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1. 发明授权

US5874581A 2-silyloxy-tetrahydrothienopyridine, salt thereof and process for preparing the same 失效
标题翻译： 2-甲基氧基 - 四氢噻吩并吡啶及其盐及其制备方法
公开(公告)号：US5874581A
公开(公告)日：1999-02-23
申请号：US817001
申请日：1997-03-31
申请人： Kikuo Ataka , Hiroyuki Miyata , Masahiko Kohno , Naoyuki Yokota , Yasuhito Yamamoto
发明人： Kikuo Ataka , Hiroyuki Miyata , Masahiko Kohno , Naoyuki Yokota , Yasuhito Yamamoto
IPC分类号： C07F7/18 , C07D471/04
CPC分类号： C07F7/1856
摘要： A 2-silyloxy-4,5,6,7-tetrahydrothieno�3,2-c!pyridine represented by the formula (I): ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 each independently represent an alkyl group having 1 to 10 carbon atoms or an aryl group,and a salt thereof and a process for preparing the same, and a 5-alkyl-2-silyloxy-4,5,6,7-tetrahydrothieno�3,2-c!-pyridine represented by the formula (IV): ##STR2## wherein R.sup.1, R.sup.2 and R.sup.3 represent the same meanings as described above; R.sup.4 represents a hydrogen atom, an alkoxycarbonyl group having 2 to 10 carbon atoms, an acyl group having 2 to 10 carbon atoms or a cyclo-alkylcarbonyl group having 4 to 10 carbon atoms; andR.sup.5 represents a halogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms,which is useful as a synthetic intermediate of an antiplatelet medicine and an elastase inhibitor, etc., and a process for preparing the same.
摘要翻译： PCT No.PCT / JP95 / 02023 Sec。 371日期1997年3月31日 102（e）1997年3月31日PCT PCT 1995年10月4日PCT公布。公开号WO96 / 11203 日期：1996年4月18日由式（I）表示的2-甲硅烷氧基-4,5,6,7-四氢噻吩并[3,2-c]吡啶：其中R 1，R 2和R 3各自独立地表示具有1-10个碳原子的烷基或芳基，及其盐及其制备方法，和5-烷基-2-甲硅烷氧基-4,5,6,7-四氢噻吩并[3,2- （IV）表示的c]吡啶：其中R 1，R 2和R 3表示与上述相同的含义; R 4表示氢原子，碳原子数2〜10的烷氧基羰基，碳原子数2〜10的酰基或碳原子数4〜10的环烷基羰基。 R5表示卤素原子，碳原子数1〜4的烷基或碳原子数1〜4的烷氧基，可用作抗血小板药和弹性蛋白酶抑制剂的合成中间体等，准备一样

2. 发明授权

US5405931A Epoxy resin compositions for use in electrical laminates 失效
标题翻译：用于电气层压板的环氧树脂组合物
公开(公告)号：US5405931A
公开(公告)日：1995-04-11
申请号：US106168
申请日：1993-08-13
申请人： Masahiko Kohno , Takahiko Ohmura , Masanori Noba
发明人： Masahiko Kohno , Takahiko Ohmura , Masanori Noba
IPC分类号： C08G59/18 , C08G59/24 , C08G59/32 , C08G59/38 , H01B3/40 , H05K1/03 , C08G59/00
CPC分类号： H01B3/40 , C08G59/182 , C08G59/245 , C08G59/3218 , C08G59/3227 , C08G59/38 , H05K1/0326
摘要： Electrical laminates can be prepared from an epoxy resin composition which comprises:(A) at least one epoxy resin having an average of more than one epoxy group per molecule;(B) an oligomer having a terminal phenolic hydroxyl group, which oligomer results from the reaction of a glycidyl ether of a halogenated phenolic compound and a halogenated phenolic compound; and(C) at least one catalyst for catalyzing a reaction between Component (A) and Component (B).
摘要翻译：电气层压板可以由环氧树脂组合物制备，所述组合物包含：（A）每分子平均具有多于一个环氧基团的至少一种环氧树脂; （B）具有末端酚羟基的低聚物，该低聚物是由卤化酚类化合物的缩水甘油醚与卤代酚类化合物的反应产生的; 和（C）至少一种用于催化组分（A）和组分（B）之间的反应的催化剂。

3. 发明授权

US5198752A Electric probing-test machine having a cooling system 失效
标题翻译：具有冷却系统的电探测试机
公开(公告)号：US5198752A
公开(公告)日：1993-03-30
申请号：US738304
申请日：1991-07-31
申请人： Eiji Miyata , Masahiko Sugiyama , Masahiko Kohno , Masataka Hatta
发明人： Eiji Miyata , Masahiko Sugiyama , Masahiko Kohno , Masataka Hatta
IPC分类号： F25B21/04 , G01R1/073 , G01R31/28
CPC分类号： G01R31/2875 , G01R1/07314 , G01R31/2865 , F25B21/04 , G01R31/2806
摘要： An electric probing-test machine comprises a probe card having a plurality of probes contacted with chips of a semiconductor wafer and serving to apply test signal to a tester which judges whether circuits on the chips of the wafer are correct or deficient, a main chuck for holding the wafer at a test temperature, a system for cooling the main chuck, and a controller for controlling the cooling system. The main chuck includes a chuck top contacted directly with the wafer, a jacket arranged to conduct heat exchange relative to the chuck top, and a temperature sensor for detecting the temperature of the chuck top. The cooling system has a pump for supplying a coolant from a reservoir to the jacket. Responsive to temperature information detected by the temperature sensor, the amount of the coolant supplied from the reservoir to the jacket is controlled by the controller to thereby control the temperature of the chuck top.
摘要翻译：电探测机包括探针卡，其具有与半导体晶片的芯片接触的多个探头，用于向测试器施加测试信号，该测试器判断晶片的芯片上的电路是否正确或不足，主夹头将晶片保持在测试温度，用于冷却主卡盘的系统以及用于控制冷却系统的控制器。主夹具包括与晶片直接接触的卡盘顶板，布置成相对于卡盘顶部进行热交换的夹套和用于检测卡盘顶部的温度的温度传感器。冷却系统具有用于将冷却剂从储存器供给到外壳的泵。响应于由温度传感器检测到的温度信息，通过控制器控制从贮存器供给到护套的冷却剂的量，从而控制卡盘顶部的温度。

