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    • 3. 发明授权
    • Method for tuning a deposition rate during an atomic layer deposition process
    • 在原子层沉积过程中调整沉积速率的方法
    • US09418890B2
    • 2016-08-16
    • US14279260
    • 2014-05-15
    • Paul MaJoseph F. AubuchonJiang LuMei Chang
    • Paul MaJoseph F. AubuchonJiang LuMei Chang
    • H01L21/768C23C16/455C23C16/52
    • H01L21/76841C23C16/45534C23C16/52
    • Embodiments of the invention provide methods for depositing a material on a substrate within a processing chamber during a vapor deposition process, such as an atomic layer deposition (ALD) process. In one embodiment, a method is provided which includes sequentially exposing the substrate to a first precursor gas and at least a second precursor gas while depositing a material on the substrate during the ALD process, and continuously or periodically exposing the substrate to a treatment gas prior to and/or during the ALD process. The deposition rate of the material being deposited may be controlled by varying the amount of treatment gas exposed to the substrate. In one example, tantalum nitride is deposited on the substrate and the alkylamino metal precursor gas contains a tantalum precursor, such as pentakis(dimethylamino) tantalum (PDMAT), the second precursor gas contains a nitrogen precursor, such as ammonia, and the treatment gas contains dimethylamine (DMA).
    • 本发明的实施例提供了在诸如原子层沉积(ALD)工艺的气相沉积工艺期间将材料沉积在处理室内的衬底上的方法。 在一个实施例中,提供了一种方法,其包括在ALD工艺期间将衬底沉积到衬底上的同时将衬底依次暴露于第一前体气体和至少第二前体气体,并且连续地或周期地将衬底暴露于处理气体之前 到和/或在ALD过程期间。 可以通过改变暴露于衬底的处理气体的量来控制被沉积的材料的沉积速率。 在一个实例中,氮化钽沉积在衬底上,并且烷基氨基金属前体气体包含钽前体,例如五(二甲基氨基)钽(PDMAT)),第二前体气体含有氮前体如氨,并且处理气体 含有二甲胺(DMA)。
    • 4. 发明申请
    • SHIP STRUCTURE
    • 船舶结构
    • US20160194056A1
    • 2016-07-07
    • US14590162
    • 2015-01-06
    • HSIAO-MEI CHANG
    • HSIAO-MEI CHANG
    • B63B7/06B63H5/07B63H1/14B63B3/04B63B3/12
    • B63B3/04B63B7/08B63B2701/00
    • A ship structure includes a ship hull formed of independently inflatable left and right garboard strakes, left and right side strakes, a floor plate and upper stretcher plates connected between the left and right side strakes, a portable box arranged at the rear side of the ship hull, a drive unit steering control motor mounted at a mount of the portable box, a rotary wheel supported on the mount of the portable box and rotatable by the drive unit steering control motor, a drive unit supported on the rotary wheel, a propeller suspending outside of the ship hull and rotatable by the drive unit to propel the ship hull on water.
