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1. 发明授权

US11963306B2 Apparatus for manufacturing printed circuit boards 有权
公开(公告)号：US11963306B2
公开(公告)日：2024-04-16
申请号：US16633840
申请日：2018-06-29
申请人： Gebr. Schmid GmbH
发明人： Christian Schmid
IPC分类号： H05K3/06 , H01L21/67
CPC分类号： H05K3/068 , H01L21/6708 , H05K3/064 , H05K2203/0165 , H05K2203/0169 , H05K2203/075 , H05K2203/1509 , H05K2203/1554 , H05K2203/1572
摘要： A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.

2. 发明授权

US09980390B2 Suspension board with circuit assembly sheet 有权
公开(公告)号：US09980390B2
公开(公告)日：2018-05-22
申请号：US14605150
申请日：2015-01-26
申请人： NITTO DENKO CORPORATION
发明人： Naohiro Terada , Yoshito Fujimura , Tomoaki Okuno
IPC分类号： H05K1/03 , H05K1/11 , H05K1/18 , H05K3/00 , G11B5/48 , H05K1/05
CPC分类号： H05K3/0097 , G11B5/4853 , G11B5/486 , H05K1/0393 , H05K1/056 , H05K1/118 , H05K1/189 , H05K3/0052 , H05K2201/05 , H05K2201/09027 , H05K2201/0909 , H05K2201/0969 , H05K2203/0169 , H05K2203/1545
摘要： A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.

3. 发明申请

US20170151640A1 CLAMPING DEVICE FOR SOLDERING OPERATIONS 审中-公开
公开(公告)号：US20170151640A1
公开(公告)日：2017-06-01
申请号：US15336826
申请日：2016-10-28
申请人： HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
发明人： XI-HANG LI , BING LIU , WEI WU , QING-LEI PAN , SHI-LI ZHANG , YUAN GAO
IPC分类号： B23K37/04 , H05K3/34
CPC分类号： B23K37/0443 , B23K1/0016 , B23K2101/42 , H05K3/3436 , H05K2203/0169 , H05K2203/0195 , H05K2203/0278 , H05K2203/1509 , H05K2203/159 , Y02P70/613
摘要： A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.

4. 发明授权

US09603238B2 Combined wiring board 有权
公开(公告)号：US09603238B2
公开(公告)日：2017-03-21
申请号：US14076586
申请日：2013-11-11
申请人： IBIDEN CO., LTD.
发明人： Michimasa Takahashi , Teruyuki Ishihara
IPC分类号： H05K1/02 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/00
CPC分类号： H05K1/0271 , H05K1/14 , H05K1/183 , H05K3/0097 , H05K2201/068 , H05K2201/09145 , H05K2201/209 , H05K2203/0169
摘要： A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.

5. 发明授权

US09437997B2 Process for attaching devices to a circuit board 有权
标题翻译：将设备连接到电路板的过程
公开(公告)号：US09437997B2
公开(公告)日：2016-09-06
申请号：US14255811
申请日：2014-04-17
申请人： Signalcraft Technologies
发明人： Bernard Gobeil , Todd Smiley , Jason McKay
IPC分类号： H05K3/00 , H01R43/02 , H01R12/70 , H05K3/30 , H05K3/34
CPC分类号： H01R43/0263 , H01R12/7011 , H05K3/0011 , H05K3/303 , H05K3/3405 , H05K2201/0909 , H05K2201/09127 , H05K2201/10189 , H05K2203/0169 , Y02P70/613 , Y10T29/49124 , Y10T29/4913 , Y10T29/49208 , Y10T29/53265
摘要： Systems, methods and apparatuses for attaching devices to ends of a circuit board. An exemplary method includes removing or creating at least a portion of a sacrificial part of a circuit board based on a predefined pattern, inserting a holder device into a remaining portion of the sacrificial part of the circuit board, placing a device at a predefined location on the circuit board, wherein the device is at least partially supported by a portion of the holder device, attaching the device to the circuit board and removing the holder device and the sacrificial part of the circuit board.
摘要翻译：用于将设备附接到电路板端部的系统，方法和装置。一种示例性方法包括基于预定图案移除或创建电路板的牺牲部分的至少一部分，将保持装置插入到电路板的牺牲部分的剩余部分中，将装置放置在预定位置上电路板，其中所述装置至少部分地由所述保持装置的一部分支撑，将所述装置附接到所述电路板并且移除所述电路板的所述保持装置和所述牺牲部分。

6. 发明申请

US20160073512A1 Process for placing, securing and interconnecting electronic components 审中-公开
公开(公告)号：US20160073512A1
公开(公告)日：2016-03-10
申请号：US14121433
申请日：2014-09-05
申请人： Edward Binkley , Robert Cattaneo , Hiep Nghi , George Laurie , Richard Otte
发明人： Edward Binkley , Robert Cattaneo , Hiep Nghi , George Laurie , Richard Otte
IPC分类号： H05K3/30 , H05K3/28
CPC分类号： H05K3/007 , H05K1/0269 , H05K1/185 , H05K3/0014 , H05K3/0052 , H05K3/0097 , H05K3/284 , H05K3/305 , H05K3/4644 , H05K3/4664 , H05K3/4673 , H05K2201/09118 , H05K2201/09918 , H05K2203/0169 , H05K2203/063 , H05K2203/1469 , H05K2203/1476 , H05K2203/1563
摘要： A method for fabricating an electronic assembly which enables the assembly and interconnection of surface mount components and/or other electrical, electronic, electro-optical, electro-mechanical and user interface devices with external I/O contacts on a planar surface without the use of solder or otherwise exposing the components to temperatures substantially above ambient.

