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    • 4. 发明授权
    • Real time analytical monitor for soft defects on reticle during reticle inspection
    • 光罩检测时光罩上的软缺陷的实时分析监视器
    • US07069155B1
    • 2006-06-27
    • US10676455
    • 2003-10-01
    • Khoi PhanBhanwar SinghBharath Rangarajan
    • Khoi PhanBhanwar SinghBharath Rangarajan
    • G01B5/28G06K9/00H01L26/00
    • G06T7/0004G01N21/3563G01N21/95692G01N2021/3595G01N2021/95676G03F1/62G03F1/82G03F1/84G06T2207/30148H01J2237/304H01J2237/31744
    • The present invention generally relates to semiconductor processing, and in particular to methods and systems for analyzing photolithographic reticle defects that include detecting soft defects on a reticle and analyzing the material composition of the defects for a particular chemical signature. Specifically, the present invention scans and images a soft defect via an optical inspection scan of a reticle, mills the defect using a Focused Ion Beam, and analyzes the defect for signatures using Electron Spectroscopy for Chemical Analysis and/or Fourier Transform Infrared Spectroscopy. The present invention thus provides for real-time analysis of the chemical composition of a soft defect on a reticle without the need for a defect identification navigation system. According to an aspect of the present invention, reticle defects can be monitored without removal of a pellicle, thus facilitating increased throughput and decreased cost in reticle repair and/or cleaning. According to another aspect of the invention, signatures occurring in trace amounts can be removed via employing a Focused Ion Beam in a non-reactive gas environment.
    • 本发明一般涉及半导体处理,特别涉及用于分析光刻掩模版缺陷的方法和系统,包括检测掩模版上的软缺陷并分析特定化学特征的缺陷的材料成分。 具体地说,本发明通过光掩膜的光学检查扫描来扫描和成像软缺陷,使用聚焦离子束研磨缺陷,并使用化学分析和/或傅立叶变换红外光谱法的电子光谱分析签名缺陷。 因此,本发明提供了对掩模版上的软缺陷的化学成分的实时分析,而不需要缺陷识别导航系统。 根据本发明的一个方面,可以在不去除防护薄膜的情况下监视掩模版缺陷,从而有助于增加掩模版修复和/或清洁中的生产量和降低成本。 根据本发明的另一方面,可以通过在非反应性气体环境中使用聚焦离子束来移除痕量发生的痕迹。
    • 8. 发明授权
    • Full flow focus exposure matrix analysis and electrical testing for new product mask evaluation
    • 全流量聚焦曝光矩阵分析和电气测试新产品面膜评估
    • US06513151B1
    • 2003-01-28
    • US09794503
    • 2001-02-26
    • Jeff ErhardtKhoi Phan
    • Jeff ErhardtKhoi Phan
    • G06F1750
    • G03F7/70558G03F7/70625G03F7/70641G03F7/7065G03F7/70658
    • A method for new product mask evaluation is provided. Focus exposure matrices are printed at one or more layers (e.g., active gate) on full flow production wafers. The focus exposure matrices are then analyzed to produce data that facilitates detecting printed defects. The full flow production wafers are also subjected to end of line electrical testing to determine bit level errors. Print defects can be correlated with bit level errors to increase confidence in detected defects. The method includes a hierarchy of testing layers, each of which produce data that can be employed in detecting defects in a reticle and/or producing a yield analysis. The method involves scanning a reticle upon which the new product mask is etched and performing a printability simulation to determine what affect, if any, detected reticle defects will have on printing defects on a wafer. After the reticle is scanned, full flow production wafers printed from the pattern on the reticle can be scanned for defects, as can resist-on-silicon flat test wafers, where a higher signal to noise ratio facilitates detecting defects that may otherwise not be detected. The reticle scanning can include critical dimension measuring by scanning electron microscopy means and/or scatterometry means.
