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    • 2. 发明授权
    • Scanning exposure method and apparatus, and device manufacturing method using the same
    • 扫描曝光方法和装置以及使用其的装置制造方法
    • US06856404B2
    • 2005-02-15
    • US09323034
    • 1999-06-01
    • Kazunori IwamotoNobuyoshi Deguchi
    • Kazunori IwamotoNobuyoshi Deguchi
    • G03F7/20H01L21/027G01B9/02
    • G03F7/70358G03F7/70725G03F7/70775
    • A scan type exposure for transferring a pattern onto a substrate by scan exposure. The apparatus includes a stage for moving the substrate in a Y direction corresponding to a scan direction, and in an X direction intersecting the scan direction, an alignment scope for performing measurement for alignment of the substrate, at a position spaced, in the Y direction, from a position where the exposure of the substrate is to be carried out, an X measuring device for performing yaw measurement of said stage by use of an X reflection surface provided on said stage along the Y direction, a Y measuring device for performing yaw measurement of the stage by use of a Y reflection surface provided on the stage along the X direction, and a controller being operable to select yaw measurement information of the X measuring device for an alignment operation including the alignment measurement using the alignment scope, and being operable to select yaw measurement information of the Y measuring device for the scan exposure.
    • 用于通过扫描曝光将图案转印到基板上的扫描型曝光。 该装置包括:用于在与扫描方向对应的Y方向上移动基板的台,并且在与扫描方向相交的X方向上,用于在Y方向上间隔开的位置处进行用于对准基板的测量的对准范围 从要进行基板的曝光的位置,用于通过使用沿着Y方向设置在所述台上的X反射面来进行所述平台的偏航测量的X测量装置,用于执行偏航的Y测量装置 通过使用沿X方向设置在舞台上的Y反射面来测量舞台,以及控制器,用于选择X测量装置的偏航测量信息,以进行包括使用对准范围的对准测量的对准操作,并且 可操作地选择用于扫描曝光的Y测量装置的偏航测量信息。
    • 5. 发明授权
    • Wafer chuck
    • 晶圆卡盘
    • US4747608A
    • 1988-05-31
    • US792584
    • 1985-10-29
    • Mitsuya SatoNobuyoshi DeguchiShunzo Imai
    • Mitsuya SatoNobuyoshi DeguchiShunzo Imai
    • H01L21/683B23B31/00
    • H01L21/6838Y10T279/11Y10T279/3481
    • A wafer chuck for releasably holding a wafer, includes a base member having an upper surface for carrying and holding thereon the wafer, a lift mechanism operative on the wafer when it rests on the base member to move the wafer relative to the base member in a direction away from the base member, the lift mechanism having an operative member extending substantially in a direction to a radially inward position from a radially outward position of the base member, the operative member having an end portion movable, relative to the base member, between a first position at which it is retracted from the upper surface of the base member and a second position at which it is protrudent from the upper surface of the base member so as to engage with the wafer to move the same relative to the base member, and driving means for moving, relative to the base member, the end portion of the operative member between the first and second positions.
    • 用于可释放地保持晶片的晶片卡盘包括具有用于承载和保持其上的晶片的上表面的基座构件;当晶片搁置在基座构件上时,其在晶片上操作以在晶片上相对于基座构件移动的升降机构 方向远离基座构件,提升机构具有一个可操作构件,其基本上沿着从基座构件的径向向外位置向径向向内位置的方向延伸,该操作构件具有可相对于底座构件在相对于底座构件之间移动的端部 从基部构件的上表面缩回的第一位置和从基部构件的上表面突出的第二位置,以便与晶片接合以使其相对于基座构件移动, 以及驱动装置,用于相对于基座构件在第一和第二位置之间移动操作构件的端部。