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    • 7. 发明授权
    • Method for fabrication an open can-type stacked capacitor on local topology
    • 本地拓扑结构的开式罐式叠层电容器的制造方法
    • US06204118B1
    • 2001-03-20
    • US09373214
    • 1999-08-12
    • Yoichi MiyaiMasayuki MoroiKatsushi Boku
    • Yoichi MiyaiMasayuki MoroiKatsushi Boku
    • H01L218242
    • H01L28/92H01L27/10852
    • An open can-type stacked capacitor is fabricated on local topology by forming a conductive layer (30) outwardly of an insulator (14, 86) and an access line (16, 18) extending from the insulator (14, 86). A mask (40) is formed outwardly of the conductive layer (30). A first electrode (50, 80) is formed by removing at least part of the conductive layer (30) exposed by the mask (40). The first electrode (50, 80) includes an annular sidewall (52) having a first segment (54, 82) disposed on the insulator (14, 86) and a second, opposite segment (56) disposed on the access line (16, 18). A dielectric layer (60) is formed outwardly of the first electrode (50, 80). A second electrode (62) is formed outwardly of the dielectric layer (60).
    • 通过在绝缘体(14,86)之外形成导电层(30)和从绝缘体(14,86)延伸的接入线(16,18),在局部拓扑上制造开放式罐式叠层电容器。 在导电层(30)的外侧形成掩模(40)。 通过去除由掩模(40)暴露的导电层(30)的至少一部分来形成第一电极(50,80)。 第一电极(50,80)包括环形侧壁(52),其具有设置在绝缘体(14,86)上的第一段(54,82)和设置在接入线(16)上的第二相对的段(56) 18)。 电介质层(60)形成在第一电极(50,80)的外侧。 第二电极(62)形成在电介质层(60)的外侧。
    • 8. 发明授权
    • DRAM COB bit line and moat arrangement
    • DRAM COB位线和护城河布置
    • US5734184A
    • 1998-03-31
    • US770883
    • 1996-12-20
    • Katsuyoshi AndohYoichi MiyaiMasayuki MoroiKatsushi Boku
    • Katsuyoshi AndohYoichi MiyaiMasayuki MoroiKatsushi Boku
    • H01L21/8242H01L27/108H01L29/76H01L29/94H01L31/119
    • H01L27/10829
    • A DRAM uses arcuate moats 18 and wavy bit lines 28, 30 for the array of memory cells. A bit line contact 20 occurs at the apex of the moat and storage node contacts 22, 24 occur at the ends of legs 40, 42 extending from the apex. The wavy bit lines have alternating crests 32, 36 and troughs 34, 38. The bit lines are arranged over the moats with the troughs of each bit line overlying and contacting the apexes of each moat and the crests avoiding any moat. The crests and troughs of the bit lines are offset from one another. In a half-pitch pattern, the troughs of one bit line lie adjacent to the crests of the next bit line. The moats are concave between the legs and the angle between the legs is between about 140 and 170 degrees. The angle between the crests and troughs of the bit lines is between about 110 and 160 degrees. In one embodiment, the central portion 70 between the areas surrounding the storage node contacts is about 10% wider than the areas surrounding the storage node contacts.
    • DRAM对于存储器单元阵列使用弧形护城河18和波纹位线28,30。 位线接触20发生在护城河的顶点处,并且存储节点接触件22,24发生在从顶点延伸的腿部40,42的端部处。 波纹位线具有交替的峰32,36和槽34,38。位线布置在护城河上,每个位线的槽谷覆盖并接触每个护城河的顶点并且避免任何护城河。 位线的波峰和波谷彼此偏移。 在半间距图案中,一个位线的槽与下一位线的波峰相邻。 护城河两腿之间是凹的,腿之间的角度在大约140和170度之间。 位线的波峰和波谷之间的角度在约110和160度之间。 在一个实施例中,围绕存储节点触点的区域之间的中心部分70比围绕存储节点触点的区域宽约10%。
    • 10. 发明申请
    • FILM DEPOSITION SYSTEM
    • 电影沉积系统
    • US20110226178A1
    • 2011-09-22
    • US13074261
    • 2011-03-29
    • Norihiko TSUJIMasayuki MoroiAtsushi SawachiSasumu Katoh
    • Norihiko TSUJIMasayuki MoroiAtsushi SawachiSasumu Katoh
    • C23C14/00
    • C23C16/45544B29C66/71C23C16/45517C23C16/45527C23C16/45551C23C16/45563H01L21/02164H01L21/02197H01L21/0228H01L21/3141H01L21/31608H01L21/31691
    • A film deposition system which a cycle of alternately supplying a first reactive gas and a second reactive gas and exhausting them is repeated twice or more in a vacuum vessel to cause reaction between the two gases, thereby depositing thin films on substrate surfaces, the film deposition system includes: a plurality of lower members having substrate-placing areas on which substrates will be placed; a plurality of upper members so placed that they face the lower members to form processing spaces together with the substrate-placing areas; a first reactive gas supply unit and a second reactive gas supply unit for supplying a first reactive gas and a second reactive gas, respectively, to the processing spaces; a purge gas supply unit for supplying a purge gas in the period between a first reactive gas supply period and a second reactive gas supply period; exhaust openings, situated along circumferences of the processing spaces, for communicating the inside of the processing spaces with the atmosphere in the vacuum vessel that is outside of the processing spaces; and an evacuating unit for evacuating the processing spaces via the atmosphere in the exhaust openings and the vacuum vessel.
    • 在真空容器中重复两次或更多次交替地供给第一反应气体和第二反应气体并使其排出的循环的膜沉积系统,以在两种气体之间引起反应,从而在基板表面上沉积薄膜,膜沉积 系统包括:具有放置基板的基板放置区域的多个下部构件; 多个上部构件,使得它们面对下部构件以与基底放置区域一起形成处理空间; 第一反应气体供应单元和第二反应气体供应单元,用于将第一反应气体和第二反应气体分别供应到处理空间; 净化气体供给单元,用于在第一反应气体供给期间和第二反应气体供给期间的期间供给净化气体; 位于处理空间周围的排气口,用于将处理空间内部与处理空间外的真空容器内的气氛连通; 以及用于通过排气口和真空容器中的大气抽空处理空间的排气单元。