专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09263312B2 Joining device and joining position adjustment method using joining device 有权
标题翻译：使用接合装置的接合装置和接合位置调整方法
公开(公告)号：US09263312B2
公开(公告)日：2016-02-16
申请号：US14351425
申请日：2012-09-13
申请人： Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
发明人： Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
IPC分类号： B32B41/00 , H01L21/68 , H01L21/67
CPC分类号： H01L21/68 , H01L21/67092 , Y10T156/1744
摘要： A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.
摘要翻译：接合装置包括：第一保持单元，其构造成在其顶表面上加载和保持第一构件; 第二保持单元，其设置在所述第一保持单元的上方，同时面向所述第一保持单元并且构造成保持所述第二构件; 以及位置调整机构，其构造成调整由所述第一保持单元保持的所述第一构件与由所述第二保持单元保持的所述第二构件之间的接合位置。第二保持单元是圆板形状，并且位置调节机构包括沿着第二保持单元的外周表面等间隔设置的四个位置调节凸轮构件，并且使第二保持单元沿水平方向移动。

2. 发明授权

US08749068B2 Mounting method and mounting device 失效
标题翻译：安装方法和安装装置
公开(公告)号：US08749068B2
公开(公告)日：2014-06-10
申请号：US13519243
申请日：2010-12-24
申请人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
发明人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
IPC分类号： H01L23/48
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83002 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
摘要翻译：将元件依次安装在基板上的安装方法包括安装过程，该安装方法将一个元件安装在一个元件的表面的第一接触区域上，该元件由取出部分从容纳元件被容纳的容纳部分中取出，衬底，其中涂布液体。该方法还包括一种涂覆方法，该涂覆方法通过可移动地与取出部分一起设置的涂层部分涂覆在与该第一接触区域不同的第一接触区域的基板的表面的接触区域上，第一区。

3. 发明申请

US20110214809A1 BONDING APPARATUS AND BONDING METHOD 审中-公开
标题翻译：粘接装置和粘接方法
公开(公告)号：US20110214809A1
公开(公告)日：2011-09-08
申请号：US12922288
申请日：2009-09-11
申请人： Masahiko Sugiyama
发明人： Masahiko Sugiyama
IPC分类号： B32B37/10 , B32B37/02 , B32B37/06 , B32B37/14 , B32B37/16
CPC分类号： H01L21/67092 , B32B37/003 , B32B37/10 , B32B2457/00 , Y10T156/17
摘要： A bonding apparatus includes a first holding section which places and holds a first member on an upper surface, and a second holding section which adsorbs and holds a second member on a lower surface. The second holding section is configured such that a center section bends due to a predetermined pressure. The second holding section includes an intake mechanism which sucks atmosphere of a bonding space between the first holding section and the second holding section. A protrusion which protrudes downward along an outer circumferential lower surface of the second holding section is formed on the outer circumferential lower surface. A sealing member which holds an air-tightness of the bonding space and has elasticity is formed in a lower surface of the protrusion. A height adjusting mechanism which abuts on the protrusion and can adjust the vertical distance between the first member and the second member is formed on a side surface of the first holding section.
摘要翻译：接合装置包括：第一保持部，其将第一部件放置在上表面上;第二保持部，其将第二部件吸附并保持在下表面。第二保持部构造成使得中心部由于预定压力而弯曲。第二保持部包括吸入第一保持部和第二保持部之间的结合空间的气氛的吸入机构。在外周下表面上形成有沿着第二保持部的外周下表面向下方突出的突起。在突出部的下表面形成有保持接合空间的气密性且具有弹性的密封构件。在第一保持部的侧面形成有与突起抵接并能够调整第一部件与第二部件的垂直距离的高度调节机构。