7. 发明授权

US09277655B2 Combined wiring board and method for manufacturing the same 有权
标题翻译：组合线路板及其制造方法
公开(公告)号：US09277655B2
公开(公告)日：2016-03-01
申请号：US14542721
申请日：2014-11-17
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Michimasa Takahashi
IPC分类号： H05K1/11 , H05K3/36 , H05K1/14 , H05K1/02
CPC分类号： H05K3/368 , H05K1/0228 , H05K1/0271 , H05K1/142 , H05K1/144 , H05K3/0052 , H05K3/0097 , H05K2201/2018 , H05K2201/2072 , H05K2203/0169 , Y10T29/49126
摘要： A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.
摘要翻译：组合布线板包括具有多个布线板和一个或多个粘合剂部分的布线板组，使得布线板通过粘合剂部分或粘合剂部分彼此连接，并且金属框架具有容纳开口部分，形成为容纳布线板，使得布线板组位于金属框架的容纳开口部分中。

8. 发明授权

US09119317B2 Method of folding flexible substrate in-situ using fold-assisting frame 有权
标题翻译：使用折叠框架原位折叠柔性基板的方法
公开(公告)号：US09119317B2
公开(公告)日：2015-08-25
申请号：US14097984
申请日：2013-12-05
申请人： BIOTRONIK SE & Co. KG
发明人： Anthony A. Primavera
IPC分类号： A61N1/375 , H05K1/02 , H05K7/16
CPC分类号： H05K7/16 , A61N1/3758 , H05K1/028 , H05K2203/0169 , Y10T29/49002 , Y10T29/49117 , Y10T29/5327
摘要： A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices.
摘要翻译：用于制造在柔性基板上构建的装置的方法采用原位折叠辅助装置框架。折叠辅助框架符合包装内部体积的一部分，使得框架的一个或多个枢转构件可以用作原位弯曲夹具，代替常规的弯曲设备，以支撑和折叠该平面柔性基底成为所需的三维构型。框架可以容纳展开的或部分折叠的柔性电路板的放置，使得结合到框架中的诸如铰链的折叠辅助特征附接到柔性电路板并围绕枢轴点闭合以将电路板轻轻地弯曲成放置，从而形成三维折叠电路。这种固定装置和方法便于以紧凑的形式包装电子装置，适用于广泛的移动消费电子产品，包括例如可植入的医疗装置。

9. 发明申请

US20150136454A1 COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：组合接线板及其制造方法
公开(公告)号：US20150136454A1
公开(公告)日：2015-05-21
申请号：US14542753
申请日：2014-11-17
申请人： IBIDEN CO., LTD.
发明人： Teruyuki ISHIHARA , Michimasa TAKAHASHI
IPC分类号： H05K1/14 , H05K3/36 , H05K1/02
CPC分类号： H05K1/142 , H05K1/0228 , H05K1/0271 , H05K1/144 , H05K3/0052 , H05K3/0097 , H05K3/368 , H05K2201/068 , H05K2201/2018 , H05K2201/2072 , H05K2203/0169 , Y10T29/49126
摘要： A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.
摘要翻译：组合布线板包括多个布线板，以及具有多个金属框架和一个或多个连接部分的连接的金属框架，使得金属框架通过连接部分或连接部分彼此连接，并具有容纳布线的容纳开口部分板。

10. 发明申请

US20150083471A1 COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：组合接线板及其制造方法
公开(公告)号：US20150083471A1
公开(公告)日：2015-03-26
申请号：US14496028
申请日：2014-09-25
申请人： IBIDEN CO., LTD.
发明人： Teruyuki Ishihara , Michimasa Takahashi
IPC分类号： H05K1/14 , H05K3/36 , H05K1/11
CPC分类号： H05K3/0097 , H05K1/0298 , H05K1/11 , H05K1/142 , H05K3/0052 , H05K3/34 , H05K3/36 , H05K2201/0909 , H05K2201/09127 , H05K2203/0169 , Y10T29/49126
摘要： A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.
摘要翻译：组合布线板包括分别具有多个开口部分的金属框架和容纳在金属框架的开口部分中的多个布线板。金属框架中的开口部分具有侧壁，其具有保持部分，使得保持部分将金属框架中的开口部分中的线路板保持在一起，并且金属框架具有与保持部分相邻的狭缝部分和连接狭缝部分的连接部分到开口部。

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