专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5578151A Manufacture of a multi-layer interconnect structure 失效
标题翻译：制造多层互连结构
公开(公告)号：US5578151A
公开(公告)日：1996-11-26
申请号：US397018
申请日：1995-03-01
申请人： Gerald S. Andris , John P. Gauci
发明人： Gerald S. Andris , John P. Gauci
IPC分类号： B41F15/08 , B05C5/02 , B41F15/40 , H01L21/48 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/40 , H05K3/46 , B32B31/00
CPC分类号： B05C5/0295 , H01L21/4867 , H01L23/5383 , H05K3/1233 , H01L2924/0002 , H05K1/0306 , H05K1/092 , H05K2203/0126 , H05K2203/0139 , H05K2203/163 , H05K3/4053
摘要： In the manufacture of multi-layer ceramic interconnect structures, a greensheet is perforated with small holes and positioned on the support fixture of a screening machine. Then a planar surface of a screening mask is positioned in relation to the greensheet for producing the circuit pattern. Then the discharge end of a paste nozzle is positioned in relation to the opposite planer surface of the mask for injecting pressurized conductive paste through the nozzle into the mask. A normal force is applied to the nozzle toward the mask to maintain the discharge end of the nozzle with a clearance of 1 to 2 mils from the mask as the nozzle traverses the mask, injecting the conductive paste to extrude the circuit pattern on the greensheet and fill the perforations to produce vias to provide electrical connections between the layers produced. The force is adjusted dependent upon the pressure of the paste being injected into the mask to maintain the 1 to 2 mil clearance. Multiple layers of patterned greensheets are stacked and sintered under pressure and high temperature to produce the multi-layer ceramic interconnect structure.
摘要翻译：在多层陶瓷互连结构的制造中，毛坯穿孔具有小孔并且位于筛选机的支撑夹具上。然后，屏蔽掩模的平坦表面相对于毛坯定位以产生电路图案。然后，糊状喷嘴的排出端相对于掩模的相对的平面定位，用于将加压的导电浆通过喷嘴注入到掩模中。向喷嘴朝向掩模施加法向力，以在喷嘴穿过掩模时使喷嘴的距离与掩模保持1至2密耳的间隙，注入导电膏以将电路图案挤出在毛坯上，填充穿孔以产生通孔以在所生产的层之间提供电连接。力被调整取决于浆料被注入到面罩中的压力以保持1至2密耳的间隙。在压力和高温下堆叠并烧结多层图案化的纸屑以产生多层陶瓷互连结构。

2. 发明授权

US07278459B2 Common carrier 有权
标题翻译：共同承运人
公开(公告)号：US07278459B2
公开(公告)日：2007-10-09
申请号：US10875699
申请日：2004-06-24
申请人： Robert L. Baan , Harry D. Cox , John P. Gauci , John R. Lankard, Jr. , David C. Long , Thong N. Nguyen
发明人： Robert L. Baan , Harry D. Cox , John P. Gauci , John R. Lankard, Jr. , David C. Long , Thong N. Nguyen
IPC分类号： B32B37/00
CPC分类号： B41F15/36 , H05K1/0306 , H05K3/1225 , H05K2203/0169 , H05K2203/0278 , Y10T29/41
摘要： A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.
摘要翻译：用于将用于制造用于屏蔽电子设备的掩模的膜安装到公共载体框架的方法。公共载架框架具有沿着外周的外边缘和在框架的中心部分中的开口。该方法包括对框架外边缘施加外部压力以将框架向内压缩并减小开口，将薄膜固定在框架上，将薄膜覆盖框架开口，并释放框架上的压力以使开口膨胀并放置薄膜在紧张。

3. 发明授权

US07879171B2 Common carrier 有权
公开(公告)号：US07879171B2
公开(公告)日：2011-02-01
申请号：US11755201
申请日：2007-05-30
申请人： Robert L Baan , Harry D Cox , John P Gauci , John R Lankard, Jr. , David C Long , Thong N Nguyen
发明人： Robert L Baan , Harry D Cox , John P Gauci , John R Lankard, Jr. , David C Long , Thong N Nguyen
IPC分类号： B32B37/00
CPC分类号： B41F15/36 , H05K1/0306 , H05K3/1225 , H05K2203/0169 , H05K2203/0278 , Y10T29/41
摘要： A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.