4. 发明授权

US07864450B2 Microlens array sheet and method of producing the same 有权
标题翻译：微透镜阵列片及其制造方法
公开(公告)号：US07864450B2
公开(公告)日：2011-01-04
申请号：US12378962
申请日：2009-02-23
申请人： Masaru Segawa , Masahiko Sugiyama , Yoichiro Nakatani
发明人： Masaru Segawa , Masahiko Sugiyama , Yoichiro Nakatani
IPC分类号： G02B9/08
CPC分类号： B29D11/00278 , B29D11/00365 , G02B3/0031 , G02B3/0056
摘要： A microlens array sheet includes a light-shielding base having a first surface and a second surface opposite to the first surface and a microlens array attached to the first surface of the light-shielding base, the array having a plurality of microlens. The light-shielding base has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the first surface side is larger than another size of each aperture on the second surface side. Instead of the light-shielding base, the microlens array sheet may include a transparent base having a first surface and a second surface opposite to the first surface and a light-shielding layer, having a third surface and a fourth surface opposite to the third surface, provided on the second surface of the transparent base. The microlens array is attached to the first surface of the transparent base. The light-shielding layer has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the third surface side is larger than another size of each aperture on the fourth surface side.
摘要翻译：微透镜阵列片包括具有第一表面和与第一表面相对的第二表面的遮光基底和附着到遮光基底的第一表面的微透镜阵列，该阵列具有多个微透镜。遮光底座具有对应于微透镜的多个孔。每个孔具有锥形梯形形状，其中第一表面侧上的每个孔的尺寸大于第二表面侧上的每个孔的另一尺寸。微透镜阵列片代替遮光底座，可以包括具有第一表面和与第一表面相对的第二表面的透明基底和遮光层，其具有与第三表面相对的第三表面和第四表面，设置在透明基底的第二表面上。微透镜阵列附着到透明基底的第一表面。遮光层具有对应于微透镜的多个孔。每个孔具有锥形梯形形状，其中第三表面侧上的每个孔的尺寸大于第四表面侧上的每个孔的另一尺寸。

5. 发明授权

US07101411B2 Apparatus for generating hydrogen gas 失效
公开(公告)号：US07101411B2
公开(公告)日：2006-09-05
申请号：US10082250
申请日：2002-02-26
申请人： Takahiro Hayashi , Mamoru Ishikiriyama , Masahiko Sugiyama , Yasukazu Saito
发明人： Takahiro Hayashi , Mamoru Ishikiriyama , Masahiko Sugiyama , Yasukazu Saito
IPC分类号： B01J7/00
CPC分类号： C10G2/32 , B01J7/02 , B01J16/005 , B01J19/247 , B01J19/249 , B01J19/26 , B01J19/285 , B01J2219/00083 , B01J2219/00135 , B01J2219/00162 , B01J2219/1941 , B01J2219/2453 , B01J2219/2458 , B01J2219/2479 , C01B3/26 , C01B2203/0277 , C01B2203/04 , C01B2203/0405 , C01B2203/0415 , C01B2203/048 , C01B2203/065 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/0827 , C01B2203/085 , C01B2203/0866 , C01B2203/0883 , C01B2203/1041 , C01B2203/1052 , C01B2203/1064 , C01B2203/107 , C01B2203/1082 , C01B2203/1247 , C01B2203/148 , C01B2203/1609 , C01B2203/1619 , C01B2203/1633 , C01B2203/1647 , C01B2203/1657 , C01B2203/1685 , C01B2203/169 , C01B2203/1695 , H01M8/0606 , Y02P20/128
摘要： An apparatus for generating hydrogen gas in which hydrogen gas of a high purity is supplied to a hydrogen-utilizing device by using a decahydronaphthalene/naphthalene reaction. The apparatus includes a storage tank in which decahydronaphthalene is stored as a crude fuel, a reaction tank which has a catalyst and a heater for heating the catalyst and which causes dehydrogenation of decahydronaphthalene supplied from the storage tank to the heated catalyst, and a separation tank in which hydrogen-rich gas is separated out from naphthalene and hydrogen gas supplied from the reaction tank by using a hydrogen separation film and from which the separated hydrogen gas is discharged.