    • 提供了一种新产品面膜评估方法。 在全流动生产晶片上的一个或多个层(例如,有源栅极)上印刷聚焦曝光矩阵。 然后分析焦点曝光矩阵以产生便于检测印刷缺陷的数据。 全流程生产晶片也经受终端电测试以确定位电平误差。 打印缺陷可以与位级错误相关联,以增加对检测到的缺陷的置信度。 该方法包括测试层的层级,每层测试层产生可用于检测掩模版中的缺陷和/或产生产量分析的数据。 该方法涉及扫描其上蚀刻了新产品掩模的掩模版并执行可印刷性模拟以确定检测到的掩模版缺陷对于在晶片上的印刷缺陷将产生什么影响(如果有的话)。 在掩模版被扫描之后,从掩模版上的图案印刷的全流动生产晶片可以被扫描以获得缺陷,如在硅平坦测试晶片上,其中更高的信噪比便于检测否则不能检测到的缺陷 。 掩模版扫描可以包括通过扫描电子显微镜装置和/或散射测量装置的临界尺寸测量。
    • 9. 发明授权
    • Low angle solvent dispense nozzle design for front-side edge bead removal in photolithography resist process
    • 低角度溶剂分配喷嘴设计用于光刻抗蚀剂工艺中的前侧边缘珠粒去除
    • US06453916B1
    • 2002-09-24
    • US09602443
    • 2000-06-23
    • Quang TranKhoi Phan
    • Quang TranKhoi Phan
    • B08B302
    • H01L21/6708G03F7/162Y10S134/902
    • An edge bead removal system and method is provided that employs a nozzle for applying edge bead removal solvent to an edge bead of a photoresist material layer disposed on a wafer. The nozzle eliminates solvent splash by lowering the angle of dispense to less than 20° as well as providing more degrees of freedom to the nozzle arm adjustments. Adjustment screws and a built-in protractor provide precision in setting the application angle. The nozzle includes a clamp design having a nozzle body clamp which holds the nozzle and a main shaft with a protractor assembly for up and down angle adjustments. A support bracket is coupled to the protractor assembly and allows for pivoting and side to side movement of the protractor assembly and the support bracket with respect to one another. A clamp connects a main arm structure that moves the entire edge bead removal nozzle assembly over the wafer.
    • 提供了一种边缘珠去除系统和方法,其采用用于将边缘珠去除溶剂施加到设置在晶片上的光致抗蚀剂材料层的边缘珠的喷嘴。 喷嘴通过将分配角度降低到20°以上以及为喷嘴臂调节提供更多的自由度来消除溶剂飞溅。 调节螺丝和内置量角器提供了设置应用角度的精度。 喷嘴包括具有保持喷嘴的喷嘴主体夹具和具有用于上下角度调节的量角器组件的主轴的夹具设计。 支撑支架联接到量角器组件并且允许量角器组件和支撑支架相对于彼此的枢转和侧向和侧向运动。 夹具连接主臂结构,其将整个边缘珠移除喷嘴组件移动到晶片上。
    • 10. 发明授权
    • Electric measurement of reference sample in a CD-SEM and method for calibration
    • CD-SEM中参考样品的电测量和校准方法
    • US06573498B1
    • 2003-06-03
    • US09608096
    • 2000-06-30
    • Bharath RangarajanBhanwar SinghKhoi PhanMichael K. Templeton
    • Bharath RangarajanBhanwar SinghKhoi PhanMichael K. Templeton
    • G01N2300
    • G01N23/225H01J2237/2826
    • The present invention relates to a system and method for calibrating a scanning electron microscope (SEM). The method comprises measuring an electrical characteristic of a calibration standard reference sample feature and correlating the electrical measurement with an SEM measurement thereof. The correlation of the electrical and SEM measurements provides a critical dimension (CD) for the reference sample feature which can then be used to correlate SEM measurements of workpiece features. The system provides a reference sample having a measurable feature electrically connected to a probe. The probe provides an electrical measurement of the reference sample feature. The system further comprises a scanning electron microscope (SEM) adapted to provide an optical measurement of the reference sample feature. A processor is provided to correlate the optical and electrical measurements of the reference sample feature, whereby a reference feature CD is obtained. The system may further correlate workpiece feature measurements with the reference feature CD in order to determine or obtain a workpiece feature CD.
    • 本发明涉及一种用于校准扫描电子显微镜(SEM)的系统和方法。 该方法包括测量校准标准参考样本特征的电特性并将电测量与其SEM测量相关联。 电和SEM测量的相关性为参考样品特征提供了临界尺寸(CD),然后可以将其用于关联工件特征的SEM测量。 该系统提供具有电连接到探针的可测量特征的参考样本。 探头提供参考样品特征的电气测量。 该系统还包括适于提供参考样品特征的光学测量的扫描电子显微镜(SEM)。 提供处理器以使参考样本特征的光学和电学测量相关,由此获得参考特征CD。 该系统可以进一步将工件特征测量与参考特征CD相关联,以便确定或获得工件特征CD。