4. 发明授权

US08020599B2 Common carrier 有权
标题翻译：共同承运人
公开(公告)号：US08020599B2
公开(公告)日：2011-09-20
申请号：US11753874
申请日：2007-05-25
申请人： Robert L Baan , Harry D Cox , John P Gauci , John R Lankard, Jr. , David C Long , Thong N Nguyen
发明人： Robert L Baan , Harry D Cox , John P Gauci , John R Lankard, Jr. , David C Long , Thong N Nguyen
IPC分类号： B32B37/00
CPC分类号： B41F15/36 , H05K1/0306 , H05K3/1225 , H05K2203/0169 , H05K2203/0278 , Y10T29/41
摘要： A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.
摘要翻译：用于将用于制造用于屏蔽电子设备的掩模的膜安装到公共载体框架的方法。公共载架框架具有沿着外周的外边缘和在框架的中心部分中的开口。该方法包括对框架外边缘施加外部压力以将框架向内压缩并减小开口，将薄膜固定在框架上，将薄膜覆盖框架开口，并释放框架上的压力以使开口膨胀并放置薄膜在紧张。

5. 发明授权

US06203690B1 Process of reworking pin grid array chip carriers 失效
标题翻译：引脚网格阵列芯片载体的返工过程
公开(公告)号：US06203690B1
公开(公告)日：2001-03-20
申请号：US09163148
申请日：1998-09-29
申请人： Paul F. Findeis , John P. Gauci , Krystyna W. Semkow , Renee L. Weisman
发明人： Paul F. Findeis , John P. Gauci , Krystyna W. Semkow , Renee L. Weisman
IPC分类号： C25F300
CPC分类号： H01L23/49811 , C25F3/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A process for reworking of PGA chip carriers where one or more I/O pins is unplated. The process includes electrolytically etching the I/O pins which removes any corrosion product from the unplated I/O pins and removes the top gold layer from the remaining I/O pins. The etchant includes a metal-providing compound selected from the group consisting of a silver salt, copper cyanide, silver cyanide, gold cyanide or mixtures thereof, at a concentration in the range from about 2.7 to about 4.1 g/l as metal; potassium or sodium carbonate at a concentration in the range from about 10 to about 100 g/l; and potassium or sodium cyanide at a concentration in the range from about 29 to about 35 g/l.
摘要翻译：一种用于重新编码一个或多个I / O引脚未被放置的PGA芯片载体的过程。该过程包括对I / O引脚进行电解蚀刻，从而从未镀覆的I / O引脚中除去任何腐蚀产物，并从剩余的I / O引脚中除去顶部金层。蚀刻剂包括浓度为约2.7至约4.1g / l的金属的选自银盐，氰化铜，氰化银，氰化金或其混合物的金属提供化合物; 浓度在约10至约100g / l范围内的碳酸钾或碳酸钠; 和浓度在约29至约35g / l范围内的氰化钾或氰化钠。