6. 发明申请

US20060033519A1 Prober and probe testing method for temperature-controlling object to be tested 有权
公开(公告)号：US20060033519A1
公开(公告)日：2006-02-16
申请号：US11206003
申请日：2005-08-18
申请人： Masahiko Sugiyama , Yoshinori Inoue
发明人： Masahiko Sugiyama , Yoshinori Inoue
IPC分类号： G01R31/02
CPC分类号： G01R31/2874 , G01R1/06705 , G01R31/2865 , G01R31/2891
摘要： A prober which tests an object to be tested under temperature control is provided. This prober includes a stage base, Z stage, X-Y stage having a frame structure, substrate fixing mechanism arranged on the X-Y stage, a probe card arranged to oppose the substrate fixing mechanism, and a probing stage fixed on the Z stage and arranged in the frame structure of the X-Y stage such that its axis coincides with an extension line vertically extending from the probe center of the probe card. The probing stage includes a probing elevating mechanism, and a temperature controller to heat and cool the object to be tested. The probing stage supports the substrate of the object to be tested from the bottom surface, and controls the temperature of the object to be tested.

7. 发明授权

US06992500B2 Prober and probe testing method for temperature-controlling object to be tested 有权
标题翻译：用于温度控制对象的探测和探测测试方法
公开(公告)号：US06992500B2
公开(公告)日：2006-01-31
申请号：US10869932
申请日：2004-06-18
申请人： Masahiko Sugiyama , Yoshinori Inoue
发明人： Masahiko Sugiyama , Yoshinori Inoue
IPC分类号： G01R31/26
CPC分类号： G01R31/2874 , G01R1/06705 , G01R31/2865 , G01R31/2891
摘要： A prober which tests an object to be tested under temperature control is provided. This prober includes a stage base, Z stage, X-Y stage having a frame structure, substrate fixing mechanism arranged on the X-Y stage, a probe card arranged to oppose the substrate fixing mechanism, and a probing stage fixed on the Z stage and arranged in the frame structure of the X-Y stage such that its axis coincides with an extension line vertically extending from the probe center of the probe card. The probing stage includes a probing elevating mechanism, and a temperature controller to heat and cool the object to be tested. The probing stage supports the substrate of the object to be tested from the bottom surface, and controls the temperature of the object to be tested.
摘要翻译：提供了一个在温度控制下测试待测物体的探测器。该探测器包括台架基座，Z台架，具有框架结构的XY平台，布置在XY平台上的基板固定机构，布置成与基板固定机构相对的探针卡，以及固定在Z台上的探测台，并布置在 XY台的框架结构，使得其轴线与从探针卡的探针中心垂直延伸的延伸线重合。探测阶段包括探测升降机构和温度控制器，以加热和冷却待测物体。探测阶段从底面支撑被测物体的基底，并控制待测物体的温度。

8. 发明授权

US5906959A Catalyst for purifying exhaust gas 失效
标题翻译：废气净化催化剂
公开(公告)号：US5906959A
公开(公告)日：1999-05-25
申请号：US684482
申请日：1996-07-19
申请人： Koiti Yamasita , Mikio Murachi , Masahiko Sugiyama
发明人： Koiti Yamasita , Mikio Murachi , Masahiko Sugiyama
IPC分类号： B01D53/86 , B01D53/94 , B01J23/56 , B01J23/58 , B01J23/63 , B01J23/89
CPC分类号： B01D53/945 , B01J23/58 , B01J23/63 , B01J23/894 , B01D2255/102 , B01D2255/40 , Y02T10/22
摘要： This invention relates to a catalyst for purifying an exhaust gas using a complex oxide having good heat-resistant and a purification performance which does not undergo degradation, particularly in a lean atmosphere at a high temperature of about 1,000.degree. C., by using the complex oxide containing platinum and at least one member of element selected from the group from an alkaline earth metal element and the Group IIIA element and, furthermore, by using at least one member of platinum complex oxides selected from the group of those Pt complex oxides expressed by the chemical structural formulas X.sub.4 PtO.sub.6 (X=Ca, Sr, Ba, Mg), X'.sub.2 Pt.sub.2 O.sub.7 (X'=Sc, La, Pr), SrX"PtO.sub.6 (X"=Co, Ni, Cu), Ba.sub.2 ZPtO.sub.6 (Z=Pr, Ce) and Ba.sub.8 Y.sub.3 Pt.sub.4 O.sub.17.5.
摘要翻译：本发明涉及一种使用复合氧化物净化废气的催化剂，该催化剂具有良好的耐热性和不经历劣化的净化性能，特别是在高温约1000℃的贫气氛中，通过使用该络合物含有铂的氧化物和选自碱土金属元素和IIIA族元素的元素中的至少一种元素，此外，通过使用选自Pt络合物氧化物中的至少一种铂络合物氧化物，由Pt复合氧化物化学结构式X4PtO6（X = Ca，Sr，Ba，Mg），X'2Pt2O7（X'= Sc，La，Pr），SrX''PtO6（X“= Co，Ni，Cu），Ba2ZPtO6 = Pr，Ce）和Ba8Y3Pt4O17.5。