    • 船体结构包括由独立充气的左右舷梯板条,左右侧板条,底板和连接在左右侧板之间的上部担架板形成的船体,设在船舶后侧的便携式箱体 船体,安装在便携式箱体的支架上的驱动单元转向控制马达,支撑在便携式箱体的支架上并由驱动单元转向控制马达可旋转的旋转轮,支撑在旋转轮上的驱动单元,螺旋桨悬挂 在船体外部并由驱动单元旋转,以将船体推向水面。
    • 5. 发明授权
    • Contact clean by remote plasma and repair of silicide surface
    • 通过远程等离子体接触清洁并修复硅化物表面
    • US09147578B2
    • 2015-09-29
    • US13004740
    • 2011-01-11
    • Xinliang LuChien-Teh KaoChiukin Steve LaiMei Chang
    • Xinliang LuChien-Teh KaoChiukin Steve LaiMei Chang
    • H01L21/00H01L21/285H01L21/02H01L21/28H01L21/321H01L29/66
    • H01L21/28518H01L21/0206H01L21/02063H01L21/02068H01L21/28061H01L21/321H01L29/665H01L29/6659Y10S438/906
    • Embodiments provide methods for treating a metal silicide contact which includes positioning a substrate having an oxide layer disposed on a metal silicide contact surface within a processing chamber, cleaning the metal silicide contact surface to remove the oxide layer while forming a cleaned silicide contact surface during a cleaning process, and exposing the cleaned silicide contact surface to a silicon-containing compound to form a recovered silicide contact surface during a regeneration process. In some examples, the cleaning of the metal silicide contact surface includes cooling the substrate to an initial temperature of less than 65° C., forming reactive species from a gas mixture of ammonia and nitrogen trifluoride by igniting a plasma, exposing the oxide layer to the reactive species to form a thin film, and heating the substrate to about 100° C. or greater to remove the thin film from the substrate while forming the cleaned silicide contact surface.
    • 实施例提供了处理金属硅化物接触的方法,其包括将具有设置在处理室内的金属硅化物接触表面上的氧化物层的衬底定位,在金属硅化物接触表面中清洁金属硅化物接触表面以除去氧化物层同时形成清洁的硅化物接触表面 清洁工艺,以及将清洁的硅化物接触表面暴露于含硅化合物,以在再生过程中形成回收的硅化物接触表面。 在一些实例中,金属硅化物接触表面的清洁包括将衬底冷却至低于65℃的初始温度,通过点燃等离子体从氨和三氟化氮的气体混合物形成反应物质,将氧化物层暴露于 反应性物质形成薄膜,并将衬底加热至约100℃或更高以在形成清洁的硅化物接触表面的同时从衬底移除薄膜。
    • 6. 发明申请
    • METHOD FOR TUNING A DEPOSITION RATE DURING AN ATOMIC LAYER DEPOSITION PROCESS
    • 在原子层沉积过程中调节沉积速率的方法
    • US20140248772A1
    • 2014-09-04
    • US14279260
    • 2014-05-15
    • Paul MAJoseph F. AUBUCHONJiang LUMei CHANG
    • Paul MAJoseph F. AUBUCHONJiang LUMei CHANG
    • H01L21/768
    • H01L21/76841C23C16/45534C23C16/52
    • Embodiments of the invention provide methods for depositing a material on a substrate within a processing chamber during a vapor deposition process, such as an atomic layer deposition (ALD) process. In one embodiment, a method is provided which includes sequentially exposing the substrate to a first precursor gas and at least a second precursor gas while depositing a material on the substrate during the ALD process, and continuously or periodically exposing the substrate to a treatment gas prior to and/or during the ALD process. The deposition rate of the material being deposited may be controlled by varying the amount of treatment gas exposed to the substrate. In one example, tantalum nitride is deposited on the substrate and the alkylamino metal precursor gas contains a tantalum precursor, such as pentakis(dimethylamino) tantalum (PDMAT), the second precursor gas contains a nitrogen precursor, such as ammonia, and the treatment gas contains dimethylamine (DMA).
    • 本发明的实施例提供了在诸如原子层沉积(ALD)工艺的气相沉积工艺期间将材料沉积在处理室内的衬底上的方法。 在一个实施例中,提供了一种方法,其包括在ALD工艺期间将衬底沉积到衬底上的同时将衬底依次暴露于第一前体气体和至少第二前体气体,并且连续地或周期地将衬底暴露于处理气体之前 到和/或在ALD过程期间。 可以通过改变暴露于衬底的处理气体的量来控制被沉积的材料的沉积速率。 在一个实例中,氮化钽沉积在衬底上,并且烷基氨基金属前体气体包含钽前体,例如五(二甲氨基)钽(PDMAT)),第二前体气体含有氮前体如氨,并且处理气体 含有二甲胺(DMA)。