4. 发明授权

US4982008A Process for preparing p-bromophenoxyacetaldehyde dialkylacetal compounds 失效
标题翻译：制备对溴苯氧乙醛二烷基缩醛化合物的方法
公开(公告)号：US4982008A
公开(公告)日：1991-01-01
申请号：US397995
申请日：1989-08-23
申请人： Kikuo Ataka , Masahiko Kohno
发明人： Kikuo Ataka , Masahiko Kohno
IPC分类号： C07C41/48 , C07C43/315 , C07C67/00
CPC分类号： C07C41/48
摘要： There is disclosed a process for preparing a p-bromophenoxyacetaldehyde dialkylacetal derivative represented by the formula: ##STR1## wherein R.sup.1 and R.sup.2 each represent a hydrogen atom or a lower alkyl group and R.sup.3 represents an alkyl group having 1 to 6 carbon atoms,which comprises reacting a bromine to a phenoxyacetaldehyde dialkylacetal represented by the formula: ##STR2## wherein R.sup.1, R.sup.2 and R.sup.3 have the same meanings as defined above,and then the reaction mixture is treated with an alkali metal hydroxide or alcoholate dissolved in an alcohol represented by the formula:R.sup.3 OHwherein R.sup.3 has the same meaning as defined above.

5. 发明授权

US5364925A Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates 失效
标题翻译：环氧树脂用二元酚进一步推进，另外用另外的二元酚延伸链，用于电气层压材料
公开(公告)号：US5364925A
公开(公告)日：1994-11-15
申请号：US106190
申请日：1993-08-13
申请人： Masahiko Kohno , Takahiko Ohmura
发明人： Masahiko Kohno , Takahiko Ohmura
IPC分类号： C08G59/06 , C08G59/00
CPC分类号： C08G59/066
摘要： An epoxy resin composition useful in an electrical laminate, which composition comprises:(A) an epoxy resin prepared by reacting (A-1) an epoxy resin having an average of more than one, but less than three epoxy groups per molecule and (A-2) a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule at a ratio to provide an epoxy to phenolic equivalent ratio of 1:x;(B) y equivalent of a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule; and(C) at least one catalyst for catalyzing a reaction of Component (A) and Component (B);wherein x and y satisfy the following equations:x.gtoreq.0.01y.gtoreq.0.010.02.ltoreq.x+y
摘要翻译：一种用于电气层压板的环氧树脂组合物，该组合物包括：（A）通过（A-1）每分子平均具有多于一个但小于三个环氧基的环氧树脂（A-1）制备的环氧树脂和 -2）一种酚类化合物，其平均每分子具有一个以上但不到三个羟基，以提供环氧树脂与酚当量比为1：x的比例; （B）y当量，每分子平均具有多于一个但少于三个羟基的酚类化合物; 和（C）至少一种用于催化组分（A）和组分（B）的反应的催化剂; 其中x和y满足以下等式：x> / = 0.01y> / = 0.01 0.02

6. 发明授权

US5084671A Electric probing-test machine having a cooling system 失效
标题翻译：具有冷却系统的电探测试机
公开(公告)号：US5084671A
公开(公告)日：1992-01-28
申请号：US512105
申请日：1990-04-20
申请人： Eiji Miyata , Masahiko Sugiyama , Masahiko Kohno , Masataka Hatta
发明人： Eiji Miyata , Masahiko Sugiyama , Masahiko Kohno , Masataka Hatta
IPC分类号： F25B21/04 , G01R1/073 , G01R31/28
CPC分类号： G01R31/2868 , G01R1/07314 , G01R31/2875 , F25B21/04
摘要： An electric probing-test machine comprises a probe card having a plurality of probes contacted with chips of a semiconductor wafer and serving to apply test signal to a tester which judges whether circuits on the chips of the wafer are correct or deficient, a main chuck for holding the wafer at a test temperature, a system for cooling the main chuck, and a controller for controlling the cooling system. The main chuck includes a chuck top contacted directly with the wafer, a jacket arranged to conduct heat exchange relative to the chuck top, and a temperature sensor for detecting the temperature of the chuck top. The cooling system has a pump for supplying a coolant from a reservoir to the jacket. Responsive to temperature information detected by the temperature sensor, the amount of the coolant supplied from the reservoir to the jacket is controlled by the controller to thereby control the temperature of the chuck top.
摘要翻译：电探测机包括探针卡，其具有与半导体晶片的芯片接触的多个探头，用于向测试器施加测试信号，该测试器判断晶片的芯片上的电路是否正确或不足，主夹头将晶片保持在测试温度，用于冷却主卡盘的系统以及用于控制冷却系统的控制器。主夹具包括与晶片直接接触的卡盘顶板，布置成相对于卡盘顶部进行热交换的夹套和用于检测卡盘顶部的温度的温度传感器。冷却系统具有用于将冷却剂从储存器供给到外壳的泵。响应于由温度传感器检测到的温度信息，通过控制器控制从贮存器供给到护套的冷却剂的量，从而控制卡盘顶部的温度。

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