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    • 1. 发明授权
    • Circuit connecting method
    • 电路连接方式
    • US08132319B2
    • 2012-03-13
    • US12740801
    • 2008-02-06
    • Motohiro ArifukuKazuyoshi KojimaKouji Kobayashi
    • Motohiro ArifukuKazuyoshi KojimaKouji Kobayashi
    • H05K3/30
    • H05K3/361H05K3/28H05K3/323H05K2201/0191H05K2203/0594Y10T29/49126Y10T29/4913Y10T29/49144
    • The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.
    • 本发明提供一种电路连接方法,其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤,制备柔性布线基板14的步骤,该柔性布线基板14具有形成在基座14a上的电路电极14b,并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分,以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤,使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。
    • 5. 发明申请
    • CIRCUIT CONNECTING METHOD
    • 电路连接方法
    • US20100263208A1
    • 2010-10-21
    • US12740801
    • 2008-02-06
    • Motohiro ArifukuKazuyoshi KojimaKouji Kobayashi
    • Motohiro ArifukuKazuyoshi KojimaKouji Kobayashi
    • H05K3/36
    • H05K3/361H05K3/28H05K3/323H05K2201/0191H05K2203/0594Y10T29/49126Y10T29/4913Y10T29/49144
    • The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.
    • 本发明提供一种电路连接方法,其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤,制备柔性布线基板14的步骤,该柔性布线基板14具有形成在基座14a上的电路电极14b,并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分,以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤,使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。