6. 发明授权

US5540779A Apparatus for manufacture of multi-layer ceramic interconnect structures 失效
标题翻译：用于制造多层陶瓷互连结构的装置
公开(公告)号：US5540779A
公开(公告)日：1996-07-30
申请号：US396987
申请日：1995-03-01
申请人： Gerald S. Andris , John P. Gauci
发明人： Gerald S. Andris , John P. Gauci
IPC分类号： B41F15/08 , B05C5/02 , B41F15/40 , H01L21/48 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/40 , H05K3/46
CPC分类号： B05C5/0295 , H01L21/4867 , H01L23/5383 , H05K3/1233 , H01L2924/0002 , H05K1/0306 , H05K1/092 , H05K2203/0126 , H05K2203/0139 , H05K2203/163 , H05K3/4053
摘要： In the manufacture of multi-layer ceramic interconnect structures, a greensheet is perforated with small holes and positioned on the support fixture of a screening machine. Then a planar surface of a screening mask is positioned in relation to the greensheet for producing the circuit pattern. Then the discharge end of a paste nozzle is positioned in relation to the opposite planer surface of the mask for injecting pressurized conductive paste through the nozzle into the mask. A normal force is applied to the nozzle toward the mask to maintain the discharge end of the nozzle with a clearance of 1 to 2 mils from the mask as the nozzle traverses the mask, injecting the conductive paste to extrude the circuit pattern on the greensheet and fill the perforations to produce vias to provide electrical connections between the layers produced. The force is adjusted dependent upon the pressure of the paste being injected into the mask to maintain the 1 to 2 mil clearance. Multiple layers of patterned greensheets are stacked and sintered under pressure and high temperature to produce the multi-layer ceramic interconnect structure.
摘要翻译：在多层陶瓷互连结构的制造中，毛坯穿孔具有小孔并且位于筛选机的支撑夹具上。然后，屏蔽掩模的平坦表面相对于毛坯定位以产生电路图案。然后，糊状喷嘴的排出端相对于掩模的相对的平面定位，用于将加压的导电浆通过喷嘴注入到掩模中。向喷嘴朝向掩模施加法向力，以在喷嘴穿过掩模时使喷嘴的距离与掩模保持1至2密耳的间隙，注入导电膏以将电路图案挤出在毛坯上，填充穿孔以产生通孔以在所生产的层之间提供电连接。力被调整取决于浆料被注入到面罩中的压力以保持1至2密耳的间隙。在压力和高温下堆叠并烧结多层图案化的纸屑以产生多层陶瓷互连结构。

7. 发明授权

US5478420A Process for forming open-centered multilayer ceramic substrates 失效
标题翻译：用于形成开心多层陶瓷基板的方法
公开(公告)号：US5478420A
公开(公告)日：1995-12-26
申请号：US281715
申请日：1994-07-28
申请人： John P. Gauci , Thomas A. Kline
发明人： John P. Gauci , Thomas A. Kline
IPC分类号： H05K3/46 , B32B18/00 , H01L21/48 , H01L23/12 , B32B31/04 , B32B31/20 , B32B31/26
CPC分类号： B32B18/00 , B32B37/0023 , B32B37/26 , B32B38/1841 , C04B35/645 , H01L21/4807 , H01L21/4867 , B32B2305/77 , B32B2315/02 , C04B2235/666 , C04B2237/32 , C04B2237/56 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/68 , C04B2237/704 , C04B2237/86 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15787
摘要： A multilayer ceramic substrate with an internal cavity extending from the top to the bottom surface of the substrate is produced using an insert material which fits within a cavity defined by aligned openings of individual ceramic sheets in a multilayer stack. The multilayer stack of ceramic sheets, together with the insert, is press-molded together with the insert serving as an internal mold that maintains the internal dimensions of the cavity. The insert is slightly larger in its top to bottom dimension than the multilayer stack and is driven into a compressible material underlying the multilayer stack during the pressing operation. The insert prevents the ceramic from flowing upwards into the center of the cavity during the pressing operation. In addition, the insert embeds electrically conductive pads located at various levels inside the cavity on individual ceramic sheets in the multilayer stack into the top surfaces of the ceramic sheets. After molding, the insert and the compressible material are removed from the multilayer structure. The invention has a particular application for forming multilayer ceramic structures that are connected to an integrated circuit chip and heat sink combination that will be positioned inside the cavity of the ceramic structure.
摘要翻译：使用插入材料制造具有从衬底的顶部到底部表面延伸的内部空腔的多层陶瓷衬底，该插入材料配合在由多层堆叠中的各个陶瓷片的对准开口限定的空腔内。陶瓷片的多层堆叠与插入件一起被压模在一起，插入件用作保持腔的内部尺寸的内部模具。该插入件的顶部至底部的尺寸比多层堆叠略大，并且在压制操作期间被驱动到多层堆叠下面的可压缩材料中。在压制操作期间，插入物防止陶瓷向上流动到空腔的中心。此外，插入件将位于多层堆叠中的各个陶瓷片上的空腔内的各种级别的导电焊盘嵌入到陶瓷片的顶表面中。在模制之后，从多层结构中去除插入件和可压缩材料。本发明具有形成多层陶瓷结构的特殊应用，该多层陶瓷结构连接到集成电路芯片和将在陶瓷结构的腔内定位的散热器组合。

