716649B2 Optical gesture sensor using a single illumination source 有权
标题翻译：光学手势传感器使用单个照明源
公开(公告)号：US08716649B2
公开(公告)日：2014-05-06
申请号：US13304603
申请日：2011-11-25
申请人： David Skurnik , Nevzat Akin Kestelli , Ilya K. Veygman , Anand Chamakura , Christopher Francis Edwards , Nicole Kerness , Pirooz Parvarandeh , Sunny Kweisun Hsu
发明人： David Skurnik , Nevzat Akin Kestelli , Ilya K. Veygman , Anand Chamakura , Christopher Francis Edwards , Nicole Kerness , Pirooz Parvarandeh , Sunny Kweisun Hsu
IPC分类号： G06M7/00 , H01J40/14 , H01L31/0203
CPC分类号： G01J1/4228 , G06F3/0416 , G06F3/042 , G06F3/0421 , G06F3/0425
摘要： A gesture sensing device includes a single light source and a multiple segmented single photo sensor, or an array of photo sensors, collectively referred to herein as segmented photo sensors. A light modifying structure relays reflected light from the light source onto different segments of the segmented photo sensors. The light modifying structure can be an optical lens structure or a mechanical structure. The different segments of the photo sensor sense reflected light and output corresponding sensed voltage signals. A control circuit receives and processes the sensed voltage signals to determine target motion relative to the segmented photo sensor.
摘要翻译：手势感测装置包括单个光源和多分段单个光传感器，或者这里统称为分段光传感器的光传感器阵列。光修正结构将来自光源的反射光中继到分段光传感器的不同段上。光改性结构可以是光学透镜结构或机械结构。光传感器的不同部分感测反射光并输出相应的感测电压信号。控制电路接收并处理所感测的电压信号以确定相对于分段的光传感器的目标运动。

10. 发明申请

US20130173840A1 COMMUNICATIONS CONTROL SYSTEM WITH A SERIAL COMMUNICATIONS INTERFACE AND A PARALLEL COMMUNICATIONS INTERFACE 有权
公开(公告)号：US20130173840A1
公开(公告)日：2013-07-04
申请号：US13341176
申请日：2011-12-30
申请人： James Calvin , Albert Rooyakkers , Pirooz Parvarandeh
发明人： James Calvin , Albert Rooyakkers , Pirooz Parvarandeh
IPC分类号： G06F13/14 , G06F13/00
CPC分类号： G06F13/4282 , G06F1/26 , G06F3/002 , G06F13/00 , G06F13/14 , G06F13/4022 , G06F13/4208 , G06F13/4217 , G06F13/4221 , G06F2213/0004 , G06F2213/0022
摘要： A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of input/output modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise a cross switch.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式