9. 发明授权

US5710529A Surface acoustic wave filer device having a cascade filter structure and a piezoelectric substrate having mirror-polished surfaces 失效
标题翻译：具有级联滤波器结构的表面声波滤波器装置和具有镜面抛光表面的压电基片
公开(公告)号：US5710529A
公开(公告)日：1998-01-20
申请号：US539254
申请日：1995-10-05
申请人： Masahiko Sugiyama , Yasufumi Horio , Masatsugu Oshima , Kenji Suzuki
发明人： Masahiko Sugiyama , Yasufumi Horio , Masatsugu Oshima , Kenji Suzuki
IPC分类号： H03H9/145 , H03H9/64 , H03H9/25
CPC分类号： H03H9/14505 , H03H9/6426 , H03H9/6489
摘要： A surface acoustic wave filter device includes a piezoelectric substrate having mirror-polished surfaces on both sides, so that it is essentially free from warping. One surface of the substrate is provided with two filter stages which are cascade connected with each other thereby to sufficiently attenuate bulk wave spurious noise below a practically negligible extent. The filter device can be manufactured with an improved yield.
摘要翻译：表面声波滤波器装置包括在两侧具有镜面抛光表面的压电基片，使得其基本上没有翘曲。衬底的一个表面设置有彼此级联的两个滤波器级，从而充分地衰减低于实际上可忽略的程度的体波杂散噪声。过滤装置可以以提高的产量制造。

10. 发明授权

US5198752A Electric probing-test machine having a cooling system 失效
标题翻译：具有冷却系统的电探测试机
公开(公告)号：US5198752A
公开(公告)日：1993-03-30
申请号：US738304
申请日：1991-07-31
申请人： Eiji Miyata , Masahiko Sugiyama , Masahiko Kohno , Masataka Hatta
发明人： Eiji Miyata , Masahiko Sugiyama , Masahiko Kohno , Masataka Hatta
IPC分类号： F25B21/04 , G01R1/073 , G01R31/28
CPC分类号： G01R31/2875 , G01R1/07314 , G01R31/2865 , F25B21/04 , G01R31/2806
摘要： An electric probing-test machine comprises a probe card having a plurality of probes contacted with chips of a semiconductor wafer and serving to apply test signal to a tester which judges whether circuits on the chips of the wafer are correct or deficient, a main chuck for holding the wafer at a test temperature, a system for cooling the main chuck, and a controller for controlling the cooling system. The main chuck includes a chuck top contacted directly with the wafer, a jacket arranged to conduct heat exchange relative to the chuck top, and a temperature sensor for detecting the temperature of the chuck top. The cooling system has a pump for supplying a coolant from a reservoir to the jacket. Responsive to temperature information detected by the temperature sensor, the amount of the coolant supplied from the reservoir to the jacket is controlled by the controller to thereby control the temperature of the chuck top.
摘要翻译：电探测机包括探针卡，其具有与半导体晶片的芯片接触的多个探头，用于向测试器施加测试信号，该测试器判断晶片的芯片上的电路是否正确或不足，主夹头将晶片保持在测试温度，用于冷却主卡盘的系统以及用于控制冷却系统的控制器。主夹具包括与晶片直接接触的卡盘顶板，布置成相对于卡盘顶部进行热交换的夹套和用于检测卡盘顶部的温度的温度传感器。冷却系统具有用于将冷却剂从储存器供给到外壳的泵。响应于由温度传感器检测到的温度信息，通过控制器控制从贮存器供给到护套的冷却剂的量，从而控制卡盘顶部的温度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式