8. 发明授权

US5249520A Mask shock absorber pad 失效
标题翻译：面罩减震垫
公开(公告)号：US5249520A
公开(公告)日：1993-10-05
申请号：US712259
申请日：1991-06-07
申请人： Gerald S. Andris , John P. Gauci
发明人： Gerald S. Andris , John P. Gauci
IPC分类号： B41F15/08 , B41F15/14 , H05K3/12 , B32B31/16
CPC分类号： B41F15/0813 , B41F15/14 , H05K3/1216 , Y10T156/1168
摘要： A shock absorber pad for absorbing shock caused by separation of a perforated sheet mask from a surface on which a pattern of a screened medium has been formed by forcing a viscous material through the mask which includes a plurality of protuberant features which have a separation determined in accordance with a nominal viscosity of the screened medium and a transverse feature dimension based on characteristic stand-off spacing or mask feature size increases pattern quality and extends mask life. Hollow pattern features also improve pattern quality by reducing pad contact area with the mask during separation while allowing the pad features to span mask features. Methodology of shock absorber pad design and adjustment of screened medium viscosity to pad feature spacing are included.

9. 发明授权

US5174201A Thick film mask separation detection system 失效
标题翻译：厚膜掩模分离检测系统
公开(公告)号：US5174201A
公开(公告)日：1992-12-29
申请号：US712263
申请日：1991-06-07
申请人： Gerald S. Andris , John P. Gauci , John F. Harmuth
发明人： Gerald S. Andris , John P. Gauci , John F. Harmuth
IPC分类号： B41F15/08 , B41M1/12
CPC分类号： B41F15/0818 , B41M1/12 , B41P2215/14 , Y10S156/922 , Y10S438/943 , Y10T156/11
摘要： An apparatus and method for screening a pattern of material onto a surface including detection of the instant of separation of the mask from the surface after screening. Particularly as applied to a process for making a multi-layer ceramic device with an automated apparatus, the screening process is speeded by initiating high speed movement immediately when the separation of the mask from the surface is complete. In a preferred embodiment, a shock absorber is used to limit the rate of change of motion of the mask and a sensor is placed directly on a portion of the shock absorber structure. Noise reduction is accomplished through differential sensing and thresholding to improve detection.
摘要翻译：一种用于将材料图案筛选到表面上的装置和方法，包括在筛选之后检测掩模与表面分离的时刻。特别是应用于制造具有自动化装置的多层陶瓷装置的方法时，当掩模与表面分离完成时，通过立即启动高速运动来加速筛选过程。在优选实施例中，使用减震器来限制掩模的运动变化率，并且传感器直接放置在减震器结构的一部分上。通过差分感测和阈值处理实现降噪，以改善检测。

10. 发明授权

US4902371A Mask shock absorbing system and method of using the same 失效
标题翻译：面罩减震系统及其使用方法
公开(公告)号：US4902371A
公开(公告)日：1990-02-20
申请号：US283437
申请日：1988-12-12
申请人： Gerald St. Andris , John P. Gauci
发明人： Gerald St. Andris , John P. Gauci
IPC分类号： B05B15/04 , B05C17/06 , B41F15/08 , B41F15/40 , H01L21/027 , H01L21/30 , H05K3/12 , H05K3/46
CPC分类号： B41F15/0813 , H05K3/1233 , B41P2215/14 , H05K2201/2045 , H05K2203/0264 , Y10S156/922 , Y10T156/11 , Y10T156/1189
摘要： An apparatus and a method is disclosed for providing a controlled separation of a structure that has been screened from the screening mask. A dampener pad floats with the mask as the screened structure is being separated from the mask. The mask is held in place by the dampener pad while the structure completely separates from the mask. The dampener pad assembly, then, in a controlled manner, brings the mask back to the original position, and the mask is then ready for the next screening operation.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式